HP FlexNetwork 7506X Instructions de montage

Page 1

Product End-of-Life Disassembly Instructions

Product Category: Networking Equipment

Marketing Name / Model

[List multiple models if applicable.]

HPE FlexNetwork 7506X PoE Ethernet Switch 6 slots Chassis(R8N48A)

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU

directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium

coin or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

Page 2

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screwdriver

Diagonal Cutters

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Unscrew the screws on mounting angle 2, and then remove mounting angle 2.

2. Unscrew the screws on cabling rack 3, and then remove cabling rack 3 from mounting angle 2.

3. Unscrew the screws on front panel 4, and then remove front panel 4.

4. Unscrew the screws on front panel 5, and then remove front panel 5.

5. Unscrew the screws on front panel 6, and then remove front panel 6.

6. Remove film 7.

7. Remove film 8.

8. Unscrew the screws on fan module frame 9, and then remove fan module frame 9.

9. Unscrew the screws on rear cover plate 10, and then remove rear cover plate 10.

10. Unscrew the screws on reinforcing plate 12, and then remove reinforcing plate 12.

11. Unscrew the screws on reinforcing plate 11, and then remove reinforcing plate 11.

12. Unscrew the screws on PCB 13, and then remove PCB 13.

13. Unscrew the screws on busbar 14, and then remove busbar 14.

14. Remove all the labels.

15. Remove all shielding fingers.

16. Remove shielding gasket 4-2 from blank panel 4-1.

17. Remove film 4-3 from blank panel 4-1.

18. Remove shielding gasket 5-2 from blank panel 5-1.

19. Remove film 5-3 from blank panel 5-1.

20. Remove the nine fans 9-2 from fan frame 9-1.

21. Unscrew the screws on PCB 9-3, and then remove PCB 9-3.

22. Remove all of the inner cables.

23. Unscrew the screws on handle 9-4, and then remove handle 9-4.

24. Remove film 9-5 from fan frame 9-1.

25. Remove shielding finger 9-6 from fan frame 9-1.

26. Unscrew the screws on guide pin 13-2, and then remove guide pin 13-2.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Page 3

Figure 1. Front of the product

Figure 2. Rear of the product

Page 4

Figure 3 Treatments to module 4

Figure 4 Treatments to module 5

Page 5

Figure 5 Treatments to fan module 9

Figure 6 Treatments to module 13

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