HP Aruba 8360-48Y6C v2 Instructions d'installation

MF877-00 Page 1

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Networking

Marketing Name / Model

[List multiple models if applicable.]

HPE Aruba 8360-48Y6C v2 Switch (JL719C)

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by

Directive 2012/19/EU of the European Parliament and of the Council on Waste Electrical and Electronic Equipment

(WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium

coin or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

MF877-00 Page 2

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Item Description

Notes

Quantity

of items

included

in product

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Torx Screw Drivers

T-10, T-15

Wire snips

Needle nose pliers

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Unscrew the screws (qty 18) with a T-10 driver, from the top of the chassis (Figure 1)

2. Unscrew the screws (qty 3) with a T-10 driver, from the right side of the chassis (Figure 1)

3. Unscrew the screws (qty 3) with a T-10 driver, from the left side of the chassis (Figure 1)

4. Remove the lid from the chassis base

5. Remove the plastic tab fr chassis (Figure 2)

6. Remove the coin battery from its holder on the right side of the main PCA (Figure 3)

7. Cut cable tie with wire snips, remove the screw (qty 1) with a T-10 driver, from the PCA at the rear right corner of the

switch (Figure 4)

8. Disconnect the cable and remove the PCA (Figure 4)

9. Unscrew the screw (qty 1) with a T-10 driver, and the bracket that were under the rear PCA (Figure 5)

10. Unscrew the screw (qty 2) with a T-10 driver, and remove front PCA (Figure 6)

11. Use force to pull out the flex cable fr the 2 connector (Figure 7)

12. Unscrew the screw (qty 1) with a T-10 driver, from the front left chassis, and remove the shield cover and shield (Figure

13. Unscrew the screws (qty 6) with a T-10 driver, that secure the daughter PCA to the base (Figure 9)

14. Remove the sheet metal parts that is securing the daughter PCA, remove the daughter PCA and then remove the 2

plastic airflow baffle (Figure 10)

15. Remove the DIMM PCA from the daughter PCA (Figure 11)

16. Remove the small heatsink by unclipping the two wire bails from the daughter PCA, then twist and untwist a couple of

times to remove the heatsink from the thermal interface material (Figure 12)

17. Unscrew the screws (qty 2) at the side, with a T-10 driver, and remove the left and right air baffle (Figure 13)

MF877-00 Page 3

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

18. Unscrew the screws (qty 14) with a T-10 driver, that secure the main PCA to the base (Figure 14)

19. Remove the main PCA from the base. Remove the small heatsink by unclipping the two wire bails from the main PCA,

then twist and untwist a couple of times to remove the heatsink from the thermal interface material and unscrew the 8

screws fr the heatsink and remove the heatsink by twisting and untwisting a couple of times. (Figure 15)

20. At the front right corner of the main PCA, remove the front plastic lightpiple (Figure 16)

21. On the empty chassis front right, remove the 2 lightpipe (Figure 17).

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Figure 1: Chassis screw locations

MF877-00 Page 4

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Figure 2: Plastic tab location

Figure 4: Rear PCA fastener and

connector

Figure 5: Rear PCA bracket and fastener

Figure 3: Coin battery location

Figure 6: Front PCA and fastener

MF877-00 Page 5

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Figure 7: Flex cable

Figure 8: Shield assembly

Figure 9: Daughter PCA screw location

MF877-00 Page 6

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Figure 10: Daughter PCA removal

Figure 8: ASIC stacked fin heatsink hardware assemblies

Figure 11: Flex cable

Figure 12: Shield assembly

MF877-00 Page 7

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Figure 13: Left and right air baffle

reval

MF877-00 Page 8

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Figure 14: Main PCA screw location

MF877-00 Page 9

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Figure 15: Main PCA and heatsink removal

Figure 16: Light pipe Removal

Figure 17: Front light pipe removal

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