HP QL322A Instructions de montage

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Product End-of-Life Disassembly Instructions

Product Category: Storage Enclosures

Marketing Name / Model

[List multiple models if applicable.]

HP/3PAR Drive Chassis 16-Disk (QL322A)

HP/3PAR Drive Chassis 16-Disk (QL243A)

Name / Model #3

Name / Model #4

Name / Model #5

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

18 to 26

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

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Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Phillips Screwdriver

Screwdriver

Slotted

Description #3

plier

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. SBOD unit from the System

2. Remove the Power Supplies from Back Side

3. Remove the IO modules from the Back Side

4. Remove the Hard Drives from the Front Side

5. Remove the Control Panel from Back Side

6. Remove Center Plane from Chassis

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Disassembling SBOD Power Supplies (PS):

At the rear of the Drive chassis, grasp each latch between the thumb and forefinger of each hand. Squeeze thumb and forefinger

together to release the latch. Pull the latches forward to cam the module out of the enclosure. Grip the latch handles and withdraw the

module.

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Use the following diagram for power supply disassembly:

AC PSU:

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Item Material

A Sheet Metal

B Plastic

C Steel

D Polycarbonate

E ABS

Item Materials Hazards

Power Socket Polycarbonate, steel...

Switch Polycarbonate, steel...

Fan

Steeel, iron, plastic, PCB, copper

Lead

Large PCB Copper, aluminium alloy... Lead

Small PCB Copper, aluminium alloy... Lead

Remove Chassis cover screws.

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Disconnect Fan connectors.

Remove 4 screws from the small PCBA.

Cut the tie wraps and disconnect from large PCBA.

Disconnect from switch PCBA.

Remove Support Tray.

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Remove the large capacitor from the Small PCBA.

Remove the Connector PCBA

Remove standoffs and the large PCBA screws.

Remove the 4 caps from the main PCBA.

DC PSU:

Remove the power supply from the drive chassis using the same method as AC PSU:

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Use the same legend as AC PSU.

Disassembling SBOD IO Modules:

At the rear of the drive chassis, grasp each latch between

the thumb and forefinger of each hand. Squeeze thumb and

forefinger together to release the latch. Pull the latches

forward to cam the module out of the enclosure.

Grip the latch handles and withdraw the

module.

Item Material Hazards

Aluminium Alloy

Polycarbonate

PCB

Lead

All Screws, nuts and washers are zinc plated steel

Remove PCBA by removing the four screws from the bottom

of the IOM.

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Disassembling Hard Drive Modules:

Release the carrier handle by pressing

the latch in the handle towards the right

Withdraw the module from the drive bay.

To remove hard drive: remove the 2 screws from the rear PCBA (if present) and remove the 4 screws from the bottom.

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Item

Material

Hazards

Hard Disk Drive

B Aluminium alloy A380

C Plain spring steel

Zinc alloy 3

Polycarbonate

Beryllium copper 190 alloy XHM. ASTM B194 1996

Lead

H Silicon Grease

PCB

Lead

All Screws, nuts and washers are zinc plated steel

Disassembling Control Panel:

At the rear of the drive chassis, remove the two screws

shown and pull out the PCBA. Remove the four screws from the PCBA to bracket assy to

remove the PCBA.

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Item

Material Hazards

A Aluminium Alloy 380

B PCB Lead

C Polycarbonate

All Screws, nuts and washers are zinc plated steel

Disassembling Center Plane (aka Mid-Plane) PCBA:

Remove the EMI fingers from all of the drive bays.

Remove one drive wall screw from each drive wall from the top, and one screw from each drive wall the bottom.

Remove the three mid drive-walls.

Remove the midplane screws to remove the midplane.

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