Panasonic Viera TH-42PHD5 Manuel utilisateur

ORDER NO. ITD0207017C0

D10 Canada:B07

Wide Plasma Display

TH-42PHD5 / TH-42PHW5

GPH5D Chassis

SPECIFICATIONS

Specifications

Power Source: AC120V 50/60Hz (UY/UZ version)

AC220-240V 50/60Hz

(Except UY/UZ version) model)

Power Consumption: 375 W

2.4W (stand-by condition)

(UY/UZ version)

3.0W (stand-by condition)

(Except UY/UZ version model)

0.9W (Power off condition)

(UY/UZ version model)

1.7W (Power off condition)

(Except UY/UZ version model)

Plasma Display panel: Drive method AC type

50-inch, 16:9 aspect ratio

Contrast Ratio 3000:1

Screen size: 920 mm (W)×518 mm (H)

1,056 mm (diagonal)

No. of pixels

786,432 (1,024 (W)×768 (H))

[3,072×768 dots]

Operating condition:

Temperature 34 °F - 104 °F (0 °C - 40 °C)

Humidity 20 % - 80 %

Wide Plasma Display 1

Specifications 1

1. Applicable signals 2

2. Safety Precautions 3

2.1. General Guidelines 3

2.1.1. Leakage Current Cold Check 3

2.1.2. Leakage Current Hot Check (See Figure 1 .) 4

3. Prevention of Electro Static Discharge (ESD) to Electrostatically Sensitive (ES) Devices 4

4. About lead free solder (PbF) 5

5. PCB Structure sheet of GPH5D chassis 7

6. Service Hint 8

7. Location of Lead Wiring 8

8. Adjustment Procedure 9

8.1. +B Set-up 9

8.1.1. Item / Preparation 10

8.1.2. Adjustments 10

8.2. Driver Set-up 10

8.2.1. Item / Preparation 10

8.2.2. Adjustments 10

8.3. Initialization Pulse Adjust 12

8.4. P.C.B. (Printed Circuit Board) exchange 12

8.4.1. Caution 13

8.4.2. Quick adjustment after P.C.B. exchange 13

8.5. Adjustment Volume Location 13

8.6. Test Point Location 13

9. Service mode 14

9.1. CAT (computer Aided Test) mode 14

9.1.1. IIC mode 14

9.1.2. CD mode 15

9.1.3. SD mode 15

9.2. IIC mode structure (following items value is sample data.) 16

10. Alignment 16

10.1. Pedestal setting 16

10.2. NTSC panel white balance 17

10.3. PAL/SECAM panel white balance 17

10.4. PC/RGB panel white balance 17

10.5. HD/ 525i /525p panel white balance 17

10.6. 625i panel balance 17

10.7. Sub brightness setting 17

11. Troubleshooting guide 17

11.1. Self Check 17

11.1.1. Display Indication 17

11.1.2. Power LED Blinking timing chart 18

11.2. No Power 18

11.3. No Picture 19

11.4. Local screen failure 19

12. Option Setting 20

13. Conductor Views 21

13.1. F-Board 21

13.2. P1-Board 21

13.3. P3, P5, P6, P7 and P8-Board 21

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13.4. HX-Board 21

13.5. HY-Board 21

13.6. HZ-Board 21

13.7. D1-Board 21

13.8. D2-Board 21

13.9. C1-Board 21

13.10. C2-Board 21

13.11. C3-Board 21

13.12. C4-Board 21

13.13. SC-Board 21

13.14. SU-Board 21

13.15. SD-Board 21

13.16. SS-Board 22

13.17. SS2 and SS3-Board 22

13.18. Z-Board 22

13.19. H3, S1 and V1-Board 22

14. Block and Schematic Diagrams 22

14.1. Schematic Diagram Notes 22

14.2. Main Block Diagram 22

14.3. Power Block Diagram 22

14.4. P1-Board Schematic Diagram 22

14.5. F, P3, P5, P6, P7 and P8-Board Schematic Diagram 22

14.6. HX-Board Block Diagram 22

14.7. HX-Board Schematic Diagram 22

14.8. HY and HZ-Board Block Diagram 22

14.9. HY-Board (1 of 2) Schematic Diagram 22

14.10. HY-Board (2 of 2) Schematic Diagram 22

14.11. HZ-Board (1 of 2) Schematic Diagram 22

14.12. HZ-Board (2 of 2) Schematic Diagram 22

14.13. D1-Board Block Diagram 22

14.14. D1-Board (1 of 6) Schematic Diagram 22

14.15. D1-Board (2 of 6) Schematic Diagram 22

14.16. D1-Board (3 of 6) Schematic Diagram 22

14.17. D1-Board (4 of 6) Schematic Diagram 22

14.18. D1-Board (5 of 6) Schematic Diagram 22

14.19. D1-Board (6 of 6) Schematic Diagram 22

14.20. D2-Board Block Diagram 22

14.21. D2-Board (1 of 8) Schematic Diagram 22

14.22. D2-Board (2 of 8) Schematic Diagram 23

14.23. D2-Board (3 of 8) Schematic Diagram 23

14.24. D2-Board (4 of 8) Schematic Diagram 23

14.25. D2-Board (5 of 8) Schematic Diagram 23

14.26. D2-Board (6 of 8) Schematic Diagram 23

14.27. D2-Board (7 of 8) Schematic Diagram 23

14.28. D2-Board (8 of 8) Schematic Diagram 23

14.29. C1, C2, C3, and C4-Board Block Diagram 23

14.30. C1-Board Schematic Diagram 23

14.31. C2-Board Schematic Diagram 23

14.32. C3-Board Schematic Diagram 23

14.33. C4-Board Schematic Diagram 23

14.34. SC-Board Block Diagram 23

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14.35. SC-Board (1 of 2) Schematic Diagram 23

14.36. SC-Board (2 of 2) Schematic Diagram 23

14.37. SU-Board Block Diagram 23

14.38. SU-Board (1 of 2) Schematic Diagram 23

14.39. SU-Board (2 of 2) Schematic Diagram 23

14.40. SD-Board Block Diagram 23

14.41. SD-Board (1 of 2) Schematic Diagram 23

14.42. SD-Board (2 of 2) Schematic Diagram 23

14.43. SS-Board Block Diagram 23

14.44. SS, SS2, SS3 and S1-Board Schematic Diagram 23

14.45. Z-Board Block Diagram 23

14.46. H3 and Z-Board Schematic Diagram 23

15. Parts Location 23

15.1. Parts Location1 24

15.2. Parts Location2 25

15.3. Parts Location3 26

16. Mechanical Replacement Parts List 27

17. Replacement Parts List 31

17.1. Relpacement Parts List Notes 31

17.2. Electrical Replacement Parts List 31

18. Schematic Diagram for printing with A4 107

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III

Horizontal scanning frequency 15.6 -

110kHz

Vertical scanning frequency 48 - 120Hz

Connection terminals:

Video in 1.0 Vp-p (75-ohm)

S-VIDEO IN / (MINI DIN

4PIN)

Y: 1 Vp-p (75-ohm), C: 0.286 Vp-p

(75-ohm)

AUDIO IN / (RCA PIN

JACK × 2)

0.5 Vrms (high impedance)

COMPONENT/RGB

Y/G 1.0 Vp-p/composite (75-ohm)

0.7 Vp-p/non-composite (75-ohm)

PB/B 0.7 Vp-p (75-ohm)

PR/R 0.7 Vp-p (75-ohm)

HD 1.0 - 5.0 Vp-p (high impedance)

VD 1.0 - 5.0 Vp-p (high impedance)

AUDIO IN

(RCA PIN JACK×2)

0.5 Vrms (high impedance)

(HIGH-DENSITY

D-SUB15PIN)

R,G,B/0.7 Vp-p (75-ohm)

HD, VD/1.0 - 5.0 Vp-p (high

impedance)

AUDIO IN (M3 JACK) 0.5Vrms (high impedance)

SERIAL

EXTERNAL CONTROL

TERMINAL (D-SUB9PIN)

RS-232C COMPATIBLE

SPEAKERS (External

speakers)

6 16W [8W+8W] (10% THD)

Dimensions (W×H×D): 40.2” (1,020 mm)×24” (610mm)×3.5” (89

mm)

Weight (Mass) approx. 66.1 Ibs (29.5 kg) (main unit only)

approx. 75.4 Ibs (33.7kg) (with speakers)

1. Applicable signals

2. Safety Precautions

2.1. General Guidelines

1. When servicing, observe the original lead dress. If a short circuit is

found, replace all parts which have been overheated or damaged by

the short circuit.

2. After servicing, see to it that all the protective devices such as

insulation barriers, insulation papers shields are properly installed.

3. After servicing, make the following leakage current checks to prevent

the customer from being exposed to shock hazards.

2.1.1. Leakage Current Cold Check

1. Unplug the AC cord and connect a jumper between the two prongs on

the plug.

2. Measure the resistance value, with an ohmmeter, between the

jumpered AC plug and each exposed metallic cabinet part on the

equipment such as screwheads, connectors, control shafts, etc. When

the exposed metallic part has a return path to thechassis, the reading

should be between 1M and 5.2M . / When the exposed metal does

not have a return path to the chassis, the reading must be .

Figure 1

2.1.2. Leakage Current Hot Check (See Figure 1 .)

1. Plug the AC cord directly into the AC outlet. Do not use an isolation

transformer for this check.

2. Connect a 1.5k , 10 watts resistor, in parallel with a 0.15 F

capacitors, between each exposed metallic part on the set and a good

earth ground such as a water pipe, as shown in Figure 1 .

3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to

measure the potential across the resistor.

4. Check each exposed metallic part, and measure the voltage at each

point.

5. Reverse the AC plug in the AC outlet and repeat each of the above

measurements.

6. The potential at any point should not exceed 0.75 volts RMS. A

leakage current tester (Simpson Model 229 or equivalent) may be used

to make the hot checks, leakage current must not exceed 1/2 milliamp.

In case a measurement is outsideof the limits specified, there is a

possibility of a shock hazard, and the equipment should be repaired

and rechecked before it is returned to the customer.

3. Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such

components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES

devices are integrated circuits and some field-effect transistorsand semiconductor "chip"

components. The following techniques should be used to help reduce the incidence of component

damage caused by electro static discharge (ESD).

1. Immediately before handling any semiconductor component or

semiconductor-equipped assembly, drain off any ESD on your body by

touching a known earth ground. Alternatively, obtain and wear a

commercially available discharging ESD wrist strap, whichshould be

removed for potential shock reasons prior to applying power to the

unit under test.

2. After removing an electrical assembly equipped with ES devices, place

the assembly on a conductive surface such as alminum foil, to prevent

electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES

devices.

4. Use only an anti-static solder removal device. Some solder removal

devices not classified as "anti-static (ESD protected)" can generate

electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical

charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package

until immediately before you are ready to install it. (Most replacement

ES devices are packaged with leads electrically shorted together by

conductive foam, alminum foil or comparableconductive material).

7. Immediately before removing the protective material from the leads of

a replacement ES device, touch the protective material to the chassis

or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all

other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES

devices. (Otherwise hamless motion such as the brushing together of

your clothes fabric or the lifting of your foot from a carpeted floor can

generate static electricity (ESD) sufficient todamage an ES device).

4. About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements.

In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.

The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).

That is Tin (Sn), Silver (Ag) and (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For

service and repair work, we’d suggest the use of Pb free solder as well, although Pb solder may be

used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol

stamped on the back of PCB.

Caution

- Pb free solder has a higher melting point than standard solder.

Typically the melting point is 50 ~ 70 °F (30 ~ 40°C) higher. Please use

a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

- Pb free solder will tend to splash when heated too high (about 1100 °F

or 600 °C).

If you must use Pb solder, please completely remove all of the Pb free

solder on the pins or solder area before applying Pb solder. If this is

not practical, be sure to heat the Pb free solder until it melts, before

applying Pb solder.

- After applying PbF solder to double layered boards, please check the

component side for excess solder which may flow onto the opposite

side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin,

silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also

beused.

5. PCB Structure sheet of GPH5D chassis

Board Name Function Remarks

D1 Format Converter 1

D2 Plasma AI Sub-Field

Processor

ZAudio out

SS Sustain out 1

SC Scan out 1

SU Sustain connection (Upper) 1

SD Sustain connection (Lower) 1

C1 Data Drive (Upper Left)

C2 Data Drive (Upper Right)

C3 Data Drive (Lower Right)

C4 Data Drive (Lower Left)

H3 Speaker terminal

S1 Power switch

SS2 Sustain connection (Upper)

SS3 Sustain connection (Lower)

V1 Front SW. & Remote receiver

FLine filter

PPower supply 1

P3 Drive voltage oscillator

P5 Primary oscillator

P6 PFC oscillator

P7 Drive voltage protection

P8 Process voltage protection

HX PC_type_Input terminal

HY BNC_type_Input terminal 2

HZ RCA type_Input terminal 3

Remarks

1. Recommend PCB's for initial service for GPH5D chassis.

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