HP Split 13 x 2 PC Instructions de montage

Product End-of-Life Disassembly Instructions

Product Category: Notebooks and Tablet PCs

Marketing Name / Model

[List multiple models if applicable.]

HP Split 13 x 2 Notebook PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Main/B, Touch pad, USB/B, HDMI/B

Batteries

All types including standard alkaline and lithium coin

or button style batteries Slate Baterry, Dock Battery

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

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Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description #1 ScrewDriver

Description #2

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Separate Slate side and Dock side

2. For Slate module :

3. Dis-fasten Slate moudle Bezel trim screw*2(M2.0*3.5)

4. Disassemble LCD cover

5. Pull out battery cable

6. Dis-fasten screw*40(M2.0*3.5, M2.0*2.5, M2.0*2)

7. Disassemble Docking FPC

8. Disassemble Docking cable

9. Disassemble Battery

10. Pull out Micro SD FFC

11. Disassemble Micro SD/Board

12. Disassemble Audio/Board

13. Disassemble Home Led/Board

14. Disassemble Bezel trim

15. Pull out Fan FPC

16. Disassemble Thermal module

17. Pull out Camera cable

18. Pull out LCD cable

19. Pull out Volume/Board FFC

20. Pull out Power/Board FFC

21. Pull out Antenna cable*2

22. Pull out TS FFC

23. Pull out TS/Board FPC

24. Disassemble TS/Board

25. Disassemble Power/Board

26. Disassemble Volume/Board and Vibrator

27. Disassemble Wlan Card

28. Disassemble SSD card

29. Disassemble Ram module

30. Disassemble Frame

31. Disassemble Main/Board

32. Disassemble Speaker(L&R)

33. Disassemble Antenna module

34. For Dock Module:

35. Pull out Rubber from Base*2

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36. Dis-fasten Bottom Base screw*6(M2.5*5, M2.5*4)

37. Disassemble Base

38. Dis-fasten hinge screw*8(M2.5*5, L&R)

39. Disassemble Hinge Assy

40. Dis-fasten battery screw*6(M2.5*5)

41. Pull out Battery cable and Disassemble Battery

42. Dis-fasten HDD screw*3(M2.5*4)

43. Pull out HDD cale

44. Disassemble HDD Assy

45. Dis-fasten HDD Assy screw*4(M3.0*3.5)

46. Dis-fasten Toch pad screw*2(M2.0*2.0)

47. Pull out TP FFC

48. Disassemble Touch pad module

49. Dis-fasten Dummy weight screw*1(M2.5*2.5)

50. Disassemble Dummy Weight

51. Dis-fasten USB/B & HDMI/B screw*3(M2.5*4)

52. Pull out KeyBoard FPC

53. Disassemble USB/B & HDMI/B

54. Pull out PCB Link FFC

55. For Hinge Assy :

56. Pul out Hinge screw mylar

57. Dis-fasten hinge screw*4(M2.5*8)

58. Disassemble Hinge cap

59. Dis-fasten screw*4(M2.0*4)

60. Disassemble Hinge sub assy

61. Dis-fasten screw*4(M2.0*4, L&R)

62. Disassemble Hinge bkt

63. Dis-fasten screw*3 on latch

64. Disassemble hinge Latch

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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