HP T5720 - Compaq Thin Client Instructions d'installation
HP-00007-01, Appendix 3 15-Dec-2005
HP Restricted
Page 1
Appendix 3 Product End-of-Life Disassembly instructions
Product Identification:
Marketing Name / Model Description
HP Compaq t5720 t5720 (Windows XPe thin client)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the
basic instructions for the disassembly of HP products to remove components and materials requiring
selective treatment.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in
the right column, as applicable.
Item Description
Notes
Qty of items in
product.
Printed Circuit Boards (PCB) or Printed
Circuit Assemblies (PCA)
With a surface greater than 10
square cm
1
Batteries All types including standard
alkaline and lithium coin or button
style batteries
1 Alkaline
button style
battery
Mercury containing components For example, mercury in lamps,
display backlights, scanner lamps,
switches, batteries
Liquid Crystal Displays (LCD) with a
surface greater than 100 square cm
Includes background illuminated
displays with gas discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing
PCB / PCT)
Electrolytic Capacitors / Condensers
measuring greater than 2.5 cm in
diameter or height
1
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame
Retardants
Components and parts containing toner
and ink, including liquids, semi-liquids
(gel/paste) and toner
Include the cartridges, print
heads, tubes, vent chambers, and
service stations.
Components and waste containing
asbestos
Components, parts and materials
containing refractory ceramic fibers
Components, parts and materials
containing radioactive substances
HP-00007-01, Appendix 3 15-Dec-2005
HP Restricted
Page 2
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a
point where components and materials requiring selective treatment can be removed.
Tool Description Tool Size (if applicable)
Phillips Screwdriver
Diagonal cutters (dikes)
3.0 Product Disassembly Process
CMOS BATTERY
1 Remove the two screws that secure the cover to the chassis (see Figure 1 below).
2 Pull the chassis cover off the chassis.
3 Disconnect the speaker cable from the system board.
4 After locating the battery on the system board, pull back on the clip that holds the battery
in place, and then remove the battery (see Figure 2 below).
SYSTEM BOARD AND CAPACITOR
1 Remove the four screws that secure the system board to the chassis (see Figure 3 below).
2 Loosen the four screws that secure each heatsink (eight total heatsink screws)
(see Figure 3 below). You can either remove the heatsinks or leave them on the PCA.
3 Remove the two black screws, one on each side, near the back of the unit (see Figure 4
below). The screws hold the copper tubing in place. You can remove the copper tubing
now or when you remove the system board from the unit.
4 Lift up the rear of the PC, and then lift the PCA up and out of the chassis.
5 Using diagonal cutters, cut the one capacitor as shown in Figure 5 below.
4.0 Illustrations
FIGURE 1: Removing the chassis cover FIGURE 2: Removing the battery
HP-00007-01, Appendix 3 15-Dec-2005
HP Restricted
Page 3
FIGURE 3: System board screw locations FIGURE 4: Copper tubing screw locations
FIGURE 5: Cut capacitor
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