HP 288 Pro G2 Instructions d'installation

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Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP 288 Pro G2 Microtower Business PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sqcm

MB, Memory,HDD PCA,ODD PCA,PSU PCA

Batteries

All types including standard alkaline and lithium coin

or button style batteriesMB

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

PSU

External electrical cables and cords

Power cord

Gas Discharge Lamps

Plastics containing Brominated Flame

Retardantsweighing > 25 grams (not including

PCBs or PCAs already listed as a separate item

above)

system fan, Cooler fan,PSU fan

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

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refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description #1crisscross screw driver

Description #2 hexagon screw driver

T15

Description #3 electric iron

QUICK 310

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove access panel from the unit.

2. Remove front panel from the unit.

3. Remove all the cable from the unit.

4. Remove HDD from the unit.

5. Remove ODD from the unit.

6. Take off PSU from the unit.

7. Take off the system fan from the unit.

8. Take off Card Reader from the unit.

9. Take off FIO from the unit.

10. Take off Memory from the unit.

11. Take off CPU cooler from the unit.

12. Take off PCA from the unit.

13. Take off battery from the unit.

14. Open the PSU.

15. Take off PSU fan.

16. Take off PCA from the PSU.

17. Take off CAP using electric iron.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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1. Remove access panel

from the unit.

Release screw on the access

panel. Griping the tab at the

end of access panel, pull

towards the rear and remove it

from unit.

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2. Remove front panel

from the unit.

Release 3 bezellatches

from chassis by pulling the

bezellatches outwards.

3.Remove all the cable

from the unit.

4.Remove HDD from the

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unit.

5. Remove ODD from the

unit.

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6.Take off PSU from the

unit.

Rotate the screw driver to

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release PSU from the unit.

7.Take off the system fan

from the unit

Rotate screw driver to

loose screw and take off the

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system fan.

8. Take off Card Reader

from the unit.

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9. Take off FIO from the

unit.

10.Take off Memory from

the unit.

Release memory socket

levers by pulling outward.

11. Take off CPU cooler

from the unit.

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Rotate the screw driver to

release CPU cooler from the

unit.

12.Take off PCA from the

unit.

Rotate screw driver to

loose PCA from the unit.

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