Dell Studio XPS 8100 Manuel utilisateur

Dell™ Studio XPS™ 8100:

Comprehensive Specifications

This document provides information that you may need when setting up,

updating drivers for, and upgrading your computer.

NOTE: Offerings may vary by region. For more information regarding the configuration

of your computer, click Start → Help and Support and select the option to view

information about your computer.

Processor

Ty p e I n t e l ®Core™ i7-870

Intel Core i7-860

Intel Core i7-750

Intel Core i5-670

Intel Core i5-661

Intel Core i5-660

Intel Core i5-650

Intel Core i3-540

Intel Core i3-530

L1 cache 32 KB

L2 cache 256 KB/core

L3 cache

Intel Core i5-670

Intel Core i5-661

Intel Core i5-660

Intel Core i5-650

Intel Core i3-540

Intel Core i3-530

Intel Core i7-750

Intel Core i7-870

Intel Core i7-860

upto 4 MB

upto 6 MB

upto 8 MB

Memory

Connectors four internally-accessible DDR3 DIMM

sockets

Capacities 1 GB, 2 GB, and 4 GB

Memory type 1066-MHz or 1333-MHz DDR3 DIMM;

non-ECC memory only

Memory configurations possible 4 GB, 6 GB, 8 GB, 12 GB, and 16 GB

(64-bit operating system)

Computer Information

System chipset Intel H57

Data bus width 2.5 GT/s

DRAM bus width 64 bits

Processor address bus width 64 bits

RAID support (internal SATA drives

only)

RAID 0 (striping)

RAID 1 (mirroring)

BIOS chip (NVRAM) 8 MB

Memory speed 1333 Mhz

Processor

(continued)

Drives and Devices

Externally accessible

• two 5.25-inch bays for SATA

DVD+/-RW Super Multi Drive or

Blu-ray Disc™ combo or Blu-ray

Disc RW drive

Internally accessible two 3.5-inch bays for SATA hard drives

Wireless (optional) WiFi/Bluetooth®wireless technology

Expansion Bus

PCI Express

• Gen2 x1 slot bi-directional speed —

500 MB/s

• Gen2 x16 slot bi-directional speed —

16 GB/s

PCI 32-bit speed — 33 MHz

SATA 2.0 1.5 Gbps and 3.0 Gbps

USB 2.0

• high speed — 480 Mbps

• full speed — 12 Mbps

• low speed — 1.2 Mbps

Memory Card Reader

Cards supported

• CompactFlash (CF) card

• Smart Media (SM) card

•xD-Picture(xD)card

• Memory Stick (MS) card

• Memory Stick Duo card

• Memory Stick PRO Duo card

• Memory Stick PRO (MSPRO) card

•MemoryStickPROHG

(MSPRO HG) card

• SecureDigital (SD) card

• SecureDigital Card (SDHC) 2.0

• MultiMedia Card (MMC)

•MicroDrive(MD)

Video

Integrated Intel®Graphics Media Accelerator HD

Discrete PCI Express x16 card

Audio

Type Integrated 7.1 channel, High Definition

audio with S/PDIF support

System Board Connectors

Memory four 240-pin connectors

PCI one 124-pin connector

PCI Express x1 two 36-pin connectors

PCI Express x16 one 164-pin connector

Power (system board) one 24-pin EPS 12V connector

(ATX-compatible)

Processor fan one 4-pin connector

Chassis fan one 3-pin connector

Front USB connector five 9-pin connectors

Front audio connector one 9-pin connector for 2-channel stereo

sound and microphone

SATA four 7-pin connectors

S/PDIF out one 5-pin connector

External Connectors

Network adapter RJ45 connector

USB two top-panel, two front-panel, and four

back-panel USB 2.0-compliant

connectors

Audio top panel — one headphone and one

microphone connector

back panel — six connectors for 7.1

support

S/PDIF one S/PDIF (optical) connector

eSATA one back-panel connector

IEEE 1394a one back-panel 6-pin serial connector

HDMI 19-pin connector

DVI 24-pin connector

Expansion Slots

PCI

Connectors

one

Connector size

124-pin connector

Connector data width (maximum)

32 bit

PCI Express x1

Connectors

two

Connector size

36-pin connector

System Board Connectors

(continued)

Connector data width (maximum)

1 PCI Express lane

PCI Express x16

Connectors

one

Connector size

164-pin connector

Connector data width (maximum)

16 PCI Express lane

Power

DC Power Supply

Wattage 350 W

Maximum heat dissipation 1836 BTU/hr

NOTE: Heat dissipation is calculated by using the power supply wattage rating.

Input voltage 115/230 VAC

Input frequency 50/60 Hz

Rated output current 8 A/4 A

Battery

Coin-cell battery 3-V CR2032 lithium coin cell

Physical

Height 407.75 mm (16.02 inches)

Width 185.81 mm (7.31 inches)

Depth 454.67 mm (17.90 inches)

Weight 10.18 kg (22.40 lb)

Computer Environment

Temperature range:

Operating

10°C to 35°C (50°F to 95°F)

Storage

-40°C to 65°C (-40°F to 149°F)

Relative humidity 20% to 80% (non-condensing)

Expansion Slots

(continued)

____________________

Information in this document is subject to change without notice.

Reproduction of these materials in any manner whatsoever without the written permission of Dell Inc. is

strictly forbidden.

Trademarks used in this text: Dell, the DELL logo, Studio XPS are trademarks of Dell Inc.; Intel is a

registered trademark and Core is a trademark of Intel Corporation in the U.S. and other countries; Microsoft,

Windows, and Windows start button logo are either trademarks or registered trademarks of Microsoft

Corporation in the United States and/or other countries.

Other trademarks and trade names may be used in this document to refer to either the entities claiming the

marks and names or their products. Dell Inc. disclaims any proprietary interest in trademarks and trade

names other than its own.

Model: D03M series Type: D03M001 October 2009 Rev. A00

Maximum vibration (using a random-vibration spectrum that simulates user

environment):

Operating

0.25 GRMS

Storage

2.2 GRMS

Maximum shock (measured with hard drive in head-parked position and a 2-ms

half-sine pulse):

Operating

Half-Sine Pulse: 40G for 2 ms with a

change in velocity of 20 in/s (51 cm/s)

Storage

Half-Sine Pulse: 50G for 26 ms with a

change in velocity of 320 in/s (813 cm/s)

Altitude (maximum):

Operating

-15.2 to 3048 m (-50 to 10,000 ft)

Storage

-15.2 to 10,668 m (-50 to 35,000 ft)

Airborne contaminant level G2 or lower as defined by ISA-S71.04-

1985

Computer Environment

(continued)

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