HP T5720 - Compaq Thin Client Instructions d'installation

HP-00007-01, Appendix 3 15-Dec-2005

HP Restricted

Page 1

Appendix 3 Product End-of-Life Disassembly instructions

Product Identification:

Marketing Name / Model Description

HP Compaq t5720 t5720 (Windows XPe thin client)

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the

basic instructions for the disassembly of HP products to remove components and materials requiring

selective treatment.

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in

the right column, as applicable.

Item Description

Notes

Qty of items in

product.

Printed Circuit Boards (PCB) or Printed

Circuit Assemblies (PCA)

With a surface greater than 10

square cm

Batteries All types including standard

alkaline and lithium coin or button

style batteries

1 Alkaline

button style

battery

Mercury containing components For example, mercury in lamps,

display backlights, scanner lamps,

switches, batteries

Liquid Crystal Displays (LCD) with a

surface greater than 100 square cm

Includes background illuminated

displays with gas discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing

PCB / PCT)

Electrolytic Capacitors / Condensers

measuring greater than 2.5 cm in

diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame

Retardants

Components and parts containing toner

and ink, including liquids, semi-liquids

(gel/paste) and toner

Include the cartridges, print

heads, tubes, vent chambers, and

service stations.

Components and waste containing

asbestos

Components, parts and materials

containing refractory ceramic fibers

Components, parts and materials

containing radioactive substances

HP-00007-01, Appendix 3 15-Dec-2005

HP Restricted

Page 2

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a

point where components and materials requiring selective treatment can be removed.

Tool Description Tool Size (if applicable)

Phillips Screwdriver

Diagonal cutters (dikes)

3.0 Product Disassembly Process

CMOS BATTERY

1 Remove the two screws that secure the cover to the chassis (see Figure 1 below).

2 Pull the chassis cover off the chassis.

3 Disconnect the speaker cable from the system board.

4 After locating the battery on the system board, pull back on the clip that holds the battery

in place, and then remove the battery (see Figure 2 below).

SYSTEM BOARD AND CAPACITOR

1 Remove the four screws that secure the system board to the chassis (see Figure 3 below).

2 Loosen the four screws that secure each heatsink (eight total heatsink screws)

(see Figure 3 below). You can either remove the heatsinks or leave them on the PCA.

3 Remove the two black screws, one on each side, near the back of the unit (see Figure 4

below). The screws hold the copper tubing in place. You can remove the copper tubing

now or when you remove the system board from the unit.

4 Lift up the rear of the PC, and then lift the PCA up and out of the chassis.

5 Using diagonal cutters, cut the one capacitor as shown in Figure 5 below.

4.0 Illustrations

FIGURE 1: Removing the chassis cover FIGURE 2: Removing the battery

HP-00007-01, Appendix 3 15-Dec-2005

HP Restricted

Page 3

FIGURE 3: System board screw locations FIGURE 4: Copper tubing screw locations

FIGURE 5: Cut capacitor

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