HP Apollo 4200 Gen10 Instructions d'installation
MF877-00 Page 1
Template Revision A
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Servers
Marketing Name / Model
[List multiple models if applicable.]
HPE Apollo 4200 Gen10
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU
directive 2012/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
1.3 Quantities vary by product configuration.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
6
Batteries
All types including standard alkaline and lithium
coin or button style batteries
2
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
Quantity varies by product configuration and power
supply model selected
1 to 10
External electrical cables and cords
Quantity depends on number of power supplies,
networking devices, and I/O devices
1 to 15
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
MF877-00 Page 2
Template Revision A
HPE instructions for this template are available at MF877-01
Item Description
Notes
Quantity
of items
included
in product
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Torx Driver
T10
Torx Driver
T15
Philps Driver
#2
Flat head screw driver
Medium
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. System Battery - Remove the top cover and locate the standup card in back pci card slot bay next to the chassis wall.
Remove the board by pulling the front CPU drawer out ~ 3 inches then unscrewing the PCA's two blue finger screws
located on both ends of the PCA. Use a medium flat head screwdriver or fingers to remove the battery and dispose of
properly.
2. Megacell - Some models, remove the battery from the holder and disconnect cable from PCA.
3. Capacitors=>2.5CM - Remove the power supplies from the system. With a #2 Philips screw driver, remove the screws
securing the top cover, then locate the capacitors and pry from the PCB with a medium flat head screw driver and
dispose of properly.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Attachment 1, 2 –System Coin Battery location
Attachment 3 –Megacell location
Attachment 4 to 8 - Capacitor location by model number of supply
Ce manuel convient aux modèles suivants
4
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