Panasonic Viera TX-32LED7FM Manuel utilisateur

Service Manual

Colour LCD Television

TX-32LED7FM

TX-32LXD7M

GLP22M Chassis

Specifications

Power Source: 220-240V AC, 50Hz

Power Consumption 135W

Stand-by Power Consumption: 1.0W (TV ONLY)

13W (TV+DVB set to record)

Aerial Impedance: 75Ωunbalanced, Coaxial Type

Receiving System: LXD7M LED7FM

PAL-I PAL-I/H, B/G, D/K

PAL-525/60 (AV only) SECAM B/G, D/K, L/L’

DVB (via UHF aerial input) PAL-525/60 (AV only)

M.NTSC (AV only) DVB (via VHF/UHF aerial input)

NTSC (AV only) M.NTSC (AV only)

NTSC (AV only)

Receiving Channels: LXD7M LED7FM

UHF E21-E68 VHF E2-E12 VHF H1-H2 (ITALY)

VHF A-H (ITALY) VHF R1-R2

VHF R3-R5 VHF R6-R12

UHF E21-E69 CATV (S01-S05)

CATV S1-S10 (M1-M10) CATV S11-S20 (U1-U10)

CATV S21-S41 (Hyperband)

Operating Conditions: Temperature: 0°C ÷35°C

Humidity: 20% ÷ 80% RH (non condensing)

Scanning format: 480i(60Hz), 480p(60Hz), 576i(50Hz), 576p(50Hz), 720p(60Hz), 720p(50Hz), 1.080i(60Hz),

1.080i(50Hz), 1.080p(60Hz), 1.080p(50Hz)

ORDER No. PCZ0801005CE

Panasonic CS ( U.K. ) Ltd.

WILLOUGHBY ROAD,

BRACKNELL,

BERKS.,

RG12 8FT.

Intermediate Frequency:

Video/Audio LXD69A LED7FA

Video 38,9MHz 38,9MHz, 33,9MHz

Audio 32.90MHz 33,4MHz (B/G), 33,16MHz (A2)

32.35MHz(NICAM) 33,05MHz (NICAM B/G, D/K, L’)

32,4MHz (D/K), 32,66MHz (CZ STEREO)

40,4MHz (L’), 39,75MHz (L’ NICAM)

Colour 34,47MHz 34,47MHz (PAL)

34,5MHz, 34,65MHz (SECAM)

38,3MHz, 38,15MHz (SECAM L’)

Terminals:

AV1 IN Video (21 pin) 1V p-p 75Ω

Audio (21 pin) 500mV rms 10kΩ

RGB (21 pin) 0,7V p-p 75Ω

AV1 OUT Video (21 pin) 1V p-p 75Ω

Audio (21 pin) 500mV rms 1kΩ

AV2 IN Video (21 pin) 1V p-p 75Ω

Audio (21 pin) 500mV rms 10kΩ

RGB (21 pin) 0,7V p-p 75Ω

S-video IN (21-pin)Y: 1V p-p 75Ω

C:0,3V p-p 75Ω

AV2 OUT Video (21 pin) 1V p-p 75Ω

Audio (21 pin) 500mV rms 1kΩ

AV3 IN S-Video IN (4-pin)Y: 1V p-p 75Ω

C:0,286V p-p 75Ω

Audio (RCAx2) 500mV rms 10kΩ

Video (RCAx1) 1V p-p 75Ω

HDMI Type A Connector

COMPONENT Video (RCAx3) Y:1V p-p 75Ω(including synchronization)

Pb, Pr: ±0,35V p-p 75Ω

AUDIO IN Audio (RCAx2) 500mV rms 10kΩ(for YUV; HDMI)

AUDIO OUT Audio (RCAx2) 500mV rms 1kΩ(high Impedance)

LCD screen: L5EDD8Q00037

1366 x 768 XGA, 16:9

Visible Diagonal 800mm

Audio Output: 20W (2x10W)

Headphones: 3,5mm (M3), 8ΩImpedance

Accessories supplied : Remote Control 2 x R6 (UM3) Batteries

Dimensions: Height: Width: Depth:

Including TV stand 615mm 791mm 239mm

TV set only 563mm 791mm 117mm

Net weight: 18,5kg

Specifications are subject to change without notice.

Weights and dimensions shown are approximate.

This service information is designed for experienced repair technicians only and is not designed for use by the general public. It does not

contain warnings or cautions to advise non-technical individuals of potencial dangers in attempting to service a product. Products

powered by electricity should be serviced or repaired only by experienced professional technicians. Any attempt to service or repair the

product or products deal within this service information by anyone else could result in serious injury or death.

Warning

CONTENTS

SAFETY PRECAUTIONS.......................................................................... 4

GENERAL GUIDE LINES..................................................................... 4

TOUCH – CURRENT CHECK.............................................................. 4

PREVENTION OF ELECTROSTATIC DISCHARGE (ESD)

TO ELECTROSTATICALLY SENSITIVE (ES) DEVICES.......................... 5

ABOUT LEAD FREE SOLDER (PBF)........................................................ 6

SUGGESTED PB FREE SOLDER....................................................... 6

APPLICABLE SIGNALS............................................................................. 7

SERVICE HINTS ....................................................................................... 8

CHASSIS BOARD LAYOUT ...................................................................... 9

LOCATION OF LEAD WIRING…………………………………………….9

SETTING INSPECTION........................................................................... 10

SELF-CHECK .......................................................................................... 11

POWER LED BLINKING TIMING CHART............................................... 12

SERVICE MODE FUNCTION.................................................................. 13

SERVICE ................................................................................................ 14

OPTION DESCRIPTION.......................................................................... 15

ADJUSTMENT METHOD ........................................................................ 16

WIRING DIAGRAM.................................................................................. 17

BLOCK DIAGRAMS................................................................................. 18

PARTS LOCATION.................................................................................. 21

REPLACEMENT PARTS LIST................................................................. 23

SCHEMATIC DIAGRAMS........................................................................ 40

DG-BOARD (1 OF 17) SCHEMATIC DIAGRAM................................ 41

P-BOARD (1 OF 2) SCHEMATIC DIAGRAM..................................... 58

G-BOARD SCHEMATIC DIAGRAM................................................... 60

V-BOARD SCHEMATIC DIAGRAM ................................................... 61

CONDUCTOR VIEWS............................................................................. 62

Safety Precautions

General Guide Lines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated

or damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following touch current checks to prevent the customer from being exposed to shock hazards.

4. Always ensure panel TKP0E16001 is correctly replaced before returning to customer (see Fig.1).

Touch-Current Check

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth

ground such as a water pipe, as shown in Fig. 2.

3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reserve the AC plug in the AC outlet and repeat each of the above measure.

6. The potential at any point (TOUCH CURRENT) expressed as voltage U1 and U2, does not exceed the following values:

For a. c.: U1 = 35 V (peak) and U2 = 0.35 V (peak);

For d. c.: U1 = 1.0 V,

Note:

The limit value of U2 = 0.35 V (peak) for a. c. and U1 = 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and

2.0 mA d. c.

The limit value U1 = 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100

kHz.

7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should

be repaired and rechecked before it is returned to the customer.

Fig. 2

PPLIANCES

EXPOSED

METAL PARTS

Resistance values in ohms (Ω)

R0=500

RS=1500

CS=0.22

10k

0.022

COLD

WATER PIPE

(EARTH GROUND)

V: Voltmetr or oscilloscope

(r.m.s. or peak reading)

Measuring network for TOUCH CURRENTS

Input resistance: ≥ 1M

Input capacitance: ≤ 200pF

Frequency range: 15Hz to 1MHz and d.c.respectively

NOTE – Appropriate measures should be taken to obtain the correct value in case of non-sinusoidal waveforms

U2(V)

Fig. 1

Prevention of Electrostatic Discharge (ESD) to Electrostatically

Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are

called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect

transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of

component damage caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on

your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD

wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as

aluminum foil, to prevent electrostatic charge build up or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD

protected)" can generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it.

(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil

or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective

material to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the

brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity

(ESD) sufficient to damage an ES device).

There are special components used in this equipment which are important for safety.

These parts are marked by in schematic diagrams, exploded views and replacement parts list. It is essential that

these critical parts should be replaced with manufacturer’s specified parts to prevent shock, fire, or other hazards. Do

not modify the original design without permission of manufacturer.

IMPORTANT SAFETY NOTICE

About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements.

In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.

The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).

That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work,

we’d suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol

stamped on the back of PCB.

Caution

•Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40°C)

higher. Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

•Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before

applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

•After applying PbF solder to double layered boards, please check the component side for excess solder which may

flow onto the opposite side. (see Fig.3)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.

However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used. (see Fig.4)

Fig.3

Fig.4

Applicable signals

Note:

•Signals other than above may not be displayed properly.

•The above signals are reformatted for optimal viewing on your display.

Signal name COMPONENT HDMI

525 (480) / 60i * *

525 (480) / 60p * *

625 (576) / 50i * *

625 (576) / 50p * *

750 (720) / 60p * *

750 (720) / 50p * *

1,125 (1,080) / 60i * *

1,125 (1,080) / 50i * *

1,125 (1,080) / 60p *

1,125 (1,080) / 50p *

Component (Y, Pb, Pr), HDMI

Service Hints

How to remove the backcover

Remove the 18[16] fixing screws. (see Fig.5)

How to remove the Pedestal assembly

Lay the main unit face down. (see Fig.6)

Remove the 4 fixing screws and the pedestal assembly. (see Fig.7)

Fig.6

Fig.7

SCREWS

SCREWS SCREWS

Fig.5

Chassis Board Layout

Location of Lead Wiring

To find the Part Number of required wire in Replacement Parts List click on the wire name in red box.

Board Name Function

DG-Board Global Core, HDMI, IDTV Processor, D/A Converter,

AV Connector, Analog tuner, Digital tuner, AV Switch

G-Board Side AV Connector

P-Board Main Input, Power Supply, Main Switch

V-Board Remote Receiver, LED IR, Cats

V-BOARD

DG-BOARD P-BOARD

G-BOARD

G51-DG51

TU3200

DG11

DG5

DG8

DG51

DG9

DG1

DG7

TU8301

DG1-V1DG7-SP

DG8-SP

P2/DG11-INV

P7-DG

TNR-TNR

DG5-PAN

P6-INV

Setting Inspection

Voltage Confirmation

Confirm the following voltages:

P board

Description Test point Position Normal mode Stand by mode Active stand by mode

Sub_5V TP861 P4, pin 12,13 5,0V +/- 0,25V <1V 5,0V +/- 0,25V

Panel 5/12V TP857 P4, pin 22,23 5V +/- 1V <1V <1V

15V_Audio TP856 C3861 15,5V +/- 1V <1V <1V

9V_Header TP864 P4, pin 7,6 9V +/- 0,25V <1V 9,0V +/- 0,25V

STBY_5V TP863 P4, pin 16 5,0V +/- 0,25V 5,0 +/- 0,25V 5,0V +/- 0,25V

24V_INV TP853 P2, pin1,2,3,4 24V +/- 1,5V <1V <1V

24V_INV TP852 C865 24V +/- 1,5V 24V +/- 1,5 24V +/- 1,5V

DG board

DTV9V TP5700 9V +/- 0,25V

SUB5V TP5701 5V +/- 0,25V

SUB3,3V TP5600 3,3V +/- 0,25V

MAIN9V TP5706 9V +/- 0,25V

STB5V TP5702 5V +/- 0,25V

SOUND15V TPS15 15V +/- 0,25V

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