Lime Microsystems LMS7002MR3 Manuel d'utilisation et d'entretien

Lime Microsystems Limited

Surrey Tech Centre

Occam Road

The Surrey Research Park

Guildford, Surrey GU2 7YG

United Kingdom

Tel: +44 (0) 1483 685 063

Fax: +44 (0) 1428 656 662

e-mail: [email protected]

LMS7002M –Multi-Band, Multi-Standard MIMO

RF Transceiver IC

- Programming and Calibration Guide -

Chip version:

LMS7002M

Mask revision:

Document version:

3.01

Document revision:

Contents

1. Serial Port Interface ............................................................................................................ 3

1.1 Description ................................................................................................................. 3

2. LMS7002Mr3 Memory Map Description.......................................................................... 5

2.1 LMS7002Mr3 Memory Map...................................................................................... 5

2.2 General Control, LimeLightTM and IO Cell Configuration Memory ......................... 8

2.3 NCO Configuration Memory ................................................................................... 17

2.4 TxTSP(A/B) Configuration Memory ....................................................................... 20

2.5 RxTSP(A/B) Configuration Memory....................................................................... 23

2.6 RX/TX GFIR1/GFIR2 Coefficient Memory............................................................ 26

2.7 RX/TX GFIR3 Coefficient Memory ........................................................................ 27

2.8 RFE(1, 2) Configuration Memory............................................................................ 28

2.9 RBB(1, 2) Configuration Memory ........................................................................... 32

2.10 TRF(1, 2) Configuration Memory............................................................................ 35

2.11 TBB(1, 2) Configuration Memory ........................................................................... 37

2.12 TRX Gain Configuration Memory........................................................................... 39

2.13 AFE Configuration Memory .................................................................................... 41

2.14 BIAS Configuration Memory................................................................................... 42

2.15 SXR, SXT Configuration Memory .......................................................................... 43

2.16 CGEN Configuration Memory................................................................................. 47

2.17 XBUF Configuration Memory ................................................................................. 50

2.18 LDO Configuration Memory ................................................................................... 51

2.19 EN_DIR Configuration Memory ............................................................................. 60

2.20 SXR, SXT and CGEN BIST Configuration Memory .............................................. 61

2.21 CDS Configuration Memory.................................................................................... 62

2.22 mSPI Configuration Memory................................................................................... 64

2.23 DC Calibration Configuration Memory ................................................................... 65

2.24 RSSI, PDET and TEMP measurement Configuration Memory .............................. 70

2.25 Analog RSSI Calibration Configuration Memory ................................................... 72

3. SPI Procedures................................................................................................................... 73

A1.1 SPI READ/WRITE Pseudo Code ............................................................................ 73

4. Control Block Diagrams ................................................................................................... 75

A2.1 RFE Control Diagrams............................................................................................. 76

A2.2 RBB Control Diagrams ............................................................................................ 78

A2.3 TRF Control Diagrams............................................................................................. 80

A2.4 TBB Control Diagrams ............................................................................................ 82

A2.5 AFE Control Diagram .............................................................................................. 84

A2.6 BIAS Control Diagram............................................................................................. 85

A2.7 SXR and SXT Control Diagrams ............................................................................. 86

A2.8 CGEN Control Diagram........................................................................................... 88

A2.9 XBUF Control Diagram ........................................................................................... 89

A2.10 LDOs Control Diagram........................................................................................ 90

A2.11 CDS Control Diagram.......................................................................................... 91

A2.12 IO Cell Control Diagram...................................................................................... 91

A2.13 TxTSP(A/B) Control Diagram ............................................................................. 92

A2.14 RxTSP(A/B) Control Diagram............................................................................. 93

A2.15 SXR, SXT and CGEN BIST Control Diagram .................................................... 94

A2.16 TxTSP(A/B) BIST Control Diagram ................................................................... 95

A2.17 RxTSP(A/B) BIST Control Diagram ................................................................... 95

A2.18 LimeLightTM Control Diagram............................................................................. 96

A2.19 DC offset correction Control Diagram................................................................. 97

A2.20 Measurement block Control Diagram .................................................................. 98

5. Calibration algorithms ...................................................................................................... 99

A3.1 VCO coarse tuning ................................................................................................... 99

A3.2 Main resistor (bias) calibration .............................................................................. 102

A3.3 RBB calibration...................................................................................................... 104

A3.3.1 RBB Low Band Calibration ........................................................................... 104

A3.3.2 RBB High band Calibration ........................................................................... 106

A3.4 Nested algorithms................................................................................................... 107

A3.4.1 Algorithm A ................................................................................................... 107

A3.4.2 Algorithm B.................................................................................................... 107

A3.4.3 Algorithm F .................................................................................................... 109

A3.5 TBB calibration ...................................................................................................... 111

A3.6 TBB Low Band Calibration ................................................................................... 111

A3.7 TBB High Band Calibration................................................................................... 114

A3.8 Nested algorithms................................................................................................... 115

A3.8.1 Algorithm A ................................................................................................... 115

A3.8.2 Algorithm B.................................................................................................... 115

A3.8.3 Algorithm C.................................................................................................... 115

A3.8.4 Algorithm D ................................................................................................... 117

A3.8.5 Algorithm E.................................................................................................... 117

Revision History

Version 31r00

Released: 23 Jan, 2017

Initial version. Build based on LMS7002M Programming and Calibration Guide v2.24.

New register HBD_DLY[2:0] added (address 0x404[15:13]).

Table 1 updated.

Chapters 2.24 and 2.25 added.

New register CMIX_GAIN[2] added (address 0x40C[12]).

Description of register CMIX_GAIN[1:0] changed (address 0x40C[15:14]).

New register CMIX_GAIN[2] added (address 0x208[12]).

Description of register CMIX_GAIN[1:0] changed (address 0x208[15:14]).

RESRV_CGN[3:1] changed to RESRV_CGN[2:1] (address 0x008D[2:0]).

New register CMPLO_CTRL_CGEN added (address 0x008B[14]).

Default value of ICT_VCO_CGEN[4:0] register (address 0x008B[13:9]) changed to 15.

New register ISINK_SPIBUFF[2:0] added (address 0x00A6[15:13]).

New register R5_LPF_BYP_TBB_(1, 2) added (address 0x010B[0]).

New register RZ_CTRL_(SXR, SXT)[1:0] added (address 0x0122[15:14]).

New register CMPLO_CTRL_(SXR, SXT) added (address 0x0122[13]).

Chapter 1.1 updated.

New register LML2_TRXIQPULSE added (address 0x0022[15]).

New register LML2_SISODDR added (address 0x0022[14]).

New register LML1_TRXIQPULSE added (address 0x0022[13]).

New register LML1_SISODDR added (address 0x0022[12]).

Description of registers at addresses 0x0024, 0x0027 updated.

(address 0x0025[12:8]).

(address 0x0025[4:0]).

(address 0x0026[12:8]).

(address 0x0026[4:0]).

(address 0x0028[12:8]).

(address 0x0028[4:0]).

(address 0x0029[12:8]).

(address 0x0029[4:0]).

(address 0x0023[4]).

(address 0x0023[1]).

LimeLight Control Diagram updated.

New register MCLK2_INV added (address 0x002B[9]).

New register MCLK1_INV added (address 0x002B[8]).

Description of registers at addresses 0x002C updated.

New register FCLK2_DLY[1:0] added (address 0x002A[15:14]).

New register FCLK1_DLY[1:0] added (address 0x002A[13:12]).

Section 1.1 updated (few typo errors fixed).

Figure 4 updated –SXT and SXR added.

Description of registers GFIR3_L (addresses 0x0207[10:8] and 0x0407[10:8]) updated –error

in the formula fixed.

New register RSSI_MODE[1:0] added (address 0x040A[15:14]).

New register CAPSEL_ADC[12] added (address 0x0400[12]).

Description of registers CAPD[31:0] (addresses 0x040E and 0x40F) and CAPSEL[1:0]

(address 0x0400[14:13]) updated.

New register DCLOOP_BYP added (address 0x040C[8]).

Version 31r01

Released: 6 Mar, 2017

changed.

Version 31r02

Released: 27 Mar, 2017

New register TRX_GAIN_SRC added (address 0x0081[15]).

New chapter 2.12 with new registers at addresses 0x0125 and 0x0126 added.

MASK register default value updated.

Version 31r03

Released: 03 Aprl, 2017

Figure 19 updated (pin naming corrected to match the datasheet pin naming)

Version 31r04

Released: 24 Apr, 2017

Updated 2.23, 2.24 and 2.25 section register description. Some of registers were separated

into individual register descriptions;

Various minor register description updates and fixed;

Updated Figure 5, Figure 6, Figure 11, Figure 12, Figure 15, Figure 16, Figure 17 and Figure

19 according to MASK=1 features.

Added sections A2.19 and A2.20.

Version 31r05

Released: 19 Jul, 2017

Updated Figure 19: Digital Padring pad names corrected, VDD12_AFE renamed to

VDD_AFE;

Serial Port Interface

1.1 Description

The functionality of LMS7002Mr3 transceiver is fully controlled by a set of internal registers

which can be accessed through a serial SPI port interface. Both write and read operations are

supported. The serial SPI port can be configured to run in 3 or 4 wire mode with the following

pins used:

SEN SPI serial port enable, active low, output from master;

SCLK SPI serial clock, output from master;

SDIO SPI serial data in/out (Master Output Slave Input (MOSI) / Master

Input Slave Output (MISO)) in 3 wire mode, serial data input (MOSI) in 4 wire mode;

SDO SPI serial data out (MISO) in 4 wire mode, don’t care in 3 wire mode.

SPI serial port key features:

Operating as slave;

Operating in SPI Mode 0: data is captured on the clock's rising edge, while data is

shifted on the clock's falling edge (i.e. clock polarity CPOL = 0 and clock phase

CPHA = 0);

32 serial clock cycles are required to complete write operation;

32 serial clock cycles are required to complete read operation;

Multiple write/read operations are possible without toggling serial enable signal.

All configuration registers are 16-bit wide. Write/read sequence consists of 16-bit instruction

followed by 16-bit data to write or read. MSB of the instruction bit stream is used as SPI

command where CMD = 1 for write and CMD = 0 for read. Next 4 bits are reserved

(Reserved[3:0]) and must be zeroes. Next 5 bits represent block address (Maddress[4:0]) since

LMS7002Mr3 configuration registers are divided into logical blocks as shown in

Table 1. Remaining 6 bits of the instruction are used to address particular registers

(Reg[5:0]) within the block as described in Section 2. Maddress and Reg compiles global 11-

bit register address when concatenated ((Maddress << 6) | Reg). Use global address values for

particular register from the tables provided in Section 2.

Write/read cycle waveforms are shown in Figure 1, Figure 2 and Figure 3. Note that

write operation is the same for both 3-wire and 4-wire modes. Although not shown in the

figures, multiple byte write/read is possible by repeating instruction/data sequence while

keeping SEN low.

SCLK Don’t care

SEN

SDIO Don’t care A141 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

Write instruction Data

Don’t care

tES tDS tDH tEH

Figure 1 SPI write cycle, 3-wire and 4-wire modes

SCLK Don’t care

SEN

SDIO Don’t care A140 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

Read instruction

Don’t care

tES tDS tDH tEH

SDO Don’t care

Output Data

D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 Don’t care

tOD

Figure 2 SPI read cycle, 4-wire mode (default)

SCLK Don’t care

SEN

SDIO Don’t care A140 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

Read instruction

Don’t care

tES tDS tDH tEH

Output Data

D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 Don’t care

tOD

Figure 3 SPI read cycle, 3-wire mode

LMS7002Mr3 Memory Map Description

2.1 LMS7002Mr3 Memory Map

All the LMS7002Mr3 configuration space is accessible via serial SPI interface. All the

configuration space is divided to logical block types:

Other

Top

TRX

TX

RX

LMS7002Mr3 chip is MIMO, hence it have two channels called A and B. So, some

analogue/digital modules appears in MIMO channel A as well as B (from TRX, TX and RX

blocks). The rest of moduleMr3s (from Other and Top logical block types) are controlled only

from one memory block. All the logical blocks are summarized in

Table 1.

To save the addressing space and speed-up write operation the following trick is used

for the TRX, TX and RX logical block types. There is a register called MAC[1:0] (address of

this register is 0x0020[1:0]) which selects MIMO channel A or/and B. MIMO channel select

logic depends on MAC[1:0] register as described below (see Figure 1 for reference):

11 –SPI write operation possible only. The same data are written to the A and B

MIMO channels at the same time. Note, that read operation will corrupt read data

when MAC[1:0] is set to "11".

01 –SPI read/write operation possible. Data may be written to or read from the MIMO

channel A only.

10 –SPI read/write operation possible. Data may be written to or read from the MIMO

channel B only.

Using the MAC register simplifies programming for MIMO. As an example, the

addresses of registers controlling TBBA and TBBB are the same, but the individual A or B

channels are identified using the MAC[1:0] register.

Let us consider the write operation to the G_TIA_RFE_A[1:0] register. This register

controls the RFE module within MIMO channel A. To write to the G_TIA_RFE_A[1:0]

value will be written to the registers G_TIA_RFE_A[1:0] and G_TIA_RFE_B[1:0] at the

same time (i.e. only one write operation is required, hence time saved). Similarly, if we want

to write to the G_TIA_RFE_B[1:0] register only, we have to set MAC[1:0] to "10".

The special case is frequency synthesizers SXR and SXT. Register addresses are the

same for SXR and SXT. To control SXT we have to set MAC[1:0] to the "10" and MAC[1:0]

to the "01" for SXR.

Modules from the Top and Other logical blocks (see Table 1) are not controlled by the

MAC[1:0] register.

TRXA

Block

TXA

Block

RXA

Block

TRXB

Block

TXB

Block

RXB

Block

Top

Block

Other

Block

SPI Bus

MAC[0]

MAC[1]

MIMO channel A

control enable

MIMO channel B

control enable

SXR

SXT

Figure 4 Access logic of configuration modules

The memory mapping is shown in Table 1. There are five basic logical blocks. These

are:

a) Other, controlling the microcontroller and LimeLightTM interface;

b) Top, controlling the top level bias, clock synthesizers, buffers, LDOs and BIST;

c) TRX, controlling the Transmit and Receive RF functions;

d) TX, controlling the transmit digital functions;

e) RX, controlling the receive digital functions.

Ce manuel convient aux modèles suivants

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