Haier HS-2190 Manuel utilisateur

HS- 2190

COLOUR TELEVISION

Service Manual

Haier group

1. Technical specifications &

Safety precautions.....................................

2. Servicing precautions................................

3. Functions & Location of controls...............

4. Brief operation instructions........................

5. Disassembly instructions...........................

6. Specific information..................................

7. Electrical adjustment..................................

8. Information of Resistors and capacitors.....

9. Damageable parts list................................

10Appendix......................................................

Features

Contents

1Technical specifications & Safety precautions …… ……..….2

2Servicing precautions…………………………………….……….4

3Functions & Location of controls …………………………..…. 10

4Brief operation instructions………………………………… …. 14

5Disassembly instructions………………………………………...15

A. Important notes………………………………………......15

B. Precautions for handling of picture tube…… ……....15

C. Exploded of cabinet parts………… ………………..….16

6Specific informations……………………………………………...17

A. Principle integrated circuits…………………………….17

B. Service mode and adjusting items and datas…….....27

C. Error detection process…………………………………32

7Electrical adjustment………………………………………..….....37

8Information of Resistors and capacitors……………………....39

Terminal view of transistors……………………………….…....40

9Damageable parts list

Replacement parts list…..……………………………….…….…41

10 Appendix…………………………………………..………………....42

A.Circuitblockdiagram

B.Circuitdiagrams

1. TECHNICAL SPECIFICATION & SAFETY

PRECAUTIONS

POWER SUPPLY: AC 160~250V, 50/60Hz

 Tuning system: voltage synthesized type auto-search fine tuning system

 PIF: 38.9MHz

 Soud output: 3W

 Power consumption: 70W

 Antenna input impedance: 75Ω

 Receiving system:

a) Color system: PAL SECAM AV: NTSC3.58MHz/4.43MHz

b) Broadcast TV system: B/G D/K

 Language displayed: English /Arabic

 Video input: 1.0VP-P (75Ω)

 Video output: 1.0VP-P (75Ω)

 Audio input: 436m Vrms (40KΩ)

 Audio output: 436m Vrms (more than 600KΩ)

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

These parts are identified by many electrical and mechanical parts in this chassis

have special safety-related characteristics. ! in the Schematic Diagram and

Replacement Parts List.

It is essential that these special safety parts should be replaced with the same

components as recommended in this manual to prevent X-RADIATION, Shock, Fire,

or other Hazards.

Do not modify the original design without permission of the manufacturer.

General Guidance

An Isolation Transformer should always be used during the servicing of a receiver

whose chassis is not isolated from the AC power line. Use a transformer of adequate

power rating as this protects the technician from accidents that might result in

personal injury caused by electrical shocks.

It will also protect the receiver and it’s components from being damaged by

accidental shorts of the circuitry that might be inadvertently introduced during the

service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with a

specified one.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep

the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Due to the high vacuum and large surface area of the picture tube, extreme care

should be taken in handling the Picture Tube. Do not lift the Picture Tube by its Neck.

X-RAY Radiation

Warning:

The source of X-RAY RADIATION in this TV receiver is the High Voltage Section and

the Picture Tube.

For continued X-RAY RADIATION protection, the replacement tube must be of the

same type as specified in the Replacement Parts List.

Before returning the receiver to the customer,

Always perform an AC leakage current check on the exposed metallic parts of the

cabinet, such as antennas, terminals, etc., to make sure that the set is safe to

operate without any danger of electrical shock.

2. SERVICING PRECAUTIONS

Warning and Cautions

Explanation on the display tube

1. When you clean the TV set, please pull

out the power plug from AC outlet. Don't

clean the cabinet and the screen with

benzene, petrol and other chemicals.

4. To prevent the TV set from firing and

electric shock, don't

make the TV set rain

or moisture.

In order to prolong the using life of the

TV set, please place it on a ventilated

place.

5. Don't open the back cover, otherwise it is

possible to damage the components in the

TV set and harm you.

Don't place the

TV set in the

sunshine or near

heat source.

6. When the TV set isn't going to be used

for long time or it is in thunder and

lightening, please pull out the plug from AC

outlet and the antenna plug from the cover

of the TV set.

Generally, it is not needed to clean the tube surface. However, if necessary, its

surface can be cleaned with a dry cotton cloth after cutting off the power. Don’t use

any cleanser. If using hard cloth, the tube surface will be damaged.

CAUTION: Before servicing receivers covered by this service manual and its

supplements and addenda, read and follow the SAFETY PRECAUTIONS.

NOTE: If unforeseen circumstances create conflict between the following servicing

precautions and any of the safety precautions, always follow the safety precautions.

Remember : Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before:

a. Removing or reinstalling any component, circuit board module or any other

assembly of the receiver.

b. Disconnecting or reconnecting any receiver electrical plug or other electrical

connection.

c. Connecting a test substitute in parallel with an electrolytic capacitor in the

receiver.

CAUTION: A wrong substitution part or incorrect installation polarity of

electrolytic capacitors may result in an explosion hazard.

d. Discharging the picture tube anode.

2. Test high voltage only by measuring it with an appropriate high voltage meter or

other voltage-measuring device (DVM, FETVOM, etc.) equipped with a suitable

high voltage probe. Do not test high voltage by “drawing an arc”.

3. Discharge the picture tube anode only by (a) first connecting one end of an

insulated clip lead to the degaussing or kine aquadag grounding system shield at

the point where the picture tube socket ground lead is connected, and then (b)

touch the other end of the insulated clip lead to the picture tube anode button,

using an insulating handle to avoid personal contact with high voltage.

4. Do not spray chemicals on or near this receiver or any of its assemblies.

5. Unless specified otherwise in this service manual, clean electrical contacts only

by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped

stick or comparable nonabrasive applicator; 10% (by volume) Acetone and 90%

(by volume) isopropyl alcohol (90%-99% strength)

CAUTION: This is a flammable mixture.

Unless specified otherwise in this service manual, lubrication of contacts is not

required.

6. Do not defeat any plug / socket B+ voltage interlocks with which receivers

covered by this service manual might be equipped.

7. Do not apply AC power to this instrument and/or any of its electrical assemblies

unless all solid-state device heat sinks are correctly installed.

8. Always connect the test receiver ground lead to the receiver chassis ground

before connecting the test receiver positive lead.

Always remove the test receiver ground lead last.

9. Use with this receiver only the test fixtures specified in this service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this

receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity.

Such components are usually called Electrostatically Sensitive (ES) Devices.

Examples of typical ES devices are integrated circuits and some field effect

transistors and semiconductor “chip” components. The following techniques should

be used to help reduce the incidence of component damage caused by static

electricity.

1. Immediately before handling any semiconductor component or semiconductor-

equipped assembly, drain off any electrostatic charge on your body by touching a

known earth ground. Alternatively, obtain and wear a commercially available

discharging wrist strap device, which should be removed to prevent potential

shock prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the

assembly on a conductive surface such as aluminum foil, to prevent electrostatic

charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type folder removal device. Some solder removal devices

not classified as “anti-static” can generate electrical charges sufficient to damage

ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges

sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until

immediately before you are ready to install it. (Most replacement ES devices are

packaged with leads electrically shorted together by conductive foam, aluminum

foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a

replacement ES device, touch the protective material to the chassis or circuit

assembly into which the device will be installed.

CAUTION: Be sure no power is applied to the chassis or circuit, and observe all

other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices.

(Otherwise even some normally harmless motions such as mutual brushing of

your clothes’ fabric or lifting of your foot from a carpeted floor might generate

static electricity sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and

shape that will maintain tip temperature within the range of 500 oF to 600 oF.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40

parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire bristle (0.5 inch, or

1.25cm) brush with a metal handle. Do not use freon-propelled spay-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.(500 o F to 600o F)

b. Heating the component lead until the solder melts.

c. Quickly draw the melted solder with an anti-static, suction-type solder removal

device with solder braid.

CAUTION: Work quickly to avoid overheating the circuit board printed foil.

6. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.(500 o F to 600o F )

b. First, hold the soldering iron tip and solder the strand against the component

lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the component lead and

the printed circuit foil, and hold it there only until the solder flows onto and

around both the component lead and the foil.

CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or splashed solder

with a small wire-bristle brush.

Remove /Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC

leads are inserted and then bent flat against the circuit foil. When holes are of slotted

type, the following technique should be used to remove and replace the IC. When

working with boards using the familiar round hole, use the standard technique as

outlined .

Removal

Desolder and straighten each IC lead in one operation by gently prying up on the

lead with the soldering iron tip as the solder melts.

Draw away the melted solder with an anti-static suction-type solder removal device

(or with solder braid) before removing the IC.

Replacement

Carefully insert the replacement IC in the circuit board.

Carefully bend each IC lead against the circuit foil pad and solder it.

Clean the soldered areas with a small wire-bristle brush.(It is not necessary to

reapply acrylic coating to the areas).

“Small-Signal” Discrete Transistor

Removal/Replacement

Remove the defective transistor by clipping its leads as close as possible to the

component body.

Bend into a “U” shape the end of each of three leads remaining on the circuit board.

Bend into a “U” shape the replacement transistor leads.

Connect the replacement transistor leads to the corresponding leads extending from

the circuit board and crimp the “U” with long nose pliers to insure metal to metal

contact then solder each connection.

Power Output, Transistor Device

Removal/Replacement

Heat and remove all solder from around the transistor leads.

Remove the heat sink mounting screw (if so equipped).

Carefully remove the transistor from the heat sink of the circuit board.

Insert new transistor in the circuit board.

Solder each transistor lead, and clip off excess lead.

Replace heat sink.

Diode Removal/Replacement

Remove defective diode by clipping its leads as close as possible to diode body.

Bend the two remaining leads perpendicularly to the circuit board.

Observing diode polarity, wrap each lead of the new diode round the corresponding

lead on the circuit board.

Securely crimp each connection and solder it.

Inspect (on the circuit board copper side) the solder joints of the two “original” leads.

If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor

Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections

CAUTION: Maintain original spacing between the replaced component and

adjacent components and the circuit board to prevent excessive component

temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds

foil to the circuit board causing the foil to separate from or “lift-off” the board. The following guidelines

and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to

install a jumper wire on the copper pattern side of the circuit board.(Use this

technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only

as much copper as absolutely necessary).

2. Carefully scratch away the solder resist and acrylic coating (if used) from the end

of the remaining copper pattern.

3. Bend a small “U” in one end of a small gauge jumper wire and carefully crimp it

around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it

overlap the previously scraped end of the good copper pattern. Solder the

overlapped area and clip off any excess jumper wire.

At other connections

Use the following technique to repair the defective copper pattern at connections

other than IC Pins. This technique involves the installation of a jumper wire on the

component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to insure that a hazardous condition will not

exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate

the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component

on one side of the pattern break to the lead of the nearest component on the

other side.

Carefully crimp and solder the connections.

CAUTION: Be sure the insulated jumper wire is dressed so that it does not touch

components or sharp edges.

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