Ebyte E72-2G4M05S1F Manuel utilisateur

E72-2G4M05S1F

CC2652RB Multifunctional SoC Wireless Module

Chengdu Ebyte Electronic Technology Co.,Ltd. E72-2G4M05S1F User Manual

Contents

Disclaimer.............................................................................................................................................................2

1 Introduction........................................................................................................................................................3

1.1 Brief Introduction.................................................................................................................................... 3

1.2 Features....................................................................................................................................................3

2 Specification and parameter...............................................................................................................................4

2.1 Limit parameter....................................................................................................................................... 4

2.2 Operating parameter................................................................................................................................ 4

3 Size and pin definition....................................................................................................................................... 5

4 Development......................................................................................................................................................7

5 Basic operation.................................................................................................................................................. 7

5.1 Hardware design......................................................................................................................................7

5.2 Programming........................................................................................................................................... 8

6 FAQ....................................................................................................................................................................8

6.1 Communication range is too short...........................................................................................................8

6.2 Module is easy to damage....................................................................................................................... 9

6.3 BER(Bit Error Rate) is high.................................................................................................................... 9

7 Production guidance.......................................................................................................................................... 9

7.1 Reflow soldering temperature................................................................................................................. 9

7.2 Reflow soldering curve..........................................................................................................................10

8 E72 series.........................................................................................................................................................10

9 Antenna recommendation................................................................................................................................ 11

9.1 Recommendation...................................................................................................................................11

10 Bulk packing..................................................................................................................................................12

Revision history.................................................................................................................................................. 12

About us..............................................................................................................................................................12

Chengdu Ebyte Electronic Technology Co.,Ltd. E72-2G4M05S1F User Manual

Disclaimer

EBYTE reserves all rights to this document and the information contained herein.

Products, names, logos and designs described herein may in whole or in part be

subject to intellectual property rights. Reproduction, use, modification or disclosure to

third parties of this document or any part thereof without the express permission of

EBYTE is strictly prohibited.

The information contained herein is provided “as is” and EBYTE assumes no

liability for the use of the information. No warranty, either express or implied, is given,

including but not limited, with respect to the accuracy, correctness, reliability and

fitness for a particular purpose of the information. This document may be revised by

EBYTE at any time. For most recent documents, visit www.ebyte.com.

Chengdu Ebyte Electronic Technology Co.,Ltd. E72-2G4M05S1F User Manual

1 Introduction

1.1 Brief Introduction

E72-2G4M05S1F is a self-developed, multi-protocol, 2.4G, SMD, wireless SoC

module based on CC2652RB from TI. The transmit power is 5dBm. Built-in ARM

microcontroller and high-performance wireless transceiver. With an integrated BAW

(Bulk Acoustic Wave) resonator to generate a radio frequency carrier, so no external

48MHz crystal is required.

The module leads out all IO ports of the MCU. Comes with a powerful

48 MHz Arm ® Cortex ® -M4F processor, an internal integrated power amplifier,

powerful peripherals and up to 26 GPIOs, enabling multi-directional development.CC2652RB has the potential to

become the best choice of wireless microcontroller for smart home, IoT transformation, and industrial automation in the

future.

Since this module is a SoC module, it needs to be programmed by user before it can be used.

1.2 Features

Powerful 48 MHz Arm ® Cortex ® -M4F processor processor;

Rich resources, 352KB FLASH, 80KB RAM;

1.8-3.8V power supply, over 3.3 V can guarantee the best performance;

Transmit power 5dBm;

Under ideal conditions, the communication distance can reach 350m with the external antenna;

Module contains an external 32.768K low speed crystal oscillator;

Industrial grade standard design, support -40 ~ 85 °C for working over a long time;

2 Pin cJTAG and JTAG debugging;

Support OTA;

Wireless protocol: Thread, Zigbee ® , Bluetooth ® 5 Low Energy;

Receiving sensitivity: –100 dBm for 802.15.4 (2.4 GHz), -102 dBm for Bluetooth 5 Low Energy Coded;

1.3 Application

Building automation solutions

-Building Security System - Motion Detector, electronic intelligent door lock, door and window sensor，Garage

door system, gateway

-HVAC - Thermostat, wireless, sensor, HVAC system controller, gateway

-Fire safety system - smoke and temperature detectors, FACP

-Video surveillance - IP webcam

-Elevators and escalators - Elevator mains，Elevator and escalator control panel;

Grid infrastructure

-Smart meter - Water meter, gas meter, electricity meter and heat cost allocator

Chengdu Ebyte Electronic Technology Co.,Ltd. E72-2G4M05S1F User Manual

-Grid communication - Wireless communication, remote sensor applications

Industrial transport - Asset tracking

Plant automation and control

Medical

Electronic Point of Sale (EPOS) - Electronic shelves

Label (ESL)

2 Specification and parameter

2.1 Limit parameter

Main parameter

Performance

Remark

Min

Max

Power supply（V）

3.8

Voltage over 3.8V will cause permanent

damage to module

Blocking power（dBm）

Chances of burn is slim when modules

are used in short distance

Operating temperature（℃）

-40

+85

Industrial grade

2.2 Operating parameter

Main parameter

Performance

Remark

Min

Type

Max

Operating voltage（V）

1.8

3.3

3.8

≥3.3 V ensures output power

Communication level（V）

3.3

For 5V TTL, it may be at risk of burning down

Operating temperature（℃）

-40

+85

Industrial grade

Operating frequency（MHz）

2400

2480

Power

Consumption

TX current（mA）

Instantaneous power consumption @5dBm

RX current（mA）

8.4

Max TX power（dBm）

4.5

5.5

Receiving sensitivity（dBm）

-102

Bluetooth 5 Low Energy Coded

Main parameter

Description

Remark

Distance

350m

Test condition：clear and open area, antenna gain: 5dBi，

antenna height: 2.5m，air data rate: 150 kbps

Distance

100m

PCB antenna，air data rate 150kbps

Crystal frequency

48MHz/32.768k

48MHz/low speed 32.768k

Protocol

BLE 5.0

Chengdu Ebyte Electronic Technology Co.,Ltd. E72-2G4M05S1F User Manual

Zigbee Thread

Package

SMD

Interface

1.1mm

Stamp hole

CC2652RB1FRGZ

FLASH

352KB

RAM

80KB

Core

Arm ® Cortex ® -M4F

Size

26*16mm

Antenna

PCB / IPEX

50Ω impedance

3 Size and pin definition

No.

Item

Direction

Description

DIO_3

Input/Output

Configurable general IO port (see CC2652RB1FRGZ manual for details)

DIO_4

Input/Output

Configurable general IO port (see CC2652RB1FRGZ manual for details)

DIO_5

Input/Output

Configurable general IO port (see CC2652RB1FRGZ manual for details)

DIO_6

Input/Output

Configurable general IO port (see CC2652RB1FRGZ manual for details)

Chengdu Ebyte Electronic Technology Co.,Ltd. E72-2G4M05S1F User Manual

DIO_7

Input/Output

Configurable general IO port (see CC2652RB1FRGZ manual for details)

DIO_8

Input/Output

Configurable general IO port (see CC2652RB1FRGZ manual for details)

DIO_12

Input/Output

Configurable general IO port (see CC2652RB1FRGZ manual for

details)

DIO_13

Input/Output

Configurable general IO port (see CC2652RB1FRGZ manual for

details)

DIO_14

Input/Output

Configurable general IO port (see CC2652RB1FRGZ manual for details)

DIO_9

Input/Output

Configurable general IO port (see CC2652RB1FRGZ manual for details)

DIO_10

Input/Output

Configurable general IO port (see CC2652RB1FRGZ manual for details)

DIO_11

Input/Output

Configurable general IO port (see CC2652RB1FRGZ manual for details)

DIO_15

Input/Output

Configurable general IO port (see CC2652RB1FRGZ manual for details)

JTAG_TMSC

Input/Output

JTAG_TMSC

JTAG_TCKC

Input

JTAG_TCKC

DIO_16

Input/Output

Configurable general IO port (see CC2652RB1FRGZ manual for details)

DIO_17

Input/Output

Configurable general IO port (see CC2652RB1FRGZ manual for details)

DIO_18

Input/Output

Configurable general IO port (see CC2652RB1FRGZ manual for details)

DIO_19

Input/Output

Configurable general IO port (see CC2652RB1FRGZ manual for details)

DIO_20

Input/Output

Configurable general IO port (see CC2652RB1FRGZ manual for details)

DIO_21

Input/Output

Ground, connected to the power reference ground

GND

Ground, connected to the power reference ground

VCC

Power supply positive, 1.8V - 3.6V

DIO_22

Input/Output

Configurable general IO port (see CC2652RB1FRGZ manual for details)

RESET_N

Input

Reset, active low (see CC2652RB1FRGZ manual for details)

DIO_23

Input/Output

Configurable general IO port (see CC2652RB1FRGZ manual for details)

DIO_24

Input/Output

Configurable general IO port (see CC2652RB1FRGZ manual for details)

DIO_25

Input/Output

Configurable general IO port (see CC2652RB1FRGZ manual for details)

DIO_26

Input/Output

Configurable general IO port (see CC2652RB1FRGZ manual for details)

DIO_27

Input/Output

Configurable general IO port (see CC2652RB1FRGZ manual for details)

DIO_28

Input/Output

Configurable general IO port (see CC2652RB1FRGZ manual for details)

DIO_29

Input/Output

Configurable general IO port (see CC2652RB1FRGZ manual for details)

DIO_30

Input/Output

Configurable general IO port (see CC2652RB1FRGZ manual for

details)

X48M-N

48-MHz crystal oscillator pin 1 (see CC2652RB1FRGZ manual for

details)

X48M-P

48-MHz crystal oscillator pin 2 (see CC2652RB1FRGZ manual for

details)

DIO_30

Input/Output

Configurable general IO port (see CC2652RB1FRGZ manual for

details)

DIO_30

Input/Output

Configurable general IO port (see CC2652RB1FRGZ manual for

details)

DIO_30

Input/Output

Configurable general IO port (see CC2652RB1FRGZ manual for

details)

Chengdu Ebyte Electronic Technology Co.,Ltd. E72-2G4M05S1F User Manual

GND

Ground, connected to the power reference ground

4 Development

No.

Keyword

Notes

Burnprocess

SOC module with GPIO port. The program download uses XDS100 special downloader

Test plate

No matched test plate provide now

5 Basic operation

5.1 Hardware design

It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible and

the module needs to be reliably grounded;

Please pay attention to the correct connection of the positive and negative poles of the power supply,reverse

connection may cause permanent damage to the module;

Please check the power supply to ensure that between the recommended supply voltage, if exceeding the maximum,

the module will be permanently damaged;

Please check the stability of the power supply. Voltage can not fluctuate greatly and frequently;

When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the

margin, so the whole machine is beneficial for long-term stable operation;

The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other

parts with large electromagnetic interference;

Bottom Layer High-frequency digital routing, high-frequency analog routing, and power routing must be avoided

under the module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer,

and the copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital

part of the module and routed in the Bottom Layer;

Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer

or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees;

It is assumed that there are devices with large electromagnetic interference around the module that will greatly

affect the performance. It is recommended to keep them away from the module according to the strength of the

interference. If necessary, appropriate isolation and shielding can be done;

Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog,

power traces) around the module that will greatly affect the performance of the module. It is recommended to stay

away from the module according to the strength of the interference.If necessary, appropriate isolation and shielding

can be done;

Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0;

The mounting structure of antenna has a great influence on the performance of the module. It is necessary to ensure

Chengdu Ebyte Electronic Technology Co.,Ltd. E72-2G4M05S1F User Manual

that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good

antenna extension cable to extend the antenna to the outside;

The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly

weakened.

5.2 Programming

The core of this module is CC2630, the user can operate according to the CC2630 chip manual (see CC2630 manual

for details).

Note: the chip used by the module DC/DC.

Burn program: SOC module, with GPIO port, program download using XDS100 dedicated downloader.

Program download interface definition:

E72 PIN

XDS100 PORT

JTAG_TMSC

TMS

JTAG_TCKC

TCK

RESET_N

SRSTN

GND

DGND

VCC

TVD

6 FAQ

6.1 Communication range is too short

The communication distance will be affected when obstacle exists;

Data lose rate will be affected by temperature, humidity and co-channel interference;

The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground;

Chengdu Ebyte Electronic Technology Co.,Ltd. E72-2G4M05S1F User Manual

Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea;

The signal will be affected when the antenna is near metal object or put in a metal case;

Power register was set incorrectly,air data rate is set as too high (the higher the air data rate,the shorter the distance);

The power supply low voltage under room temperature is lower than recommended value, the lower the transmitting

power;

Due to antenna quality or poor matching between antenna and module.

6.2 Module is easy to damage

Please check the power supply source, ensure that it is within the recommended supply voltage, voltage higher than

the maximum value, will permanent damage the module;

Please check the stability of power source, the voltage cannot fluctuate too much;

Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic

susceptibility;

Please ensure the humidity is within limited range, some parts are sensitive to humidity;

Please avoid using modules under too high or too low temperature.

6.3 BER(Bit Error Rate) is high

There are co-channel signal interference nearby, please be away from interference sources or modify frequency and

channel to avoid interference;

Poor power supply may cause messy code. Make sure that the power supply is reliable;

The extension line and feeder quality are poor or too long, so the bit error rate is high.

7 Production guidance

7.1 Reflow soldering temperature

Profile Feature

Sn-Pb Assembly

Pb-Free Assembly

Solder Paste

Sn63/Pb37

Sn96.5/Ag3/Cu0.5

Preheat Temperature min (Tsmin)

100℃

150℃

Preheat temperature max (Tsmax)

150℃

200℃

Preheat Time (Tsmin to Tsmax)(ts)

60-120 sec

Average ramp-up rate(Tsmax to Tp)

3℃/second max

Liquidous Temperature (TL)

183℃

217℃

Time(tL)Maintained Above(TL)

60-90 sec

30-90 sec

Peak temperature(Tp)

220-235℃

230-250℃

Aveage ramp-down rate(Tp to Tsmax)

6℃/second max

Time 25℃ to peak temperature

6 minutes max

8 minutes max

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