High-Flying MYK2011_100 Manuel utilisateur

MYK2011_100 Low Power Wi-Fi Module User Manual

Shanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) - 1 -

MYK2011_100

Low Power Wi-Fi Module User Manual

V 1.9

Overview of Characteristic

Support IEEE802.11b/g/n Wireless Standards

Based on Self-developed High Cost Effective MCU

Ultra-Low-Power for Battery Applications with Excellent Power Save Scheme

Support UART/SPI/PWM/GPIO Data Communication Interface

Support Work As STA/AP/AP+STA Mode

Support Smart Link Function (APP program provide)

Support Wireless and Remote Firmware Upgrade Function

Support WPS Function

Support Multi-TCP Link (5 Channel) Apllication

Support External(I-PEX) Antenna Option

Single +3.3V Power Supply

Smallest Size: 23.1mm x 32.8mm x (3.45±0.3)mm

FCC/CE/TELEC Certificated

MYK2011_100 Low Power Wi-Fi Module User Manual

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TABLE OF CONTENTS

LIST OF FIGURES...................................................................................................................................3

LIST OF TABLES ....................................................................................................................................4

1. PRODUCT OVERVIEW ................................................................................................................5

1.1. General Description.................................................................................................................5

1.1.1 Device Features..................................................................................................................5

1.1.2 Device Paremeters .............................................................................................................6

1.1.3 Key Application ...................................................................................................................6

1.2. Hardware Introduction.............................................................................................................7

1.2.1. Pins Definition.....................................................................................................................7

1.2.2. Electrical Characteristics ....................................................................................................9

1.2.3. Mechanical Size................................................................................................................11

1.2.4. External Antenna ..............................................................................................................11

2. PACKAGE INFORMATION ........................................................................................................13

2.1. Recommended Reflow Profile ..............................................................................................13

2.2. Device Handling Instruction (Module IC SMT Preparation)...............................................13

2.3. Shipping Information.............................................................................................................13

3. OEM/INTEGRATORS INSTALLATION MANUAL ..................................................................15

MYK2011_100 Low Power Wi-Fi Module User Manual

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LIST OF FIGURES

Figure 1. MYK2011_100 View...............................................................................................................7

Figure 2. MYK2011_100 Pins Map........................................................................................................7

Figure 3. MYK2011_100 Mechanical Dimension ................................................................................11

Figure 4. MYK2011_100 PCB Symbol Size ........................................................................................11

Figure 5. Reflow Soldering Profile .......................................................................................................13

Figure 6. Shipping Information ............................................................................................................14

MYK2011_100 Low Power Wi-Fi Module User Manual

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LIST OF TABLES

Table 1 MYK2011_100 Module Technical Specifications.....................................................................6

Table 2 MYK2011_100 Pins Definition..................................................................................................7

Table 3 MYK2011_100 External Antenna Parameters .......................................................................12

Table 11 Reflow Soldering Parameter .................................................................................................13

MYK2011_100 Low Power Wi-Fi Module User Manual

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1. PRODUCT OVERVIEW

1.1. General Description

TheMYK2011_100 is a fully self-contained small form-factor, single stream, 802.11b/g/n Wi-Fi module,

which provide a wireless interface to any equipment with a Serial/SPI interface for data

transfer.MYK2011_100 integrate MAC, baseband processor, RF transceiver with power amplifier in

hardware and all Wi-Fi protocol and configuration functionality and networking stack, in embedded

firmware to make a fully self-contained 802.11b/g/n Wi-Fi solution for a variety of applications.

TheMYK2011_100 employs the world's lowest power consumption embedded architecture. It has

been optimized for all kinds of client applications in the home automation, smart grid, handheld device,

personal medical application and industrial control that have lower data rates, and transmit or receive

data on an infrequent basis.

TheMYK2011_100 integrates all Wi-Fi functionality into a low-profile, 23.1x32.8x 2.7mm SMT module

package that can be easily mounted on main PCB with application specific circuits. Also, module

provides built-in antenna, external antenna option.

1.1.1 Device Features

Single stream Wi-Fi @ 2.4 GHz with support for WEP security mode as well as WPA/WPA2

Based on Self-developed High Cost Performance MCU

Ultra-low-power operation with all kinds of power-save modes.

Includes all the protocol and configuration functions for Wi-Fi connectivity.

Support STA/AP/AP+STA Mode

Support Smart Link Function

Support Wireless and Remote Firmware Upgrade Function

Support Max 8 Channel PWM/GPIO Output

Integrated pcb antenna, antenna connector options.

Compact surface mount module 23.1mm x 32.8mm x (3.45±0.3)mm.

Full IPv4 stack.

Low power RTOS and drivers.

CE/FCC/TELEC Certified.

RoHS compliant.

Single supply –3.3V operation.

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1.1.2 Device Paremeters

Table 1 MYK2011_100 Module Technical Specifications

Class

Item

Parameters

Wireless

Parameters

Certification

TBD

Wireless standard

802.11 b/g/n

Frequency range

2.412GHz-2.462GHz

Transmit Power

802.11b: +16 +/-2dBm (@11Mbps)

802.11g: +14 +/-2dBm (@54Mbps)

802.11n: +13 +/-2dBm (@HT20 , MCS7)

802.11n: +13 +/-2dBm (@HT40 , MCS7)

Receiver Sensitivity

802.11b: -93 dBm (@11Mbps ,CCK)

802.11g: -85 dBm (@54Mbps, OFDM)

802.11n: -82 dBm (@HT20, MCS7)

802.11n: -82 dBm (@HT40, MCS7)

Antenna Option

External:I-PEX Connector

Hardware

Parameters

Data Interface

UART

SPI, PWM, GPIO

Operating Voltage

2.8~3.6V

Operating Current

Peak [Continuous TX]: ~300mA

Normal [WiFi ON/OFF, DTIM=100ms]:

Average. ~12mA, Peak: 300mA

Operating Temp.

-40℃- 85℃

Storage Temp.

-45℃- 125℃

Dimensions and Size

23.1mm×32.8mm×(3.45±0.3)mm

Software

Parameters

Network Type

STA /AP/STA+AP

Security Mechanisms

WEP/WPA-PSK/WPA2-PSK

Encryption

WEP64/WEP128/TKIP/AES

Update Firmware

Local Wireless, Remote

Customization

Web Page Upgrade

Support SDK for application develop

Network Protocol

IPv4, TCP/UDP/HTTP

User Configuration

AT+instruction set. Android/ iOS

Smart Link APP tools

1.1.3 Key Application

Remote equipment monitoring

Asset tracking and telemetry

Security

Industrial sensors and controls

Home automation

Medical devices

MYK2011_100 Low Power Wi-Fi Module User Manual

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1.2. Hardware Introduction

Figure 1. MYK2011_100 View

1.2.1. Pins Definition

Figure 2. MYK2011_100 Pins Map

Table 2 MYK2011_100 Pins Definition

Describtion

Net Name

Signal

Type

Comments

1,17,32,48

Ground

GND

Power

Debug Pin

SWCLK

I, PD

Debug functional pin,

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Describtion

Net Name

Signal

Type

Comments

No connect if not use.

Debug Pin

SWD

I/O,PU

N.C

No connect

GPIO/AD

Sleep_RQ

I.PU

GPIO7, No connect if not use.

GPIO/AD

Sleep_ON

GPIO8, No connect if not use.

+3.3V Power

DVDD

Power

N.C

No connect

PWM/GPIO/AD

PWM_1

I/O

GPIO11, No connect if not use.

PWM/GPIO/AD

PWM_2

I/O

GPIO12, No connect if not use.

GPIO

GPIO13

I/O

GPIO13, No connect if not use.

N.C

No connect

WPS/GPIO

GPIO15

I/O

GPIO15, WPS Function Pin.

N.C

No connect

PWM/GPIO

PWM_3

I/O

GPIO18, No connect if not use.

N.C

No connect

PWM/GPIO

PWM_4

I/O

GPIO20, No connect if not use.

N.C

No connect

N.C

No connect

PWM/GPIO/AD

PWM_5

I/O

GPIO23, No connect if not use.

N.C

No connect

Power Control Switch

PWR_SW

I,PU

Leave it no connect

N.C

No connect

SPI Interface/AD/PWM

SPI_MISO

GPIO27, No connect if not use.

SPI Interface/PWM

SPI_CLK

I/O

GPIO28, No connect if not use.

SPI Interface/AD

SPI_CS

I/O

GPIO29, No connect if not use.

SPI Interface/PWM

SPI_MOSI

GPIO30, No connect if not use.

+3.3V Power

DVDD

Power

N.C

No connect

+3.3 Power

DVDD

Power

N.C

No connect

N.C

No connect

N.C

No connect

N.C

No connect

UART0

UART0_TX

GPIO39, No connect if not use.

UART0

UART0_RTS

I/O

GPIO40, No connect if not use.

UART0

UART0_RX

GPIO41, No connect if not use.

UART0

UART0_CTS

I/O

GPIO42, No connect if not use.

Wi-Fi Status

nLink

Detailed functions see

<Notes>

Module Boot Up

Indicator

nReady

“0” – Boot-up OK;

“1” – Boot-up No OK;

MYK2011_100 Low Power Wi-Fi Module User Manual

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Describtion

Net Name

Signal

Type

Comments

No connect if not use.;

Multi-Function

nReload

I,PU

Detailed functions see

<Notes>

N.C

No connect

Module Reset

EXT_RESETn

I,PU

“Low” effective reset input.

<Notes>

nReload Pin (Button) function：

1. When this pin is set to “low” during module boot up, the module will enter wireless

firmware and config upgrade mode. This mode is used for customer manufacture.

(See Appendix D to download software tools for customer batch configuration and

upgrade firmware during mass production)

2. After module is powered up, short press this button ( “Low” < = 2s ) to make the

module go into “Smart Link “ config mode, waiting for APP to set password and

other information. (See Appendix D to download SmartLink APP)

3. After module is powered up, long press this button ( “Low” >= 4s ) to make the

module recover to factory setting.

High-Flying strongly suggest customer fan out this pin to connector or button for

“Manufacture” and “ Smart Link” application.

nLink Pin (LED) function：

1. At wireless firmware and config upgrade mode , this LED used to indicate configure

and upgrade status.

2. At “Smart Link “ config mode, this LED used to indicate APP to finish setting.

3. At normal mode, it’s Wi-Fi link status indicator

High-Flying strongly suggest customer fan out this pin to LED.

1.2.2. Electrical Characteristics

Absolute Maximum Ratings:

Parameter

Condition

Min.

Typ.

Max.

Unit

Storage temperature range

-45

125

°C

Maximum soldering temperature

IPC/JEDEC J-STD-020

260

° C

Supply voltage

3.8

Voltage on any I/O pin

3.3

ESD (Human Body Model HBM)

TAMB=25°C

ESD (Charged Device Model, CDM)

TAMB=25°C

Power Supply & Power Consumption:

Parameter

Condition

Min.

Typ.

Max.

Unit

Operating Supply voltage

2.8

3.3

3.8

Supply current, peak

Continuous Tx

300

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Supply current, IEEE PS

DTIM=100ms

Output high voltage

Sourcing 6mA

2.8

Output low voltage

Sinking 6mA

0.2

Input high voltage

2.2

Input low voltage

0.8

GPIO Input pull-up resistor

200

kΩ

GPIO Input pull-down resistor

200

kΩ

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