Ebyte E01C-ML01SP4 Manuel utilisateur

E01C-ML01SP4

SI24R1+ 2.4GHz 100mW SPI SMD Wireless Module

Chengdu Ebyte Electronic Technology Co.,Ltd.

E01C-ML01SP4 User Manual

，

Chengdu Ebyte Electronic Technology Co.,Ltd.

Contents

Disclaimer...............................................................................................................................................................................2

1 Overview..............................................................................................................................................................................3

1.1 Introduction............................................................................................................................................................ 3

1.2 Features.................................................................................................................................................................. 3

1.3 Application.............................................................................................................................................................3

2 Technical Parameters........................................................................................................................................................... 4

2.1 Limit Parameter....................................................................................................................................................... 4

2.2 Working parameters................................................................................................................................................. 4

3 Size and pin definition......................................................................................................................................................... 5

4 Basic operation.................................................................................................................................................................... 6

4.1 Hardware design...................................................................................................................................................... 6

4.2 Software programming............................................................................................................................................ 6

5 Basic application..................................................................................................................................................................7

6 FAQ......................................................................................................................................................................................8

6.1 Communication range is too short......................................................................................................................... 8

6.2 Module is easy to damage......................................................................................................................................8

6.3 BER(Bit Error Rate) is high...................................................................................................................................8

7 Welding guidance.................................................................................................................................................................9

7.1 Reflow Soldering Temperature................................................................................................................................ 9

7.2 Reflow Soldering Curve.......................................................................................................................................... 9

9 Antenna recommendation.................................................................................................................................................. 11

9.1 Recommendation................................................................................................................................................... 11

10 Batch packaging...............................................................................................................................................................11

Revision history.................................................................................................................................................................... 12

About us................................................................................................................................................................................12

Chengdu Ebyte Electronic Technology Co.,Ltd.

E01C-ML01SP4 User Manual

，

Chengdu Ebyte Electronic Technology Co.,Ltd.

Disclaimer

EBYTE reserves all rights to this document and the information contained herein.

Products, names, logos and designs described herein may in whole or in part be

subject to intellectual property rights. Reproduction, use, modification or disclosure to

third parties of this document or any part thereof without the express permission of

EBYTE is strictly prohibited.

The information contained herein is provided “as is” and EBYTE assumes no

liability for the use of the information. No warranty, either express or implied, is given,

including but not limited, with respect to the accuracy, correctness, reliability and

fitness for a particular purpose of the information. This document may be revised by

EBYTE at any time. For most recent documents, visit www.ebyte.com.

Chengdu Ebyte Electronic Technology Co.,Ltd.

E01C-ML01SP4 User Manual

，

Chengdu Ebyte Electronic Technology Co.,Ltd.

1 Overview

1.1 Introduction

E01C-ML01SP4 is a small size 2.4ghz SMD wireless module, maximum

transmitting power of 100mW, which is independently developed based on

domestic SI24R1.

Built-in power amplifier (PA) and low noise amplifier (LNA) on the

original basis, the maximum transmission power reaches 100mW, while the

receiving sensitivity is further improved, and the overall communication

stability is less than power amplifier and low noise amplifier The products have

been greatly improved.

This product uses industrial-grade high-precision 16MHz crystal.

Since E01C-ML01SP4 is a radio frequency transceiver module, it needs to

use MCU driver or use a dedicated SPI debugging tool.

1.2 Features

Small size 14.5*18mm;

The maximum transmit power is 100mW, software multi-level adjustable;

Communicationdistancecanreach2KMunderidealconditions;

Globallicense-freeISM2.4GHzband;

Air data rate : 2Mbps, 1Mbps and 250kbps;

125communicationchannelstomeettheneedsofmulti-pointcommunication,packet,frequencyhoppingandotherapplications;

Connect to MCU through SPI interface, the speed is 0 ～10Mbps;

Power supply 2.0～3.6V, more than 3.3V can guarantee the best performance;

Professional RF shielding cover, anti-interference, anti-static;

IPEX interface, convenient for connecting coaxial cable or external antenna (shared with IPEX interface);

1.3 Application

Smart home and industrial sensors;

Security system, positioning system;

Wireless remote control, drone;

Wireless game remote control;

Health care products;

Wireless voice, wireless headphones;

Automotive industry applications.

Chengdu Ebyte Electronic Technology Co.,Ltd.

E01C-ML01SP4 User Manual

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Chengdu Ebyte Electronic Technology Co.,Ltd.

2 Technical Parameters

2.1 Limit Parameter

Main parameter

Performance

Remarks

Min

Max

Voltage supply（V）

3.6

Voltage over 3.6V will cause permanent

damage to module

Blocking power（dBm）

Chances of burn is slim when modules

are used in short distance

Working temperature（℃）

-40

Industrial

2.2 Working parameters

Main parameter

Performance

Remarks

Min.

Typ.

Max.

Operating voltage（V）

2.0

3.3

3.6

≥3.3 V ensures output power

Communication level（V）

3.3

For 5V TTL, it may be at risk of burning down

Working temperature（℃）

-40

Industrial design

Operating frequency（GHz）

2.4

2.525

Support ISM band

Power

consumption

TX current（mA）

113

Instant power consumption

RX current（mA）

Sleep current

（μA）

Software shut off

Max Tx power（dBm）

19.7

20.2

Receiving sensitivity（dBm）

-96.5

-96

-97.5

Air data rate is 250kbps

Air data rate（bps）

250k

User programming control

Main parameter

Value

Remarks

Distance

2000m

In open and clear air, at height of 2.5m，air data rate:250kbps

FIFO

32Byte

Max packet length per time

Crystal Frequency

16MHz

Modulation

GFSK

Package

SMD

Connector

1.27mm 插针

Communication interface

SPI

0～10Mbps

Size

14.5*18mm

Without SMA

Antenna

IPEX

50 ohm impedance match

Chengdu Ebyte Electronic Technology Co.,Ltd.

E01C-ML01SP4 User Manual

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Chengdu Ebyte Electronic Technology Co.,Ltd.

3 Size and pin definition

Pin No.

Pin item

Pin direction

Application

VCC

Power supply between 2.0 and 3.6V

Input

Module control pin

CSN

Input

Chip select pin for starting new SPI communication

SCK

Input

SPI clock pin

MOSI

Input

SPI data input pin

MISO

Output

SPI data output pin

IRQ

Output

Interrupt request，valid in low level

GND

Ground, connected to power reference ground

GND

Ground, connected to power reference ground

GND

Ground, connected to power reference ground

Chengdu Ebyte Electronic Technology Co.,Ltd.

E01C-ML01SP4 User Manual

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Chengdu Ebyte Electronic Technology Co.,Ltd.

4 Basic operation

4.1 Hardware design

It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible,

and the module needs to be reliably grounded;

Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse

connection may cause permanent damage to the module；

Please check the power supply to ensure it is within the recommended voltage otherwise when it exceeds the

maximum value the module will be permanently damaged；

Please check the stability of the power supply, the voltage cannot be fluctuated frequently；

When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of

the margin, so the whole machine is beneficial for long-term stable operation;

The module should be as far away as possible from the power supply, transformers, high-frequency wiring and

other parts with large electromagnetic interference;

Bottom Layer；High-frequency digital routing, high-frequency analog routing, and power routing must be

avoided under the module. If it is necessary to pass through the module, assume that the module is soldered to

the Top Layer, and the copper is spread on the Top Layer of the module contact part(well grounded), it must be

close to the digital part of the module and routed in the Bottom Layer;

Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer or

other layers, which will affect the module's spurs and receiving sensitivity to varying degrees;

It is assumed that there are devices with large electromagnetic interference around the module that will greatly

affect the performance. It is recommended to keep them away from the module according to the strength of the

interference. If necessary, appropriate isolation and shielding can be done；Assume that there are traces with

large electromagnetic interference (high-frequency digital, high-frequency analog, power traces) around the

module that will greatly affect the performance of the module. It is recommended to stay away from the

module according to the strength of the interference. If necessary, appropriate isolation and shielding can be

done;

Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0;

The antenna installation structure has a great impact on the performance of the module. Be sure to ensure that the

antenna is exposed, preferably vertically.When the module is installed inside the case, a high-quality antenna

extension cable can be used to extend the antenna to the outside of the case;

Do not install the antenna inside the metal case,it will greatly reduce the transmission distance.

4.2 Software programming

This module is SI24R1+PA+LNA, and its driving mode is exactly the same as SI24R1. Users can operate in

full accordance with the SI24R1 chip manual (see the SI24R1 manual for details);

Chengdu Ebyte Electronic Technology Co.,Ltd.

E01C-ML01SP4 User Manual

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Chengdu Ebyte Electronic Technology Co.,Ltd.

Power step:

SI24R1Register setting table：

Address(Hex)

Mnemonic

Bit

Reset Value

Description

RF_SETUP

Rf configuration

RF_PWR

2:0

110

TX transmitting power

111:7dBm 110:4dBm

101:3dBm 100:1dBm

011:0dBm 010:-4dBm

001:-6dBm 000:-12dBm

011：Front 0dBm, output 20dBm;

010：Front -4dBm，output 17dBm；

011：Front -6dBm，output 14dBm;

000：Front -12dBm，output 8dBm;

IRQ is an interrupt pin. It is used to wake up the microcontroller and achieve fast response; users can leave it

unconnected and use SPI to query the interrupt status (not recommended, not conducive to overall power

consumption, low efficiency);

CE can be connected to high level for a long time, but the module must be set to POWER DOWN power-

down mode when writing to the register. It is recommended that CE be controlled by MCU pin.

The CE pin is connected to the LNA enable pin. When CE=1, LNA is turned on, and when CE=0, LNA is

turned off. This operation is completely consistent with the transceiver mode of nRF24L01; in other words,

the user does not need to care about LNA operation at all;

If the user needs to answer automatically, the CE pin must remain high during transmission. The correct

operation is: CE=1 to trigger the transmission. After knowing that the transmission is completed, CE=0,

instead of CE=0 after 10us. The reason is: After SI24R1 is sent, it will immediately switch to receiving mode.

At this time, if CE= 0, the LNA has been turned off, which is not conducive to receiving sensitivity.

5 Basic application

Chengdu Ebyte Electronic Technology Co.,Ltd.

E01C-ML01SP4 User Manual

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Chengdu Ebyte Electronic Technology Co.,Ltd.

6 FAQ

6.1 Communication range is too short

The communication distance will be affected when obstacle exists;

Data lose rate will be affected by temperature, humidity and co-channel interference;

The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near

ground.;

Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the

sea;

The signal will be affected when the antenna is near metal object or put in a metal case;

Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the

distance);

The power supply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower the

transmitting power;

Due to antenna quality or poor matching between antenna and module.

6.2 Module is easy to damage

Please check the power supply to ensure that it is between the recommended power supply voltage. If the

maximum value is exceeded, the module will be permanently damaged;

Please check the stability of power source, the voltage cannot fluctuate too much;

Please make sure anti-static measure are taken when installing and using, high frequency devices have

electrostatic susceptibility;

Please ensure the humidity is within limited range, some parts are sensitive to humidity;

Please avoid using modules under too high or too low temperature.

6.3 BER(Bit Error Rate) is high

There are co-channel signal interference nearby, please be away from interference sources or modify frequency

and channel to avoid interference;

The clock waveform on the SPI is not standard. Check whether there is interference on the SPI line. The SPI bus

line should not be too long;

Poor power supply may cause messy code. Make sure that the power supply is reliable;

The extension line and feeder quality are poor or too long, so the bit error rate is hig.

Chengdu Ebyte Electronic Technology Co.,Ltd.

E01C-ML01SP4 User Manual

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Chengdu Ebyte Electronic Technology Co.,Ltd.

7 Welding guidance

7.1 Reflow Soldering Temperature

Profile Feature

Sn-Pb Assembly

Pb-Free Assembly

Solder Paste

Sn63/Pb37

Sn96.5/Ag3/Cu0.5

Preheat Temperature min （Tsmin）

100℃

150℃

Preheat temperature max (Tsmax)

150℃

200℃

Preheat Time (Tsmin to Tsmax)(ts)

60-120 sec

Average ramp-up rate(Tsmax to Tp)

3℃/second max

Liquidous Temperature (TL)

183℃

217℃

Time（tL）Maintained Above（TL）

60-90 sec

30-90 sec

Peak temperature（Tp）

220-235℃

230-250℃

Aveage ramp-down rate（Tp to Tsmax）

6℃/second max

Time 25℃ to peak temperature

6 minutes max

8 minutes max

7.2 Reflow Soldering Curve

Table des matières

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