HP Chromebook x2 12 Instructions d'installation

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Notebooks and Tablet PCs

Marketing Name / Model

[List multiple models if applicable.]

HP Chromebook x2 12

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

M/B, Dock/B

Batteries

All types including standard alkaline and lithium

coin or button style batteries Main Battery

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps 12.3"

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Power cord

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

EL-MF877-00 Page 2

Template Revision B

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Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description #1 Screw Driver

Description #2 Screw Driver

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. separate the machine into two parts : slate and chassis

2. use jig to separate glass assy and cover assy

3. pull out touch control board , touch fpc , LVDS cable

4. remove battery screw*5 , pull out battery cable

5. remove mb support metal screw*3 , speaker L screw*2 , MB screw*1 , wi-lan card screw*1

6. pull out mb support metal , speaker L ,MB sub-assy,wi-lan module

7. remove antenna R/L screw*4 , antenna module,front camera,rear camera,rear mic fpc , front mic fpc

8. remove speaker R screw*2 , usb bkt screw*2 ,volume button , usb board ,usb fpc , usb bkt,speaker R

9. remove pogo-pin fpc screw*2,audio-jack fpc screw*1 , power btn,power board,audio-jack fpc,pogo-pin fpc

10. remove base rubber, base screw*4, base assy

11. remove tp support bkt screw*3 , tp holder screw*3 , tp support bkt , tp holder bkt, pull out tp ffc ,

12. remove hinge screw*4 , hinge cover, hinge bar,pull out pogo-pin cable

13. remove docking board screw*2 , pogo-pin board screw*1 , pogo-pin board ,docking board , pull out docking ffc

14. remove hinge bar mylar , hinge bar screw*6 , hinge bar up , hinge screw*4 , hinge R/L ,pogo-pin cable

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

3.21 Separate the machine into two parts : slate and chassis

3.22 Separate glass assy and cover assy

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3.23 Pull out touch control board , touch fpc , LVDS cable

3.24 Remove battery screw*5 , pull out battery cable

EL-MF877-00 Page 4

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3.25/26 Remove mb support metal screw*3 , speaker L screw*2 , MB screw*1 , wi-lan card screw*1 ,pull out mb

support metal , speaker L ,MB sub-assy,wi-lan module

3.27 remove antenna R/L screw*4 , antenna module,front camera,rear camera,rear mic fpc , front mic fpc

3.28 remove speaker R screw*2 , usb bkt screw*2 ,volume button , usb board ,usb fpc , usb bkt,speaker R

EL-MF877-00 Page 5

Template Revision B

PSG instructions for this template are available at EL-MF877-01

3.29 Remove pogo-pin fpc screw*2,audio-jack fpc screw*1 , power btn,power board,audio-jack fpc,pogo-pin fpc

3.30 remove base rubber, base screw*4, base assy

EL-MF877-00 Page 6

Template Revision B

PSG instructions for this template are available at EL-MF877-01

3.31 Remove tp support bkt screw*3 , tp holder screw*3 , tp support bkt , tp holder bkt, pull out tp ffc ,

3.32 Remove hinge screw*4 , hinge cover, hinge bar,pull out pogo-pin cable

3.33 Remove docking board screw*2 , pogo-pin board screw*1 , pogo-pin board ,docking board , pull out docking ffc

3.34 Remove hinge bar mylar , hinge bar screw*6 , hinge bar up , hinge screw*4 , hinge R/L ,pogo-pin cable

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