HP Compaq V4000 Series Instructions de montage
HP-00007-01, Appendix 3 13-Oct-2004
Page 1
Appendix 3 Product End-of-Life Disassembly instructions
Product Identification:
Marketing Name / Model Description
Compaq V4000 Series Notebook PC Notebook PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the
basic instructions for the disassembly of HP products to remove components and materials requiring
selective treatment.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in
the right column, as applicable.
Item Description Notes Quantity of
items included
in product.
Printed Circuit Boards (PCB) or Printed
Circuit Assemblies (PCA) With a surface greater than 10
square cm 3
Batteries All types including standard
alkaline and lithium coin or button
style batteries
2
Mercury containing components For example, mercury in lamps,
display backlights, scanner lamps,
switches, batteries
1
Liquid Crystal Displays (LCD) with a
surface greater than 100 square cm Includes background illuminated
displays with gas discharge lamps 1
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing
PCB / PCT)
Electrolytic Capacitors / Condensers
measuring greater than 2.5 cm in
diameter or height
0
External electrical cables and cords 0
Gas Discharge Lamps 0
Plastics containing Brominated Flame
Retardants Declaration limited to case
plastics only. 0
Components and parts containing toner
and ink, including liquids, semi-liquids
(gel/paste) and toner
Include the cartridges, print
heads, tubes, vent chambers, and
service stations.
0
Components and waste containing
asbestos 0
Components, parts and materials
containing refractory ceramic fibers 0
HP-00007-01, Appendix 3 13-Oct-2004
Page 2
Components, parts and materials
containing radioactive substances 0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a
point where components and materials requiring selective treatment can be removed.
Tool Description Tool Size (if applicable)
Screwdriver Type-Phillip #1
Screwdriver Type-Phillip #0
Screwdriver Type-T #8
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials
requiring selective treatment:
1 Remove 6 cell battery
2 Remove M2.5*6L screws on HDD door, then remove HDD and ODD module.
3 Remove M2.5*6L screws and M2*3L screws on lower case , then reverse it.
4 Remove middle cover assy., then remove M2*3L screws on upper case.
5 Remove keyboard and LCD assy.
6 Remove M2*12L screws and M2*3L screws on upper case.
7 Remove upper case assy.
8 Remove M2.5*6L screws, then remove MB.
9 Remove IO/R and lower case assy.
10 Divide MB from connecter and Remove RTC coin cell battery on MB for selective
treatment.
11 Remove six M2.5*6L screws, then remove LCD bezel
12 Remove two M2.5*5L screws, then remove daughter board and LCD module.
13 Remove four M2*2L screws on middle cover assy., then Remove launch board.
14 Disassemble LCD assembly and remove mercury bulb for selective treatment.
3.2 OPTIONAL: Depending upon the complexity of the disassembly process, a graphic
depicting the locations of items contained within the product which require selective
treatment (with descriptions and arrows identifying locations) can be inserted below:
HP-00007-01, Appendix 3 13-Oct-2004
Page 3
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