Omron B3SN-3012 Manuel utilisateur
1
Tactile Switch (Sealed SMD Type) B3SN
Designed as Surface-mounting Device
(SMD) Meeting High-density Mounting
Requirements
SMD
T
actile Switch ideal for high-density mounting.
Compact and more than 1 mm thinner than
conventional tactile switches.
Available with ground terminals for protection
against static electricity.
Sealed construction conforming to IP64 (IEC-529)
provides high reliability in dusty or humid
environments.
Ordering Information
Model Number Legend:
B3SN-jjjjj
12345
1. Height
3: 3.1
mm
2. Ground terminal
0:
Without ground terminal
1:
With ground terminal
3. Sealing
1:
IP64 (IEC529)
4. Operating force (OF)
2:
1.57 N {160 gf}
5.
Shipment package
None: Bag
P:
Embossed tape
List of Models
Type Bags Embossed
tape (see note)
W
ithout ground terminal
B3SN-3012 B3SN-3012P
W
ith ground terminal
B3SN-3112 B3SN-3112P
Note:
Switches on embossed tape must be ordered in units of 3,000 pieces.
For details on packing, refer to
Switch Pacing
on page
17.
Specifications
Ratings/Characteristics
Switching
capacity
1 to 30 mA, 5 to 24 VDC (resistive load)
Contact configuration
SPST-NO
Contact resistance
100 m
Ω
max. (initial value) (rated: 1 mA, 5 VDC)
Insulation resistance
100 M
Ω
min. (at 250 VDC)
Dielectric strength
250 V
AC, 50/60 Hz for 1 min
Bounce time
5 ms max.
V
ibration resistance
Malfunction: 10 to 55 Hz, 1.5-mm double amplitude
Shock resistance
Destruction: 1,000 m/s
2
{approx. 100G} max.
Life expectancy
100,000 operations min.
Ambient temperature
Operating: –25
°
C to 70
°
C (with no icing)
Ambient humidity
Operating: 35% to 85%
Weight
Approx. 0.2 g
B3SN B3SN
2
Engineering Data
Operating Force vs. Stroke (Typical)
Stroke
S (mm)
Operating force (N {gf})
1.96 {200}
1.47 {150}
0.98 {100}
0.49 {50}
Nomenclature Film
Push
button
Cover
Terminals
Plunger
Contact dome
Fixed contact
Base
B3SN B3SN
3
Dimensions
Note: 1.
All units are in millimeters unless otherwise indicated.
2. No
terminal numbers are indicated on
the Switches. The numbers used for terminals in the following graphics are indicated in the
“Bottom
V
iew” diagram below
. In this diagram, the Switch is rotated so that the terminals
are on the right and left-hand sides, and the
OMRON
logo appears the right way up.
(Bottom V
iew)
3
1
4
2
Without Ground Terminal
B3SN-3012
B3SN-3012P
With Ground Terminal
B3SN-3112
B3SN-3112P
PCB
Mounting
(T
op V
iew) T
erminal Arrangement
/Internal Connections
(T
op V
iew)
2
4
1
3
9.5
4
2.6 5.4
2
6
3 dia.
1.2 0.7
6.5
(4.6)
7±0.5
4±0.2
2
4
1
3
5
9.5
4
2.6 5.4
1.4
3 dia.
6
(4.6)
1.2
2
6.5
0.70.7
7±0.5
4±0.2
3.4±0.2
PCB
Mounting
(T
op V
iew) T
erminal Arrangement
/Internal Connections
(T
op V
iew)
3.1+0.3
0
3.1+0.3
0
0.1
Operating Characteristics
Operating force (OF) 1.57±
0.49 N {160
±
50 gf} max.
Releasing force (RF)
0.29 N {30 gf} min.
Pretravel (PT) 0.25±
0.15 mm
Precautions
Soldering
Do
not apply flow
soldering, otherwise fragments of solder and flux
may
have a bad influence on the operation of the pushbutton.
Apply reflow soldering according to the optimum heating curve
shown below. Reflow soldering equipment may have a high peak
value.
Be sure to conduct a test before use.
Soldering
may be
repeated only once at a minimum interval of five
minutes
if the Switch is not soldered properly
.
Note: The above heating curve applies if the
thickness
of the circuit board is 1.6 mm.
T
emperature ( C)
°
Room
temperature
T
ime (s)
60
to 90 s
20 max.
10 max.
Preheating
B3SN B3SN
4
Do not apply additional force to the plunger once it has stopped
moving.
Do not repeatedly press the plunger off-center or from an acute
angle.
Cleaning
B3SN
Switches are designed to allow submersed cleaning after sol
-
dering.
When cleaning, follow the guidelines given as follows:
1. Clean
with alcohol solvents. Do not use chlorine solvents
or
water.
2. When using ultrasonic cleaning in two- or three-tank
systems,
do not clean for more than one minute at a time or for
more
than three minutes total.
3.
Do not apply external force to the Switch while cleaning.
4. Do
not clean immediately after
soldering. Allow components
to
stand for at least three minutes before
cleaning if possible.
5. The Switch cannot be used where subject to direct contact
with
water
.
Switch Packing
Switches
are packed on tape as shown below
.
(18) Label Tape drawing direction
Reel
Tape drawing direction
2
5.5
(3.6)
13 dia. 380±2 dia.
1.75±0.1
8±0.1
4±0.1
12±0.3
1.5+0.1
0 dia.
Package 3,000 Switches
Heat resistance
50°
C for 24 hours (not to be deformed)
Note: The
ground terminals of the Switches are on the guide hole
side
of the package.
ALL DIMENSIONS SHOWN ARE IN MILLIMETERS.
To
convert millimeters into inches, multiply by 0.03937. T
o convert grams into ounces, multiply by 0.03527.
Cat. No. C096-E1-2A
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