Panasonic TH-L32X10A Manuel utilisateur

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TH-L32X10A

LH88 Chassis

LCD TV

Specifications

Power Source AC 220-240V, 50/60 Hz

Power Consumption Power rating:114W

Normal(Home) mode:91W

Standby condition:0.4W

LCD 80cm

Wide XGA (1366 × 768 pixels) 16:9 aspect ratio LCD panel.

Screen Size 698mm(W) × 393mm(H)

Sound

Speaker 160mm × 42mm× 2pcs,8 Ω

Audio Output 20W(10W+10W)10% THD

Headphones M3 (3.5 mm)stereo mini Jack × 1

PC signals VGA, SVGA, XGA

SXGA ...........(compressed)

Horizontal scanning frequency 31 - 69 kHz

Vertical scanning frequency 59 - 86 Hz

Receiving System/Band name

PAL B/G Reception of Off air broadcasts

DVB-T 7MHz VHF/UHF(Australia)free-to-air TV broadcast reception

PAL 60Hz Playback of NTSC tape from some PAL Video recorders(VCR)

M.NTSC Playback from M.NTSC Video recorders(VCR)

NTSC Playback from NTSC Video recorders(VCR)

Aerial-Rear VHF/UHF

Operating Conditions Temperature : 0°C - 35°C

Humidity : 20 % - 80 % RH (non-condensing)

Connection Terminals

ORDER NO. SMT0902002CE

1 Safety Precautions 4

1.1. General Guidelines 4

2 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices 5

3 About lead free solder (PbF) 6

4 Input signal that can be displayed 7

5 Self-check function 8

5.1. Self-check 8

6 Power LED blinking timing chart 9

7 Chassis Board Layout 10

8 Before servicing 11

8.1. Location of Lead wiring 11

8.2. EMI 1 processing 12

8.3. EMI 2 processing 13

9 Maintenance Disassembly 14

9.1. Remove the back cover 14

9.2. Remove AC cord 14

9.3. Control panel assy 14

9.4. Side AV stand bracket,A-board,P-board 15

9.5. Remove the speaker 16

9.6. V-board and LED panel 16

9.7. LCD screen 16

10 Service Mode 17

10.1. How to enter into Service Mode 17

10.2. SRV-TOOL 18

10.3. Option Description 18

10.4. OPTION Setting 18

11 Hotel Mode Access 19

11.1. Purpose 19

11.2. Access command to the Hotel mode setup menu 19

11.3. To exit the Hotel mode setup menu. 19

11.4. Explain the Hotel mode setup menu. 19

12 Adjustment Method 20

12.1. P-board voltage testing point 20

12.2. A-board voltage testing point 20

13 Conductor Views 21

13.1. P-Board 21

13.2. A-Board 23

13.3. K and V-Board 25

14 Schematic Diagram 27

14.1. Schematic Diagram Notes 27

14.2. P-Board (1/3) Schematic Diagram 28

14.3. P-Board (2/3) Schematic Diagram 29

14.4. P-Board (3/3) Schematic Diagram 30

AV3 VIDEO (RCA Pin Type) 1.0 V[p-p] (75 Ω)

S-VIDEO (MINI DIN 4-pin) Y: 1.0 V[p-p] (75 Ω), C: 0.286 V[p-p] (75 Ω)

AUDIO L-R (RCA Pin Type × 2) 0.5 V[rms]

AV1/AV2 VIDEO (RCA Pin Type) 1.0 V[p-p] (75 Ω)

AUDIO L-R (RCA Pin Type × 2) 0.5 V[rms]

Y1.0 V[p-p] (including synchronization)

PBCB/PRCR±0.35 V[p-p]

Others

HDMI 1-3 Input: TYPE A Connectors (This TV supports "HDAVI Control 4" function.)

PC Input HIGH-DENSITY D-SUB 15PIN R, G, B/0.7 V[p-p] (75Ω)

HD, VD/TTL Level 2.0 - 5.0 V[p-p](high impedance)

AUDIO L-R RCA PIN Type × 2 0.5 V[rms]

DIGITAL AUDIO OUT PCM/Dolby Digital, Fiber optic

Card slot SD CARD slot × 1

Monitor Output VIDEO (RCA PIN Type × 1) 1.0V[p-p](75 Ω)

AUDIO L-R (RCA PIN Type × 2) 0.5V[rms](high impedance)

Dimensions ( W x H x D )

Including TV Stand 798mm × 511mm × 217mm

TV Set Only 798mm × 511mm × 93mm

Weight 13.5 kg Net(With Pedestal)

11.5 kg Net(TV only)

Note:

Design and specifications are subject to change without notice. Weight and Dimensions shown are approximate.

CONTENTS

Page Page

TH-L32X10A

14.5. A-Board (1/24) Schematic Diagram 31

14.6. A-Board (2/24) Schematic Diagram 32

14.7. A-Board (3/24) Schematic Diagram 33

14.8. A-Board (4/24) Schematic Diagram 34

14.9. A-Board (5/24) Schematic Diagram 35

14.10. A-Board (6/24) Schematic Diagram 36

14.11. A-Board (7/24) Schematic Diagram 37

14.12. A-Board (8/24) Schematic Diagram 38

14.13. A-Board (9/24) Schematic Diagram 39

14.14. A-Board (10/24) Schematic Diagram 40

14.15. A-Board (11/24) Schematic Diagram 41

14.16. A-Board (12/24) Schematic Diagram 42

14.17. A-Board (13/24) Schematic Diagram 43

14.18. A-Board (14/24) Schematic Diagram 44

14.19. A-Board (15/24) Schematic Diagram 45

14.20. A-Board (16/24) Schematic Diagram 46

14.21. A-Board (17/24) Schematic Diagram 47

14.22. A-Board (18/24) Schematic Diagram 48

14.23. A-Board (19/24) Schematic Diagram 49

14.24. A-Board (20/24) Schematic Diagram 50

14.25. A-Board (21/24) Schematic Diagram 51

14.26. A-Board (22/24) Schematic Diagram 52

14.27. A-Board (23/24) Schematic Diagram 53

14.28. A-Board (24/24) Schematic Diagram 54

14.29. K-Board Schematic Diagram 55

14.30. V-Board Schematic Diagram 56

15 Parts Location 57

16 Package exploded view 58

17 Mechanical Replacement Parts List 59

18 Electrical Replacement Parts List 60

18.1. Replacement Parts List Notes 60

18.2. Electrical Replacement Parts List 61

19 SCHEMATIC DIAGRAM FOR PRINTING WITH A4 77

TH-L32X10A

1 Safety Precautions

1.1.1. Leakage Current Cold Check

1. Unplug the AC cord and connect a jumper between the two

prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between

the jumpered AC plug and each exposed metallic cabinet

part on the equipment such as screwheads, connectors,

control shafts, etc. When the exposed metallic part has a

return path to the chassis, the reading should be between

1MΩand 5.2MΩ.

When the exposed metal does not have a return path to the

chassis, the reading must be .

Figure 1

1.1.2. LEAKAGE CURRENT HOT CHECK

(See Figure 1.)

1. Plug the AC cord directly into the AC outlet. Do not use an

isolation transformer for this check.

2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF

capacitors, between each exposed metallic part on the set

and a good earth ground such as a water pipe, as shown in

Figure 1.

3. Use an AC voltmeter, with 1000 ohms/volt or more

sensitivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the

voltage at each point.

5. Reverse the AC plug in the AC outlet and repeat each of the

above measurements.

6. The potential at any point should not exceed 0.75 volts

RMS. A leakage current tester (Simpson Model 229 or

equivalent) may be used to make the hot checks, leakage

current must not exceed 1/2 milliamp. In case a

measurement is outside of the limits specified, there is a

possibility of a shock hazard, and the equipment should be

repaired and rechecked before it is returned to the

customer.

1.1. General Guidelines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

TH-L32X10A

2 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called

Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and

semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage

caused by electro static discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,

which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as

aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can

generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable

conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing

together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to

damage an ES device).

TH-L32X10A

3 About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements.In the information below, Pb will refer to Lead solder, and PbF

will refer to Lead Free Solder.The Lead Free Solder used in our manufacturing process and discussed below is

(Sn+Ag+Cu).That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it.s manufacture due to environmental conservation issues. For service and repair work, we.d

suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol stamped on the back of PCB.

Caution

•

• •

• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70°F (30~40°C) higher.

Please use a high temperature soldering iron and set it to 700 ± 20°F (370 ± 10°C).

•

• •

• Free solder will tend to splash when heated too high (about 1100°F or 600°C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying

Pbsolder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

•

• •

• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto

the opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.

However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

TH-L32X10A

4 Input signal that can be displayed

COMPONENT (Y, PB/CB,P

R/CR), HDMI

* Mark: Applicable input signal

Signal name Component HDMI

525(480)/60i * *

525(480)/60p * *

625(576)/50i * *

625(576)/50p * *

750(720)/60p * *

750(720)/50p * *

1,125(1,080)/60i * *

1,125(1,080)/50i * *

1,125(1,080)/60p *

1,125(1,080)/50p *

1,125(1,080)/24p *

PC (D-sub 15P)

Signal name Horizontal frequency(kHz) Vertical frequency(Hz)

640 × 400 @ 70 Hz 31.47 70.07

640 × 480 @ 60 Hz 31.47 59.94

640 × 480 @ 75 Hz 37.50 75.00

800 × 600 @ 60 Hz 37.88 60.32

800 × 600 @ 75 Hz 46.88 75.00

800 × 600 @ 85 Hz 53.67 85.06

852 × 480 @ 60 Hz 31.44 59.89

1,024 × 768 @ 60 Hz 48.36 60.00

1,024 × 768 @ 70 Hz 56.48 70.07

1,024 × 768 @ 75 Hz 60.02 75.03

1,024 × 768 @ 85 Hz 68.68 85.00

1,280 × 1,024 @ 60 Hz 63.98 60.02

1,280 × 768 @ 60 Hz 47.70 60.00

1,366 × 768 @ 60 Hz 48.39 60.04

Macintosh13” (640 × 480) 35.00 66.67

Macintosh16” (832 × 624) 49.73 74.55

Macintosh21” (1,152 × 870) 68.68 75.06

Note

•

• •

• Signals other than above may not be displayed properly.

•

• •

• The above signals are reformatted for optimal viewing on your display.

•

• •

• Applicable input signal for PC is basically compatible to VESA standard timing.

•

• •

• PC signal is magnified or compressed for display, so that it may not be possible to show fine detail with sufficient clarity.

TH-L32X10A

5 Self-check function

5.1. Self-check

1. Self-check is used to check the bus of the TV and the Hex code.

2. To enter the self-check mode, pressing -/V button on the user’s controller which is on the side of the main unit, press MENU

button on the remote controller unit simultaneously, and then the display screen will appear:

3. Turn off the TV after self-checking, and any programmed channels, channels caption data and some other user defined settings

will be erased and return to factory setting.

Display Ref No. Description P.C.B.

ADV IC4510 A/D convert A-Board

ADAV IC4510 Audio Processor A-Board

GENX IC1100 Microprocessor A-Board

MEM1 IC1101 EEPROM(GENX) A-Board

MEM2 IC8502 EEPROM(PEAKS LITE2) A-Board

TUN TU2901 TUNER A-Board

AVSW IC3001 AUDIO VIDEO SWITCH A-Board

OFDM IC8301 Orthogonal Frequency Division Multiplexing A-Board

TEMP IC1000 TEMP SENSOR A-Board

VIF TU2901 TUNER A-Board

TH-L32X10A

6 Power LED blinking timing chart

1. Subject

Information of LED Flashing timing chart.

2. Contents

When abnormality has occurred the unit, the protection circuit operates and reset to the stand by mode. At this time, the

defective block can be identified by number of blinking of the Power LED on the front panel of the unit.

Priority Blinking timing SOS detection subject LED blinking

1 INVERTER_SOS 1

2 FAN_SOS 2

3 SOS 3

4 DTV_9V 4

5 SUB_5V 6

6 MAIN_9V 5

7 SUB_3.3V 7

8 MAIN_3.3V 8

9 SOUND_SOS 9

10 ZWEI_SOS 10

11 AUDIO_PWM_SOS 14

12 Emergency 13

TH-L32X10A

7 Chassis Board Layout

Board Name Function

A-board AVSW, TUN, OFDM, ADV, P-AVC, GENX, EEP, TEMP

P-board Power Supply

V-board Remote, LED,Luminunce Sensor

K-board KEY,Power SW

TH-L32X10A

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