NeoDen NeoDen 4 Manuel utilisateur
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Hangzhou NeoDen Technology Co.Ltd
User Manual
Neoden4
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Content
1.Structure of Neoden 4.................................................................................................................. 6
1.1.Brief Introduction..................................................................................................................6
1.2.Structure of NeoDen 4.......................................................................................................... 7
2.Operation Flow Chart....................................................................................................................8
3.Procedure for making a programming file..................................................................................9
4.Edit on the Operation Interface..................................................................................................10
4.1Edit on the Interface.............................................................................................................10
4.1.1.PCB Feeding Setting................................................................................................10
（1）Tray fixed...................................................................................................... 10
（2）Rail once....................................................................................................... 10
（3）Rail multi.......................................................................................................11
（4）Eject front......................................................................................................11
4.1.2.Setting Panelized PCB & first chip( manual is the same as automatic download)............. 11
（1）Single PCB....................................................................................................12
（2）Panelized PCB.............................................................................................. 12
（3）PCB angle correction.................................................................................... 13
（4）Bad PCB detection........................................................................................13
4.1.3.PCB mark point setting............................................................................................13
（1）Single PCB....................................................................................................13
（2）Panelized PCB.............................................................................................. 13
（3）Maunal.......................................................................................................... 14
（4）Add or delete mark point.............................................................................. 14
4.1.4.Chip list setting........................................................................................................ 15
（1）Manual program............................................................................................15
（2）Import PCB BOM File..................................................................................16
4.1.5.Feeder configuration................................................................................................ 17
（1）Feed setting................................................................................................... 17
（2）System setting............................................................................................... 17
4.2.File mounting...................................................................................................................... 21
4.3.Manual test.......................................................................................................................... 22
4.3.1.Placement head........................................................................................................ 22
4.3.2.Rails control............................................................................................................. 23
4.3.3.Host control..............................................................................................................23
4.3.4.Feeder test................................................................................................................ 24
4.4.Factory settings................................................................................................................... 24
4.4.1Feeder configuration................................................................................................. 26
4.4.2.Feed setting.......................................................................................................... …29
4.4.3.Peel Configuration ……………………………………………………………… 30
4.4.4.System setting.......................................................................................................... 31
4.5.First trial and testing........................................................................................................... 33
4.6Continuous SMT production................................................................................................34
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5.Structure and maintenance instruction..................................................................................... 35
5.1.Structure chart..................................................................................................................... 35
5.1.1Peel box.....................................................................................................................36
5.1.2.Tape&Reel holder.................................................................................................... 36
5.1.3.Fixation support....................................................................................................... 37
5.1.4.Feed-box...................................................................................................................37
5.1.5.Vibration feeder........................................................................................................38
5.1.6.Auto-rails................................................................................................................. 39
5.1.7.Nozzle...................................................................................................................... 40
5.2Maintenance......................................................................................................................... 42
5.2.1.Take effective measures to reduce/ avoid malfunction........................................... 42
5.2.2Maintenance of device.............................................................................................. 43
5.2.3Placement failure analysis and troubleshooting....................................................... 44
5.2.4Related issues during Solder paste printing process ...............................................45
1.Stencil Printing Technology...................................................................................45
2.Inspecting of solder paste printing.........................................................................45
3.The defects of solder paste printing, reasons and solutions.................................. 46
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IMPORTANT
PLEASE READ THIS USER MANUAL
COMPLETELY BEFORE OPERATING
THIS UNIT AND RETAIN THIS BOOKLET
FOR FUTURE REFERENCE
Notes
1.The contents include all features of NeoDen4, some of which may not be equipped on your
machine.
2.Basic training and basic SMT knowledge is required for an operator.
3.For routine inspection and repair ,please contact sales for operating instruction.
Safety Device,Warning Label
1.Before operation,please ensure the presence of adequate guarding and safety devices to avoid
accident..
2.When tear down the safety device,please keep it in the original position,and make sure it works
in good condition
3.When failures happen on safety device,can not run the machine after remove safety device.In
case any injuries or casualty accident.
Usage
1.You agree that you will solely be responsible for your use of any products and services provided
to you and that you will use our products and services legally and only for the purposes that they
are intended to be used for.
2.You agree that you will not misuse the products and/or services supplied and that you will abide
by any laws applicable to this agreement or the operation of it.
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CAUTION
Power off: After cut off main power supply,pull the plug or disconnect the power cable from the
power supply.
1.When an exception or failure happens,or power failure,please terminate the operation of
Windows,and power it off.
2.Power off prior to cleaning and repairing in case of any accidents.
3.When pull the plug,please hold the head instead of wire.
Transport
1.Take necessary security measures,to prevent upside down or fall when lifting or moving.
Open
1.Please read all instruction in the wooden box
2.Do not cut the packing tape by knife,to avoid scratch the machine
3.Keep all packing material.
Installation
1.Please put the machine in a horizontal place.
2.Please keep the floor clean and dry,and the machine should be grounded, to prevent electric
shock or leakage.
Prepare work
1.Make sure the power cable no damage,no shedding and no loose.
2.Do not put hand in the working area.
Maintenance
1.Repair and calibration should be operated by skilled mechanical technician.When replacing
parts,please use the part which are supplied by NeoDen.We are not responsible for any accident
result from using nonstandard part.
2.In order to prevent electric shock caused by unskilled operation,the electrical repairs,
maintenance(including wiring),should be operated by professional electrician or the technical staff
from NeoDen or our distributors.
3.Make sure Bolts - Nuts are tighten after repair,calibration or replacing any part.
Working Environment
1.Do not use machine in a noisy environment,such as high frequency welding machine.
2.Do not use machine if the power supply voltage exceed the rated voltage ± 10%.
3.Do not use machine and pull the plug when thunder to avoid any accident caused by damaged
electrical component.
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1. Brief Introduction
1.1. Product Introduction
NeoDen4,the 4th generation pick and place machine of NeoDen Tech., was
independently designed and developed with patents and CE certificate.
This machine equipped with dual cameras, four heads, auto rails,electronic
feeder,two conveyor ports, which achieves high accuracy,simple structure,stable
performance and easy operation.
It adopts our newly developed feeding system which can help to replace the tape
easily and install smoothly, together with its vision system and rails feeding system,
committed to create the great value for customers in actual PCB production.
1 Number of Heads with Vision 4
2Placement Rate( under
factory
test
condition)
WITH VISION:5000/WITHOUT VISION:10000
3 Feeder capacity TAPE REEL FEEDERS:48（all 8mm)
VIBRATING FEEDERS:5
4 IC tray capacity 5
5 Component sizes with vision Smallest Component size:0201
Largest Component size:TQFP240
6 Component Max Height 5MM
7 Resolution X/Y axis:0.01MM Z axis:0.1MM
9Rotation +/-180°(360°)
10 Positioning Accuracy +/-0.02MM
11 X-Y repeatability +/-0.02MM
13 Placement Area
With Auto Rails:310*1500MM(without waffle tray)
140*1500MM(with 1 waffle tray)
Without Auto Rails :310*400MM(without waffle tray)
140*400MM(with 1 waffle tray)
15 Main Control GUI
16 Power Supply 110V/220V
17 Power 180W
18 External Dimensions Machine :87*68*48CM/Packing size:94*74*60CM
19 Weight Net Weight:60KGS/Gross weight:80KGS
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1.2. Structure of NeoDen 4
Each part mentioned above can be disassembled and tested. Please find more details on P20.
①：Placement head
②: Nozzle
③：Rails
④：Vibration feeder
⑤：On/Off button
⑥：Conveyor port
⑦：Multi-hole positioning board
⑧：Feed box
⑨：Peel box
⑩：Emergency button
⑪：Power switch
⑫：Rack shelf
⑬：Acrylic cover
⑭：Foot Mounts
⑮：Fixed support
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2. Operation Flow Chart
NO. Flow chart Note
1
Check the working environment
whether it is safe or not
2
3
The machine will start a 1-2 mins
self-inspection after boot-up. It enters
the operation page once finished.
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5
Please check detailed programming
tutorial in P10.
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After making a programming file, there
may exist several unpredictable
problems , such as rotation issues of
components, so a production testing is
necessary for solving issues.
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Start to pick and place
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Power off software
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Power off after the software being
turned off, which decrease the damage
to the software
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Keep the machine clean and nozzles
need to be washed regularly
Keep daily maintenance of nozzle
assures high utility.
P
reparation
Turn
on
Initialization
Operation
page
Edit
Test
Modify
Yes
No
Mounting
Exit
System power off
Power off
Cleaning and maintenance
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3. Procedure for making a programming
file
Note: The basic procedure of making a programming file for manual programming or direct PCB
file is similar, but there are two different parts: chip list and mark point setting. Please find the
detailed operation steps of the differences on relative page.
Start
Add a new file
Edit the file
2、Chip list See P11
See P 17
See P11
See P13
See P10
1. PCB feed setting
3.Feeder setting
4.Panelized PCB first
chip setting
5.Mark point setting
Save
and
return
Select
file and
start
working
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4. Edit on the Operation Interface
4.1. Edit on the Interface
See below Fig.: Edit Interface
4.1.1. PCB Feeding Setting
Function:Used to confirm the feeding place,first edit item in manual program
Introduction of function keys:
(1) Tray Fixed:Once select tray fixed,the setting items of board feeding will be closed.We only
need use the positioning column to fix the board.
(2) Rail Once:First need ensure there are rails for your machine,then select one-off rail feed,the
setting items will be open corresponding.
Operation Step:First should adjust the width of the rail to ensure the PCB can move smoothly
Adjust the position of the board in rail via clicking items”Rail forward” and “Rail
backward”.
Click “ Align” enter into below interface(See fig.2),then adjust the position of camera until
to the limited place (See fig.3).Click “Save” item to save the setting,return to the main page
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