HP 5500-24G-PoE+-4SFP Instructions de montage

Product End-of-Life Disassembly Instructions

Product Category: Networking Equipment

Marketing Name / Model

[List multiple models if applicable.]

HP 5500-24G-PoE+-4SFP HI Switch w/2 Slt(JG541A)

HP 5500-24G-PoE+-4SFP HI TAA Swch w/2Slt(JG679A)

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

EL-MF877-00 Page 1

Template Revision B

Tool Description

Tool Size (if

applicable)

Screw driver

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Unscrew the screws on mounting angle 1, and then remove mounting angle 1.

2. Unscrew the screws on mounting angle 2, and then remove mounting angle 2.

3. Unscrew the screws 3, and then remove the screws 3.

4. Unscrew the screws on the dummy bar 4,and then remove the dummy bar 4.

5. Remove the power 5 and the filler panel 6.

6. Unscrew the screws on top cover 7, and then remove top cover 7.

7. Remove plastic panel 8.

8. Remove all of the inner cables.

9. Unscrew the screws on the shutter 10, and then remove the shutter 10.

10. Unscrew the screws on the shutter 11, and then remove the shutter 11.

11. Unscrew the screws on fan-assembly 9, and then remove fan-assembly 9 from the chassis.

12. Unscrew the screws on PCB 12, and remove PCB 12 from the chassis.

13. Unscrew the screws 9-1,and then remove the fan 9-3 from the bracket 9-2.

14. Unscrew the screws on PCB 12-2, and then remove PCB 12-2 from PCB 12-1.

15. Remove the lamp guide 12-3 from PCB 12-1.

16. Remove all of the labels from the chassis.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 2

Template Revision B

3.3 Material of the facility built

Facility

Components

Material

Weight(g)

Weight percentage

Selective treatment for

materials and components

Details

1.15%

Fe recycling

1.48%

Fe recycling

40*2

1.32%

Fe recycling

960

15.82%

Fe recycling

100

1.65%

Fe recycling

Figure 1Remove mounting angle Figure 2 Rear of the product

Figure 3Treatments to the product Figure 4Treatments to the product

Figure 5 Treatments to fan-assembly Figure 6Treatments to PCB

EL-MF877-00 Page 3

Template Revision B

1500

24.72%

Fe recycling

PC+ABS

0.82%

Containing

brominated flame

retardants

Pla recycling

9-2

0.66%

Fe recycling

9-3

PBT+Cu

1.20%

Containing

brominated flame

retardants

Cu recycling

0.41%

Fe recycling

PC+ABS

0.82%

Containing

brominated flame

retardants

Pla recycling

12-1

Complex

PWB

1010

16.64%

The surface of PCB is greater

than 10 square centimeters;

12-2

Complex

PWB

1.32%

The surface of PCB is greater

than 10 square centimeters;

12-3

0.16%

Containing

brominated flame

retardants

Pla recycling

1930

31.81%

Fe recycling

4. Revised record

Date

Version

Author

Modify content

2013.01.08

Li Meng

Initial version

2013.04.10

Liu Baoquan

Add the module JG679A

EL-MF877-00 Page 4

Template Revision B

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