Dell Studio XPS 8100 Manuel utilisateur
Dell™ Studio XPS™ 8100:
Comprehensive Specifications
This document provides information that you may need when setting up,
updating drivers for, and upgrading your computer.
NOTE: Offerings may vary by region. For more information regarding the configuration
of your computer, click Start → Help and Support and select the option to view
information about your computer.
Processor
Ty p e I n t e l ®Core™ i7-870
Intel Core i7-860
Intel Core i7-750
Intel Core i5-670
Intel Core i5-661
Intel Core i5-660
Intel Core i5-650
Intel Core i3-540
Intel Core i3-530
L1 cache 32 KB
L2 cache 256 KB/core
L3 cache
Intel Core i5-670
Intel Core i5-661
Intel Core i5-660
Intel Core i5-650
Intel Core i3-540
Intel Core i3-530
Intel Core i7-750
Intel Core i7-870
Intel Core i7-860
upto 4 MB
upto 6 MB
upto 8 MB
Memory
Connectors four internally-accessible DDR3 DIMM
sockets
Capacities 1 GB, 2 GB, and 4 GB
Memory type 1066-MHz or 1333-MHz DDR3 DIMM;
non-ECC memory only
Memory configurations possible 4 GB, 6 GB, 8 GB, 12 GB, and 16 GB
(64-bit operating system)
Computer Information
System chipset Intel H57
Data bus width 2.5 GT/s
DRAM bus width 64 bits
Processor address bus width 64 bits
RAID support (internal SATA drives
only)
RAID 0 (striping)
RAID 1 (mirroring)
BIOS chip (NVRAM) 8 MB
Memory speed 1333 Mhz
Processor
(continued)
Drives and Devices
Externally accessible
• two 5.25-inch bays for SATA
DVD+/-RW Super Multi Drive or
Blu-ray Disc™ combo or Blu-ray
Disc RW drive
Internally accessible two 3.5-inch bays for SATA hard drives
Wireless (optional) WiFi/Bluetooth®wireless technology
Expansion Bus
PCI Express
• Gen2 x1 slot bi-directional speed —
500 MB/s
• Gen2 x16 slot bi-directional speed —
16 GB/s
PCI 32-bit speed — 33 MHz
SATA 2.0 1.5 Gbps and 3.0 Gbps
USB 2.0
• high speed — 480 Mbps
• full speed — 12 Mbps
• low speed — 1.2 Mbps
Memory Card Reader
Cards supported
• CompactFlash (CF) card
• Smart Media (SM) card
•xD-Picture(xD)card
• Memory Stick (MS) card
• Memory Stick Duo card
• Memory Stick PRO Duo card
• Memory Stick PRO (MSPRO) card
•MemoryStickPROHG
(MSPRO HG) card
• SecureDigital (SD) card
• SecureDigital Card (SDHC) 2.0
• MultiMedia Card (MMC)
•MicroDrive(MD)
Video
Integrated Intel®Graphics Media Accelerator HD
Discrete PCI Express x16 card
Audio
Type Integrated 7.1 channel, High Definition
audio with S/PDIF support
System Board Connectors
Memory four 240-pin connectors
PCI one 124-pin connector
PCI Express x1 two 36-pin connectors
PCI Express x16 one 164-pin connector
Power (system board) one 24-pin EPS 12V connector
(ATX-compatible)
Processor fan one 4-pin connector
Chassis fan one 3-pin connector
Front USB connector five 9-pin connectors
Front audio connector one 9-pin connector for 2-channel stereo
sound and microphone
SATA four 7-pin connectors
S/PDIF out one 5-pin connector
External Connectors
Network adapter RJ45 connector
USB two top-panel, two front-panel, and four
back-panel USB 2.0-compliant
connectors
Audio top panel — one headphone and one
microphone connector
back panel — six connectors for 7.1
support
S/PDIF one S/PDIF (optical) connector
eSATA one back-panel connector
IEEE 1394a one back-panel 6-pin serial connector
HDMI 19-pin connector
DVI 24-pin connector
Expansion Slots
PCI
Connectors
one
Connector size
124-pin connector
Connector data width (maximum)
32 bit
PCI Express x1
Connectors
two
Connector size
36-pin connector
System Board Connectors
(continued)
Connector data width (maximum)
1 PCI Express lane
PCI Express x16
Connectors
one
Connector size
164-pin connector
Connector data width (maximum)
16 PCI Express lane
Power
DC Power Supply
Wattage 350 W
Maximum heat dissipation 1836 BTU/hr
NOTE: Heat dissipation is calculated by using the power supply wattage rating.
Input voltage 115/230 VAC
Input frequency 50/60 Hz
Rated output current 8 A/4 A
Battery
Coin-cell battery 3-V CR2032 lithium coin cell
Physical
Height 407.75 mm (16.02 inches)
Width 185.81 mm (7.31 inches)
Depth 454.67 mm (17.90 inches)
Weight 10.18 kg (22.40 lb)
Computer Environment
Temperature range:
Operating
10°C to 35°C (50°F to 95°F)
Storage
-40°C to 65°C (-40°F to 149°F)
Relative humidity 20% to 80% (non-condensing)
Expansion Slots
(continued)
____________________
Information in this document is subject to change without notice.
© 2009 Dell Inc. All rights reserved.
Reproduction of these materials in any manner whatsoever without the written permission of Dell Inc. is
strictly forbidden.
Trademarks used in this text: Dell, the DELL logo, Studio XPS are trademarks of Dell Inc.; Intel is a
registered trademark and Core is a trademark of Intel Corporation in the U.S. and other countries; Microsoft,
Windows, and Windows start button logo are either trademarks or registered trademarks of Microsoft
Corporation in the United States and/or other countries.
Other trademarks and trade names may be used in this document to refer to either the entities claiming the
marks and names or their products. Dell Inc. disclaims any proprietary interest in trademarks and trade
names other than its own.
Model: D03M series Type: D03M001 October 2009 Rev. A00
Maximum vibration (using a random-vibration spectrum that simulates user
environment):
Operating
0.25 GRMS
Storage
2.2 GRMS
Maximum shock (measured with hard drive in head-parked position and a 2-ms
half-sine pulse):
Operating
Half-Sine Pulse: 40G for 2 ms with a
change in velocity of 20 in/s (51 cm/s)
Storage
Half-Sine Pulse: 50G for 26 ms with a
change in velocity of 320 in/s (813 cm/s)
Altitude (maximum):
Operating
-15.2 to 3048 m (-50 to 10,000 ft)
Storage
-15.2 to 10,668 m (-50 to 35,000 ft)
Airborne contaminant level G2 or lower as defined by ISA-S71.04-
1985
Computer Environment
(continued)
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