HP EliteDesk 800 G3 Instructions d'installation

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Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP EliteDesk 800 G3 Small Form Factor Business PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

Chicony EPA85 HV

External electrical cables and cords

Power cord

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

Include the cartridges, print heads, tubes, vent

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including liquids, semi-liquids (gel/paste) and toner

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screwdriver

T-15

Micro shear

170II

Screwdriver

PH1

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Slide the latch and remove access panel.(see Figure 1-2 below)

2. Rotate the driver cage form the hook on slide rail.(see Figure 3 below)

3. Disconnect power cable from the MB.(see Figure 4 below)

4. Disconnect SATA cables from the MB.(see Figure 5 below)

5. Disconnect speaker cable from the MB.(see Figure 6 below)

6. Disconnect other PSU cables from the MB.(see Figure 7-8 below)

7. Remove the fan duct (see Figure 9-10 below)

8. Disconnect P3 cable from MB.(see Figure 11 below)

9. Remove HDD/ODD from chassis.(see Figure 12-19 below)

10. Remove the heatsink from MB.(see Figure 20-21 below)

11. Separate the fan from CPU heatsink.（see Figure 22 below）

12. Remove the memory card from the MB.(see Figure 23 below)

13. Remove the CPU from the MB.(see Figure 24-25 below)

14. Remove M/B from chassis .(see Figure 26-27 below)

15. Remove the battery from MB.(see Figure 28 below)

16. Remove LED holder from MB.(see Figure 29 below)

17. Remove front panel from chassis.(see Figure 30 below)

18. Remove Speaker from chassis.(see Figure 31 below)

19. Unscrew the PSU and disconnect all PSU cables from chassis.(see Figure 32-35 below)

20. Remove PSU cover and remove the Electrolytic Capacitors.(see Figure 36-41 below)

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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Figure 1Slide the latch and remove access panel

Figure 2 Remove the access panel

Figure 3 Rotate the driver cage from the hook

Figure 4 Disconnect Power SATA cable from MB

Figure 5 Disconnect All SATA cables from MB

Figure 6 Disconnect Speaker cable from MB

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Figure 7 Disconnect P1 power cable from the MB

Figure 8 Disconnect P2 power cable from MB

Figure 9 press the hook and pull up the fan duct

Figure 10 Remove the fan duct

Figure 11 Disconnect P3 Power cable from MB

Figure 12 Pull the HDD latch and rotate the HDD up

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Figure 13 Disconnect power cable from HDD

Figure 14 Disconnect SATA cable from HDD

Figure 15 Remove the HDD from HDD cage

Figure 16 Disconnect power cable from ODD

Figure 17 Disconnect SATA cable from ODD

Figure 18 Press the ODD latch and remove it

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Figure 19 Remove ODD from ODD cage

Figure 20 Disconnect CPU fan cable from MB

Figure 21 Use T15 screwdriver to unscrew the screw and

remove the heatsink

Figure 22 Use PH1 screwdriver to break up the heatsink

into fan and cooler

Figure 23 Remove memory from MB

Figure 24 Rotate the handle and pull it up

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Figure 25 Remove CPU from the socket

Figure 26 Use T15 screwdriver to remove all MB screws

from MB

Figure 27 Remove MB from chassis

Step 28. Remove battery from MB

Step 29 Remove LED cover from MB

Step 30 Remove the front bezel

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Step 31 Use T15 screwdriver remove speaker from the

front wall

Step 32 Use T15 screwdriver to remove the PSU screws

from rear wall

Step 33 Remove all the power cables from the hook

Step 34 Press the latch and slide the PSU out

Step 35 Remove the PSU from chassis

Figure 36 Use Micro shear 170II to cut the cable tie

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Figure 37 Use PH1 screwdriver to de-screw from the

external cover top

Figure 38 Use PH1 screwdriver to de-screw from the

external cover bottom

Figure 39 Removed out the side cover

Step 40 Use PH1 screwdriver to de-screw from the PCBA

its bottom side four corners

Step 41 Remove the bigger electrolyte capacitor “C1”

Step 42 Remove the main PCB

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PSG instructions for this template are available at EL-MF877-01

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