Panasonic KX-TS620BXB Manuel utilisateur

rights reserved. Unauthorized copying and distribu-

tion is a violation of law.

ORDER NO. KM40605055CE

Telephone Equipment

KX-TS620BXB

KX-TS620BXW

Telephone Answering System

Black Version

White Version

(for Asia, Middle Near East and Other areas)

KX-TS620BXB/KX-TS620BXW

TABLE OF CONTENTS

PAGE PAGE

1 Safety Precaution ------------------------------------------------ 4

1.1. For Service Technicians --------------------------------- 4

2 Warning -------------------------------------------------------------- 4

2.1. Battery Caution--------------------------------------------- 4

2.2. About Lead Free Solder (Pbf: Pb free)--------------- 4

3 Specifications ----------------------------------------------------- 6

4 Technical Descriptions ----------------------------------------- 7

4.1. Block Diagram (Base Unit) ------------------------------ 7

4.2. Circuit Operation (Base Unit)--------------------------- 8

4.3. Ringer IC----------------------------------------------------10

4.4. Module Block Diagram ---------------------------------- 11

4.5. Signal Route -----------------------------------------------12

5 Location of Controls and Components ------------------13

5.1. Controls -----------------------------------------------------13

6 Installation Instructions ---------------------------------------15

6.1. Connections------------------------------------------------15

7 Operation Instructions-----------------------------------------17

7.1. Dial Lock ----------------------------------------------------17

7.2. Troubleshooting-------------------------------------------18

8 Troubleshooting Guide ----------------------------------------20

8.1. Troubleshooting Guide ----------------------------------20

8.2. How to Replace the Flat Package IC----------------27

9 Disassembly and Assembly Instructions ---------------29

10 Schematic Diagram ---------------------------------------------30

10.1. For Schematic Diagram---------------------------------30

10.2. Schematic Diagram (Main)-----------------------------32

10.3. Schematic Diagram (Operation) ----------------------34

11 Printed Circuit Board-------------------------------------------35

11.1. Circuit Board (Main)--------------------------------------35

11.2. Circuit Board (Operation) -------------------------------37

12 Appendix Information of Schematic Diagram ---------39

12.1. CPU Data --------------------------------------------------39

12.2. Terminal Guide of the Ics, Transistor and

Diodes -------------------------------------------------------41

13 Exploded View and Replacement Parts List -----------42

13.1. Cabinet and Electric Parts -----------------------------42

13.2. Accessories and Packing Materials------------------43

13.3. Replacement Part List-----------------------------------44

KX-TS620BXB/KX-TS620BXW

1 Safety Precaution

1.1. For Service Technicians

ICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.

1. Cover the plastic parts boxes with aluminum foil.

2. Ground the soldering irons.

3. Use a conductive mat on the worktable.

4. Do not touch IC or LSI pins with bare fingers.

2Warning

2.1. Battery Caution

1. Danger of explosion if battery is incorrectly replaced.

2. Replace only with the same or equivalent type recommended by the manufacturer.

3. Dispose of used batteries according to the manufacture’s Instructions.

2.2. About Lead Free Solder (Pbf: Pb free)

Note:

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-

tains lead.

We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),

Silver (Ag), and Copper (Cu).

This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair

work we suggest using the same type of solder.

Caution

• PbF solder has a melting point that is 50 °F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with

temperature control and adjust it to 700 °F ± 20 °F (370 °C ± 10 °C).

• Exercise care while using higher temperature soldering irons.:

Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 °F (600 °C).

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

opposite side (See the figure below).

KX-TS620BXB/KX-TS620BXW

2.2.1. Suggested PbF Solder

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper

(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufac

turer’s specific instructions for the melting points of their products and any precautions for using their product with other materi-

als. The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.

2.2.2. How to recognize that Pb Free solder is used

(Example: Operation P.C.B.)

(Component View)

Note:

The location of the “PbF” mark is subject to change without notice.

CN801

MIC

PQUP11371Z

PbF

Marked

KX-TS620BXB/KX-TS620BXW

3 Specifications

KX-TS620BXB/KX-TS620BXW

4 Technical Descriptions

4.1. Block Diagram (Base Unit)

T1 D3, D5 C1

PC1 R1

IC1 D4, D6

Speaker

Q103, Q104 D7, D9

Q401 D8, D10

MIC

D306

D304

IC304

Q701 Q702

6.5V

DC Power

IC903

IC902

IC303, Q301

LCD

IC305

Handset / Headset

MIC

IC904

Q402

Q108

Ringer indication LED

LED 804 (1AP - SUB)

IC901

DSP MICON

NS BBIC

JOHN SMITH

1234567890

Keyboard

Switch

RINGER

BELL

Line

ON/OFF

Handset

Sending

Amp

Headset

Detection

FLASH

MEMORY

CIDIN+

CIDIN -

SP-Phone

Amp

MIC -

LSR +

HeadsetDET

MIC +

LSR -

LINE IN -

LINE OUT

Sidetone

Bridge

Reg.

1.8V

Reg.

3.2V

RSTn

VDD, AVD

VDDIO

VBAT2

Reset IC

Regulator

4.0V

Regulator

4.0V

ACFL

Power Down

Detection

KX-TS620 BLOCK DIAGRAM

KX-TS620BXB/KX-TS620BXW

4.2. Circuit Operation (Base Unit)

4.2.1. Outline

The unit consists of the following ICs as shown in the Block Diagram (Base Unit) (P.7).

•BBIC (Base Band IC): IC901

- Handling all the audio, signal and data processing needed

- ADPCM codec filter for speech encoding and speech decoding (DSP section)

- Echo-cancellation and Echo-suppression (DSP section)

- Any tones (tone, sidetone, ringing tone, etc.) generation (DSP section)

- DTMF receiver (DSP section)

- ADC, DAC, timer and power control circuitry

- All interfaces (eg: LCD, LED, Analog Front End, etc.)

•FLASH MEMORY: IC902

- Voice Prompt (TAM) Download Area

- Program D/L Area

•RINGER IC: IC1

- Bell signal generator (for bell detection purpose)

-RefertoRinger IC (P.10)

•SP AMP: IC904

- Low voltage audio power amplifier

•Additionally,

- Power Supply Circuit (+4.0V, +4.0V, +3.2V, +1.8V output)

- Telephone Line Interface Circuit

- Bell Detection Circuit

- SP-Phone Circuit

- Handset Circuit

-TAMCircuit

4.2.2. Power Supply Circuit

The power is supplied to the BBIC, Flash ROM, SP AMP, Logic IC, LCD, LED from AC adaptor (6.5V) as below:

• BBIC (IC901): CN301 -> D304 -> IC304 -> Q702 -> IC901

• Flash Memory (IC902): CN301 -> D304 -> IC304 -> Q702 -> IC902

• Logic IC (IC905): CN301 -> D304 -> IC304 -> Q702 -> IC905

• SP AMP (IC904): CN301 -> IC305 -> IC904

• LCD (LCD): CN301 -> D304 -> IC304 -> Q702 -> L302 -> LCD

• LED (LED801, LED802): CN301 -> IC305 -> L301 -> CN403 -> CN801 -> LED

KX-TS620BXB/KX-TS620BXW

4.2.3. Telephone Line Interface

Function:

• Bell Signal Detection

• Caller ID Detection

• ON/OFF hook Circuit

•AudioCircuit

4.2.3.1. Bell Detection Circuit

When the bell signal is input from LINE to T/R (when the telephone rings), BBIC detects bell signal via following path:

T -> D3 -> IC1(1) -> IC1(8) -> C4 -> R6 -> PC1(1) -> PC1(4) -> IC901(63)

R -> R1 -> LED804 -> D4 -> IC1(1) -> IC1(8) -> C4 -> R6 -> PC1(1) -> PC1(4) -> IC901(63)

After bell signal detected at IC901(63), the bell ringing signal is output at the speaker via the following path:

4.2.3.2. Caller ID Detection Circuit

Normally, FSK caller ID data is followed after the 1st bell signal.

When the bell signal is detected by BBIC, Caller ID signal is sent through the circuit via

following path:

T -> C501 -> R503 -> R905 -> IC901(107)

R -> C502 -> R504 -> R908 -> IC901(112)

4.2.3.3. On/Off Hook Circuit

In standby mode, SW101 is open and Q104 is OFF. Consequently Q103 is open and cut the DC loop current and voice signal.

This is an on-hook condition.

When handset is picked up or SP-Phone key is pressed, Q104 turns on and then Q103 turns on, thus providing an off-hook

condition. A DC loop is made and current flows through the circuit via following path:

T -> D7 -> Q103 -> Q108 -> R124 -> D106 -> D10 -> R

Pulse signal is generated by repeated switches between high (3.2V) and low (0V) logic output from IC901(79), switching the line

loop on and off.

4.2.3.4. Handset Circuit

* Refer to Signal Route (P.12).

4.2.3.5. Speakerphone Circuit

* Refer to Signal Route (P.12).

KX-TS620BXB/KX-TS620BXW

4.3. Ringer IC

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