HPE 5945 Instructions d'installation

MF877-00 Page 1

Template Revision A

HPE instructions for this template are available at MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Networking Equipment

Marketing Name / Model

[List multiple models if applicable.]

HPE 5945 4-slot Switch JQ076A

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU

directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

MF877-00 Page 2

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HPE instructions for this template are available at MF877-01

Item Description

Notes

Quantity

of items

included

in product

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Phillips screwdriver

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove all the blank panel.

2. Remove film 1-1 from panel 1-2.

3. Remove shielding fingers 2-1 from panel 2-2.

4. Unscrew all screws 3, then remove the cover assembly 4 and management panel 5.

5. Remove lab 4-3,4-4,4-5,4-6 and foam 4-2 from cover 4-1.

6. Remove film 5-1 and film 5-3 from panel 5-2.

7. Unscrew all screws 6 and screws 7, then remove the pcb 8,10,11 and air guide 9.

8. Remove dowel 8-1, dowel bushing 8-2, spring 8-3 and radiator 8-4 from pcb 8-5.

9. Unscrew all screws 10-1, then separation of pcb 10-2 and pcb 10-4, then remove the double-screw belts 10-3.

10. Unscrew all screws 11-5, then separation of pcb 11-6 and pcb 11-7, then remove dowel 11-1, dowel bushing 11-2,

spring 11-3 and radiator 11-4 from pcb 11-7.

11. Unscrew all double-screw belts 12 and radiator's screws, then remove radiator 13 and pcb 14.

12. Unscrew all screws 14-1, then remove handle 14-2 from pcb 14-3.

13. Unscrew all screws 15 and screws 17, then remove film 16 and support panel 18.

14. Unscrew all screws 19 and double-screw belts 21, then remove rack 20 and pcb 22.

15. Unscrew all screws 22-1, then remove confluence bar 22-2 from pcb 22-3.

16. Separation of film 23,27, shielding fingers 24, foam 25 and conductive foam 26 from base 28.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

MF877-00 Page 3

Template Revision A

HPE instructions for this template are available at MF877-01

Figure 1 Remove all the blank panel

MF877-00 Page 4

Template Revision A

HPE instructions for this template are available at MF877-01

Figure 2 Treatments to the power blank panel

Figure 3 Treatments to the card blank panel

MF877-00 Page 5

Template Revision A

HPE instructions for this template are available at MF877-01

Figure 4 Unscrew all screws 3, then remove the cover assembly 4 and management panel 5

MF877-00 Page 6

Template Revision A

HPE instructions for this template are available at MF877-01

Figure 5 Remove lab 4-3,4-4,4-5,4-6 and foam 4-2 from cover 4-1

Figure 6 Remove film 5-1 and film 5-3 from panel 5-2

MF877-00 Page 7

Template Revision A

HPE instructions for this template are available at MF877-01

Figure 7 Unscrew all screws 6 and screws 7, then remove the pcb 8,10,11 and air guide 9

MF877-00 Page 8

Template Revision A

HPE instructions for this template are available at MF877-01

Figure 8 Remove dowel 8-1, dowel bushing 8-2, spring 8-3 and radiator 8-4 from pcb 8-5

Figure 9 Unscrew all screws 10-1, then separation of pcb 10-2 and pcb 10-4, then remove the double-screw

belts 10-3

MF877-00 Page 9

Template Revision A

HPE instructions for this template are available at MF877-01

Figure 10 Unscrew all screws 11-5, then separation of pcb 11-6 and pcb 11-7, then remove dowel 11-1,

dowel bushing 11-2, spring 11-3 and radiator 11-4 from pcb 11-7

Figure 11 Unscrew all double-screw belts 12 and radiator's screws, then remove radiator 13 and pcb 14

MF877-00 Page 10

Template Revision A

HPE instructions for this template are available at MF877-01

Figure 12 Unscrew all screws 14-1, then remove handle 14-2 from pcb 14-3

Figure 13 Unscrew all screws 15 and screws 17, then remove film 16 and support panel 18

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