Datum X72 Manuel utilisateur

C/O/106031/I

Designer’s Reference

Datum — Proprietary

Printed in U.S.A.

This material is protected y the copyright and trade

secret laws of the United States and other countries. It

may not e reproduced, distri uted or altered in any

fashion, except in accordance with applica le

agreements, contracts or licensing, without the express

written consent of Datum Irvine.

For permission to reproduce or distri ute please contact:

Pu lications Supervisor, Datum Irvine, 3 Parker,

Irvine, CA 92618-1605.

Ordering Information

The ordering num er of this document is C/O/106031A.

To order this document, call 949 598 7600 and ask for the

Datum Irvine Sales Department.

Notice

Every effort was made to ensure that the information in

this document was complete and accurate at the time

of printing. However, the information presented here is

su ject to change.

Applica le Patents

This product is protected under the following U.S. patent

num ers: 5,457,430, 5,489,821, and patents pending.

Trademarks

X72 is a registered trademark of Datum.

Other trademarked terms may appear in this document

as well. They are marked on first usage.

Warranty

Datum provides a 1 year warranty on the electronics and

a 20 year warranty on the ru idium lamp and cell of this

product.

Table of Contents

SECTION ONE - About This Document

SECTION TWO - Introduction

1.0 Description ........................................................................................... 3

1.1 Typical Applications ........................................................................................ 3

SECTION THREE - Design Integration Considerations

3.1 Mechanical Considerations.......................................................................................... 9

3.1.1 Recommended Mating Connectors .............................................................. 9

3.1.2 Mounting Recommendations........................................................................ 9

3.1.3 Integrating the X72 into a System .............................................................. 10

3.1.3.1 Edge Boards .................................................................... 10

3.1.3.2 Standard Edge Board ...................................................... 11

3.1.3.3 The Anchored Edge Board.............................................. 12

3.1.3.4 3.25 Inch - Connector ..................................................... 13

3.1.3.5 X72 - LPRO Adapter ...................................................... 14

3.2 Thermal Considerations ......................................................................................... 15

3.2.1 Use of Thermal Tape .................................................................................. 15

3.2.2 Frequency offset from Water Condensation in Excess Humidity............... 15

3.2.3 Effect of Excessive Dust............................................................................. 15

3.3 External Interfaces and Grounding............................................................................ 16

3.4 Electrical Interface ......................................................................................... 16

3.4.1 X72 rf Output ......................................................................................... 16

3.4.1.1 RF Output Impedance Versus Frequency ....................... 16

3.4.1.2 AC-coupled rf Load ........................................................ 16

3.4.1.3 Transformer-coupled rf Load .......................................... 17

3.4.3 X72 1 PPS Input and Output ....................................................................... 17

3.4.4 Service Signal .......................................................................................... 17

3.4.5 X72 Frequency Control Signal ................................................................... 18

3.4.6 X72 ACMOS Output Frequency ................................................................ 18

3.5 Frequency Control Analog ........................................................................................ 18

3.5.1 Greater than ±1E-9 Internal or External Control ........................... 18

3.5.2 Time Response of Ext. Frequency Control .................................... 18

3.5.3 Temperature Compensation of Freq. using Ext. Freq. Control ...... 18

3.6 Modifiable Unit Settings .......................................................................................... 20

3.6.1 Hardware Selectable Items ......................................................................... 20

3.6.2 Software Selectable items........................................................................... 20

3.6.3 Temperature Compensation of Frequency Using Ext. C-field Control ...... 20

3.7 EMI Considerations .......................................................................................... 21

3.8 X72 Susceptibility to Input Noise ............................................................................. 21

3.9 X72 Reliability and Maintenance .............................................................................. 22

3.9.1 Reliability .......................................................................................... 22

Table of Contents (continued)

SECTION FOUR - X72 Operation

4.1 X72 Installation ......................................................................................... 23

4.1.1 Site Selection ................................................................................. 23

4.1.2 Turn-on Procedure ......................................................................... 23

4.2 Start-up Sequence ......................................................................................... 24

4.3 Theory of Operation ...................................................................................... 25

4.4 Troubleshooting ......................................................................................... 26

4.5 Maintenance ......................................................................................... 27

4.4.1 Repairs ......................................................................................... 27

4.5.2 Warranty ......................................................................................... 28

APPENDIXA

X72 J1 Connector and Plug ............................................................................................................ A1-3

APPENDIX B

Using the Datum Serial Interface Protocol ................................................................................... B1-10

APPENDIX C

Using the X72 Developer's Kit ..................................................................................................... C1-14

X72 Rubidium Oscillator

X72 Designer’s Reference 09-20-2001

C/O/106031G

Purpose 1

This documen provides basic recommenda ions for designing produc s o use Da um’s X72 ru-

bidium oscilla or. These guidelines are in ended o be generic, as specific produc requiremen s will

vary from applica ion o applica ion.

Technical Support and Warranty Coverage 1

Warran y and non-warran y repair suppor for he X72 is provided by Da um Irvine’s Cus omer

Suppor group. Designer echnical suppor is provided by applica ion engineering from he Irvine

facili y’s Marke ing depar men during he design process.

Scope1

This ma erial consis s of a brief descrip ion of X72 design suppor ed by block diagrams, descrip ion

of environmen al issues, ins alla ion guidelines, required ma ing connec ors, and uni opera ion. This

documen is available in bo h a hardcopy and in Adobe Acroba Reader (.pdf) elec ronic forma .

Intended Audience

This documen is in ended for engineers and elecommunica ions professionals who are designing,

ins alling, opera ing or main aining ime, frequency, and synchroniza ion sys ems having a require-

men for a low profile and highly precise frequency genera or.

Prerequisite Skills and Knowledge 1

To use his documen effec ively, he user should have a good unders anding of digi al elecommuni-

ca ions echnologies and analog frequency genera ion and syn hesis echniques.

Section - About This Document

X72 Rubidium Oscillator

X72 Designer’s Reference 09-20-2001

C/O/106031G

How to Use This Document 1

This documen consis s of Sec ions 1 hrough 4, and Appendice A, B and C.

This documen is organized as follows:

• Section : About this Document

Provides general informa ion abou his documen , he in ended audience,

organiza ion and con en s.

• Section 2: X72 Introduction and Overview

This sec ion con ains a descrip ion of he X72 and lis s i s ypical applica ions.

Dimensions, performance and connec or pinou s are documen ed.

• Section 3: X72 Design Integration Considerations

This sec ion con ains mechnical issues per aining o X72 moun ing and

ma ing recommenda ions, including hermal and EMI considera ions, ex ernal

in erfaces and grounding, frequency con rol, suscep ibili y o noise, and

reliabili y goal.

• Section 4: X72 Installation and Operation

This sec ion con ains he informa ion necessary o properly ins all and opera e

he X72 uni including a simplified heory of opera ion, and main enance and

warran y.

• Appendix A: X72 J Connector and Plug

This appendix iden ifies he Molex J1 connec or and i s ma ing plug,

and provides pinou informa ion for he X72 edge board, and 3.25” cable.

• Appendix B: Using the Datum Serial Interface Protocol

This appendix describes use of he ex ernal communica ions link sof ware.

• Appendix C: Using the X72 Deverloper’s Kit

This appendix describes he X72 developer’s ki hardware.

X72 Rubidum Oscillator

X72 Designer's Reference 09-08-2001

C/O/106031G

Section 2 - Introduction

2.0 Description

The X72 rubidium oscilla or is he newes and

smalles of DATUM’s family of precision frequency

genera or componen s. This fif h genera ion Rb

oscilla or reflec s significan advances in physics

minia uriza ion and in egra ion and offers a low

heigh (0.70" / 17.7 mm), a small foo prin , and an

indus rial empera ure range of -40˚C o +85˚C.

Drawing on over 30 years of experience, he

X72 design has been refined for low cos mass

produc ion and can be easily in egra ed in o ime,

frequency and synchroniza ion sys ems, requiring

only one inpu supply vol age. I can be moun ed

direc ly on o a circui board as a componen of a

module used in 0.8" wide card slo s. I offers he

high reliabili y and accuracy of a rubidium

oscilla or, in a new design concep benefi ing from

he many years of experience Da um has gained in

fielding ens of housands of rubidium oscilla ors.

2. Typical Applications

The eleva ed opera ing empera ure range of he

X72 se s a new high-poin for his ype of a omic

reference. Compared wi h radi ional quar z oscil-

la ors, he s abili y of he X72 main ains excellen

frequency con rol even when he opera ing em-

pera ure is pushed above 85˚C, so ha even if he

hos sys em overhea s in faul mode, he X72

oscilla or will con inue o produce a s able and

accura e ime or frequency reference.

The X72 is easily in egra ed in o ime and fre-

quency sys ems because of i s low profile. The

heigh and foo prin are designed o accommoda e

0.8" (4I) wide card slo applica ion. The uni oper-

a es wi h a low power requiremen (+5 Vdc or

be ween +10 o 32 Vdc). The X72 mee s all appli-

cable CE and FCC requiremen s for EMI emis-

sions and suscep ibili y.

This design is being successfully applied as an

OEM componen in wireless elecom ne works

such as digi al cellular/PCS bases a ions, SONET/

SDH digi al ne work iming, e c. Linked wi h a

GPS receiver or o her ex ernal iming reference,

he X72 provides he necessary iming require-

men s for CDMA cellular and PCS sys ems. The

low empera ure coefficien and excellen frequency

s abili y ex end holdover performance when he

GPS signal is no available. Tempera ure compen-

sa ed uni s are available for hose special applica-

ions requiring even be er empera ure perfor-

mance.

The X72's 20 year s abili y wi hou he need for

re uning permi s ex ended opera ing periods wi h-

ou main enance (long life Rb lamp, ex ended

crys al con rol range). The design produces a

s able frequency wi h good shor and long erm

s abili y, and excellen spur performance.

Figure 2- . X72 Rb Oscilla or a op an 80's vin age

FRK Rb oscilla or showing he drama ic

reduc ion in size of Rb oscilla or design.

X72 Rubidum Oscillator

X72 Designer's Reference 09-08-2001

C/O/106031G

Figure 2-2. X72 Rubidium oscilla or simplified block diagram

Lamp

Energizer Lamp

Heater C-Field

Control

Status

Serial

out

1 PPS IN

1 PPS OUT

TTL

SINE

Analog

Control

Cell

Heater

Microwave

Generator

Filter/

Amp

Mod Synth

DATUM Proprietary

Digital Control Kernel

DC / DC

Converter

and

filters

+5 Vdc

10 - 32 Vdc

Conditioned

Voltages

X72 Block Diagram

EF 1/19/00

Da um's commi men o quali y and reliabili y

is backed by a 20 year warran y on he physics

package (lamp bulb and resona or cell).

The microprocessor-based X72 is a more cos -

effec ive sys em design ha allows serial com-

mand selec ion and enabling of TTL level digi al

ou pu frequencies. This allows he oscilla or ou -

pu o be divided o a number of differen frequen-

cies, as opposed o older oscilla ors wi h a single

fixed ou pu frequency. The sine ou pu frequency

is selec ed a ime of order.

A 1 PPS ou pu is an in egral par of he design.

An op ional 1 PPS inpu allows he uni o rack a

GPS or o her ex ernal reference, and display he

difference be ween he inpu and he 1 PPS gener-

a ed by he X72 hrough he RS232 link.

For simple applica ions he X72 provides a 5V

CMOS-compa ible Buil -in Self Tes (BIST)

Service and a LOCK alarm signal derived from he

basic physics opera ion. This lock signal indica es

when he ou pu frequency is locked o he a omic

resonance of rubidium. When more con rol over

he device is desired, an ex ensive command -

con rol - s a us dialog is available.

In addi ion o con rolling he opera ion of he

oscilla or, he microprocessor's buil -in firmware

allows an ex ernal hos compu er o communica e

wi h he embedded con roller hrough a serial por

connec ion. This allows precise frequency con rol,

he dynamic frequency selec ion men ioned earlier,

he abili y o enable and disable ou pu s, o query

he sys em's heal h, and acquire informa ion abou

he uni 's serial number, opera ing empera ure,

faul his ory, ini ia e a self es , and o her

performance indica ors. The pro ocol used is

Da um's proprie ary Da um Serial In erface

Pro ocol, or DSIP.

The simplified block diagram below shows he

impor ance of he digi al con rol in he uni , how i

con rols and moni ors all aspec s of opera ion, such

as he hea er circui s of he physics package, as well

as he selec ion of ou pu s.

X72 Rubidum Oscillator

X72 Designer's Reference 09-08-2001

C/O/106031G

Bottom View

Front View

Top

Base Plate

3.00

(76)

3.50 (89)

0.70 (18)

2.75

(69.9)

3.250 (82.6)

MOLEX Connector

P/N 52629-2651

Mate with MOLEX

P/N 52660-2651

shown below

CAUTION: unit has an internal fuse

but has no reverse polarity

protection!

NOTE: all pins must be connected!

01 26

4X M3X.5 X .20 (5.1)

Baseplate

mounting

holes (4)

2.07

(52.5)

0.42 (10.6)

Figure 2-3. Ou line Drawing, X72 uni

Table 2- . J1 Connec or In erface

PIN# SIGNAL NAME TYPE** SIGNAL FUNCTION

1 - 7 VDD PWR +Power inpu (+4.5 o 5 Vdc or +10 o +32 Vdc).

All power pins mus be connec ed.

8 SERVICE Ou pu Indica es uni is nearing limi s of frequency con rol and ha

Service is required wi hin several mon hs.

9 DOUT Ou pu UART da a ou a ACMOS logic levels.

10 DIN Inpu UART da a in a ACMOS logic levels.

11 FREQ CTRL Analog Frequency con rol - analog inpu be ween 0 - 5 Vdc.

12 - 18 VSS GND -Power & signal re urn - all grounds mus be connec ed.

19 1 PPS IN Inpu 1 PPS inpu , posi ive edge riggered.

20 1 PPS OUT Ou pu 1 PPS ou pu , may be enabled/disabled digi ally.

21 LOCK Ou pu If low, indica es Rb osc. is locked.

22 FXO Ou pu * (FXO) ACMOS ou pu equalling he VCXO frequency.

23 FACMOS RTN GND Re urn for FACMOS & FXO signals.

24 FACMOS OUT Ou pu (FACMOS) ACMOS ou pu equalling VCXO frequency.

25 FSINE RTN GND Chassis ground - re urn signal for FSINE signal.

26 FSINE OUT Ou pu (FSINE) Sine ou pu op ion - equals VCXO frequency

divided by 2xM (M is se a he fac ory).

* High impedance ** All inpu s and ou pu s are ESD pro ec ed, shor circui pro ec ed,

and all inpu s are compa ible wi h 3.3V ACMOS logic and 5V TTL logic.

NOTE: Refer o Appendix A for he connec or manufac urer's drawings and specifica ions.

X72 Rubidum Oscillator

X72 Designer's Reference 09-08-2001

C/O/106031G

Table 1: ABSOLUTE MAXIMUM RATINGS

Symb CHARACTERISTIC -40 Degrees C UNITS

ol (Uni in ambien s ill air - o 85 C

Symbol CHARACTERISTIC -40 Degrees C to 85 C UNITS

(Unit in ambient still air – convection) Base-plate

VCC SUPPLY RELATIVE 5 VOLT UNIT -0.25 to 8 V

10 TO 32 VOLT UNIT -0.25 to 40

VIN DIN & 1PPSIN -0.5 to 5.5 V

FREQ CNTL -0.5 to 5.5

PWU MAX WARM UP POWER 17 WATTS

PQ MAX QUIESCENT POWER -40˚C BASEPLATE 15 WATTS

25˚C BASEPLATE 10

85˚C BASEPLATE 5.0

twu MAXIMUM WARMUP TIME -40˚C BASEPLATE <8 MINUTES

25˚C BASEPLATE <4

TMOBP Conditions: Still Air – -45 to 85 ˚C

TMTBP Conditions: Still Air – -40 to 85 ˚C

TSTG MAXIMUM STORAGE TEMPERATURE -55 to 85 ˚C

MAXIMUM VIBRATION Sine – 1 inch DA or 10G 0 to 300 Hz

MAXIMUM VIBRATION Sine – 1 inch DA or 10G 0 to 100 Hz

MAXIMUM ALTITUDE With respect to Sea Level 30,000 Feet

MAXIMUM ALTITUDE With respect to Sea Level 50,000 Feet

NOTE: ALL OUTPUTS ARE SHORT CIRCUIT PROTECTED

INPUT VOLTAGE

RELATIVE TO GND

REGARDLESS OF POWER

SUPPLY VOLTAGE

Lock to < 1E-9

MAXIMUM ABSOLUTE

TURN-ON BASEPLATE

TEMPERATURE

MAXIMUM ABSOLUTE

OPERATING BASEPLATE

TEMPERATURE Convection – No Heat

Sink on Unit

Convection – No Heat

Sink on Unit

(Powered but

not locked)

(Powered and

maintaining lock)

(Powered up unit)

(Unpowered)

TO GROUND

TABLE 2-2. X72 Design Absolu e Maximum Ra ings

Table des matières

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