HP Stream 11 Pro G2 Instructions d'installation

EL-MF877-00

Template Revision C

Page 1

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP Desktop Pro A G2 MT

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU

directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).

NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking

code on the plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries, excluding Li-Ion batteries.

All types including standard alkaline, coin or button

style batteries

Li-Ion batteries. Include all Li-Ion batteries if more

than one is provided with the product (such as a

detachable notebook keyboard battery, RTC coin

cell, etc.)

Battery(ies) are attached to the product by (check all

that apply with an “x” inside the “[ ]”):

[ ] screws

[X] snaps

[ ] adhesive

[ ] other. Explain

NOTE: Add detailed removal procedures including

required tools in the sections 3.1 and 3.2.

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

PSU

External electrical cables and cords

DC Cable for External Power Supply

Gas Discharge Lamps

1.0 Items Requiring Selective Treatment

EL-MF877-00

Template Revision C

Page 2

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Item Description

Notes

Quantity

of items

included

in product

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Hexagon Screw Driver

T-15

Electric Iron

QUICK 310

Crisscross Screw Driver

PH1

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment

including the required steps to remove the external enclosure:

1. Remove access panel (Step1-2)

2. Disconnect ODD/ HDD power cable and ODD/ HDD SATA cable from ODD(Step3~Step4)

3. Remove ODD/ HDD from chassis (Step5~Step9)

4. Remove all cables and heat sink from MB (Step10~Step14)

5. Remove the Memory/ CPU/ WLAN/Battery from MB (Step15~Step19)

6. Remove MB from chassis (Step20-21)

7. Remove antenna from chassis(Step22)

8. PSU from chassis (Step23~Step25)

9. Separate PSU and remove the Electrolytic Capacitors (Step 26~Step30)

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifyinglocations).

EL-MF877-00

Template Revision C

Page 3

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Step1 Use T-15 screwdriver to Loose thumb screw and remove

access panel.

Step2 Remove front bezel from chassis

Step3 Disconnect ODD power cable and

ODD SATA cable from ODD.

Step4 Disconnect HDD power cable and

HDD SATA cable from HDD.

Step5 Use T-15 screwdriver to Loose screw

Step6 Press the ODD’s latch on ODD cage

EL-MF877-00

Template Revision C

Page 4

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Step7 Remove the ODD from ODD cage

Step8 Remove the driver cage from

Chassis

Step9 Use T-15 screwdriver to loose the

screws of HDD and remove HDD from HDD

cage

Step10 Remove the Fan duct from cooler

Step11 Disconnect Cooler Fan cable from MB

Step12 Loose the screws and remove cooler

EL-MF877-00

Template Revision C

Page 5

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Step13 Loose the screws and remove cooler fan

Step14 Disconnect all cables from MB.

Step15 Remove memory from the MB

Step16 Rotate the handle and open it up

Step17 Remove the CPU from the board

Step18 Remove the battery from MB

EL-MF877-00

Template Revision C

Page 6

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Step19 Remove WLAN M.2 Card

Step20 Loose the screws from MB and Remove MB from

chassis

Step21 Remove MB from chassis

Step22 Loose the screw of Rear Antenna and remove

Step23 Remove the screws of PSU from chassis

Step24 Press the PSU’s latch on chassis a

EL-MF877-00

Template Revision C

Page 7

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Step25 Remove the Power supply from chassis

Step26 Remove screw for bottom

Step27 Remove the screw and open case

Step28 Loose screws and remove PCB from case

Step29 Remove Ele-Cap from PCBA

Step30 Show Ele-Cap on PCBA (C1)

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