HP Pavilion 23 TouchSmart Instructions d'installation

EL-MF877-00 Page 1

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Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP Pavilion 23 TouchSmart All-in-One PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

MB, Webcam, converter board, Wlan card, DSP

board

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

power cord

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

EL-MF877-00 Page 2

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Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screw Driver

2# X10

Screw Driver

1# X10

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Please refer to the 3.2.2 disassemble rear cover

2. Please refer to the 3.2.3 disassemble the stand

3. Please refer to the 3.2.4 disassemble MB Shielding

4. Please refer to the 3.2.5 disassemble HDD & ODD

5. Please refer to the 3.2.6 disassemble Speaker

6. Please refer to the 3.2.7 disassemble CPU thermal module

7. Please refer to the 3.2.8 disassemble FAN Module

8. Please refer to the 3.2.9 disassemble converter board

9. Please refer to the 3.2.10 disassemble Webcam

10. Please refer to the 3.2.11 disassemble Wireless card

11. Please refer to the 3.2.12 disassemble the cables connected to MB and Base pan

12. Please refer to the 3.2.13 disassemble MB and MB battery

13. Please refer to the 3.2.14 disassemble CPU and DDR

14. Please refer to the 3.2.15 separate Base pan and front bezel and panel

15. Please refer to the 3.2.16 remove Mouse/Keyboard Battery/MB

16. Please refer to the 3.2.17 remove power supply

17.

18.

19.

20.

21.

22.

23.

24.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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1, Place the system

2. Disassemble rear cover

Remove 3pcs screws with circle in yellow.

3. Disassemble stand

Remove 4pcs screws on both left and right so you can remove stand.

EL-MF877-00 Page 4

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4. Disassemble MB shielding

Remove 3pcs screws with circles in yellow for Alloy.

5. Disassemble HDD & ODD

Remove 1pcs screw from HDD and pull backward to disengage the HDD from base pan.

Remove 1pcs screw and push ODD forward to slide from ODD cage.

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6. Disassemble speaker

Remove 4pcs screws from left and right,

Also remove the speaker cable in order to take out two speakers from system.

7, Disassemble FAN Module

Remove 3pcs screws and remove the cable to disassemble the fan.

8, Disassemble converter board

Remove two cables and 2pcs screws to remove the converter board.

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9, Disassemble Webcam

Remove the cable and screw in order to disengage the webcam module and mechanical parts.

10, Disassemble Wireless card

Remove one or two cables and 1pcs screw in order to remove wireless card.

11, Disassemble the cables connected to MB and Base pan.

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(1), Remove the HDD /ODD cable

Remove the cable with circles in red and remove 4pcs screws with circles in yellow.

Unplug the SATA cable on MB connector.

(2) Remove converter cable/LVDS cable/TS USB cable connected to MB and take away converter cable/TS USB

cable

-Converter cable

-LVDS cable

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-TS USB cable

(3), Remove antenna cable on the Base pan and take away the cable.

(4)Remove TS USB cable connected to DSP board.

EL-MF877-00 Page 9

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12. Disassemble DSP board

(1) Remove FFC cable*3 as below yellow.

(2) Remove 3pcs screws with circles in yellow.

13. Disassemble MB and MB battery

Remove 9pcs screws to disassemble Alloy MB

Pull backward the clip to release the battery

EL-MF877-00 Page 10

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14, Disassemble DDR

Pull both clicks outward that holding the memory to remove the DDR.

15, Separate Base pan and front bezel and panel

Remove 16 pcs screws with circles in red and 4pcs screws with circles in yellow to separate base pan and front bezel.

[BOE/LG/Samsung panel]

16.Remove backlight cable/LVDS cable/FFC cable and LCD bracket.

-backlight cable

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