BenQ mobile A38 Manuel utilisateur

Technical Documentation Release 1.0

Service Manual Level 3

for

A38

Release Date Department Notes to change

R 1.0 06.09.2006 BQY CC S CES New document

TD_Repair_L3 _Theory of Operation_S38_R1.0.pdf Page 1 of 59

Created by inservio GmbH for BenQ mobile GmbH & Co. OHG - Company Confidential2006©inservio

Technical Documentation Release 1.0

Table of Content

1Introduction ...............................................................................................................................4

1.1 PURPOSE ...............................................................................................................................4

1.2 SCOPE ...................................................................................................................................4

2List of available level 3 parts....................................................................................................5

3Required Equipment for Level 3 ..............................................................................................7

4Required Software for Level 3..................................................................................................7

5PCB Main Board Overview .......................................................................................................8

6Radio Part Introduction.............................................................................................................9

6.1 RECEIVER OPERATION..........................................................................................................10

6.2 TRANSMITTER OPERATION ....................................................................................................12

6.3 KEY COMPONENTS ...............................................................................................................14

6.3.1 T/R SWITCH ......................................................................................................................14

6.3.2 POWER AMPLIFIER ............................................................................................................14

6.3.3 TRANSCEIVER HD155165BP.............................................................................................15

6.3.4 SAW FILTER .....................................................................................................................15

7Logic / Control Introduction...................................................................................................16

7.1 CALYPSO-BLOCK DIAGRAM (HERCROM200G2)..................................................................17

7.1.1 ARM MEGA-CELL (ARM7TDMIE) .....................................................................................20

7.1.2 DSP SUB-CHIP (S28C128) ...............................................................................................20

7.1.3 INTERNAL STATIC RAM .....................................................................................................20

7.1.4 INTERNAL BOOT ROM ........................................................................................................21

7.1.5 MEMORY INTERFACE .........................................................................................................22

7.1.6 MEMORY PROTECTION UNIT (MPU) ...................................................................................22

7.1.7 DEBUG UNIT (DU) .............................................................................................................22

7.1.8 INTERRUPT HANDLER (INTH).............................................................................................22

7.1.9 TIMERS .............................................................................................................................23

7.1.10 ARM I/O ...........................................................................................................................23

7.1.11 UART-MODEM &UART-IRDA ..........................................................................................24

7.1.12 MICRO WIRE INTERFACE (U-WIRE)....................................................................................24

7.1.13 MASTER I2C SERIAL INTERFACE ........................................................................................24

7.1.14 SERIAL PROT INTERFACE (SPI)..........................................................................................24

7.1.15 SUBSCRIBER IDENTITY MODULE (SIM) ...............................................................................25

7.1.16 REAL TIME CLOCK (RTC) ..................................................................................................25

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7.1.17 ULTRA LOW POWER DEVICE (ULPD) .................................................................................26

7.1.18 JOINED TEST ACTION GROUP (JTAG)................................................................................26

7.1.19 CIPHERING PROCESSOR (CRYPT) ....................................................................................26

7.1.20 RADIO INTERFACE (RIF) ....................................................................................................26

7.1.21 MULTI-CHANNEL SERIAL INTERFACE (MCSI) ......................................................................27

7.1.22 PULSE WIDTH TONES (PWT) .............................................................................................27

7.1.23 PULSE WIDTH LIGHT (PWL)...............................................................................................27

7.2 IOTA (TWL3025).................................................................................................................28

7.2.1 INTRODUCTION OF IOTA....................................................................................................28

7.2.2 BLOCK SPECIFICATIONS (IOTA) ..................................................................................28

7.2.3 USP (MCU SERIAL PORT).................................................................................................30

7.2.4 BSP (BASE BAND SERIAL PORT)........................................................................................30

7.2.5 BBC (BASE BAND CODEC)................................................................................................31

7.2.6 BDL (BASE BAND DOWNLINK PATH)....................................................................................31

7.2.7 AFC &APC ......................................................................................................................32

7.2.8 VREG (VOLTAGE REGULATION).........................................................................................34

7.2.9 VRPC (VOLTAGE REFERENCE POWER CONTROL)..............................................................34

7.2.10 BCI (BATTERY CHARGER INTERFACE)................................................................................35

7.2.11 VBC (VOICE BAND CODEC)................................................................................................36

7.2.12 TSP (TIME SERIAL PORT)..................................................................................................37

7.2.13 SIM CARD INTERFACE (SIM) .............................................................................................37

7.2.14 AUXILIARY CURRENT DRIVER (ACD) ..................................................................................38

7.2.15 AUXILIARY DAC (ADAC) ...................................................................................................38

7.3 INTRODUCTION TO MEMORY DEVICES ...................................................................................39

7.4 INTRODUCTION TO EXTERNAL PERIPHERY CIRCUITS ...............................................................40

7.4.1 MELODY LSI .....................................................................................................................40

7.4.2 VIBRATING MOTOR ............................................................................................................41

7.4.3 KEYBOARD LED CIRCUIT ...................................................................................................42

7.4.4 KEYBOARD CIRCUIT ...........................................................................................................43

7.4.5 AUDIO CIRCUIT ..................................................................................................................44

7.4.6 AUDIO JACK CIRCUIT .........................................................................................................46

7.4.7 SIM READER CIRCUIT .......................................................................................................47

7.4.8 DISPLAY CIRCUITS .............................................................................................................47

7.4.9 CHARGING CIRCUIT............................................................................................................48

Appendix A: Charging Algorithm................................................................................................50

TD_Repair_L3 _Theory of Operation_S38_R1.0.pdf Page 3 of 59

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1 Introduction

1.1 Purpose

This Service Repair Documentation is intended to carry out repairs on BenQ repair level 3.

1.2 Scope

This document is the reference document for all BenQ authorised Service Partners which are

released to repair BenQ Siemens Mobile phones up to level 3.

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2 List of available level 3 parts

Product Chipset ID OrderNumber DescriptionCM

A38 TI ANT1 L50634-Z97-C554 CONN ANT 5.1*3*5 RF05301-PG

A38 TI ANT2 L50634-Z97-C554 CONN ANT 5.1*3*5 RF05301-PG

A38 TI BQ250 L50640-C2143-D670 XTOR BC807-40W SOT-323 PNP

A38 TI BQ350 L50640-C2150-D670 XTOR UMT4403 UMT3 PNP

A38 TI C653 L50695-F3157-M1 CHIP CAP T 150UF 10V M7132

A38 TI D250 L50640-D5111-D670 Diode SB CRS03 30V1A PMDU

A38 TI D350 L50640-L2180-D670 LED BLUE 0603M BL-HB536G-TRB

A38 TI D351 L50640-L2180-D670 LED BLUE 0603M BL-HB536G-TRB

A38 TI D352 L50640-L2180-D670 LED BLUE 0603M BL-HB536G-TRB

A38 TI D353 L50640-L2180-D670 LED BLUE 0603M BL-HB536G-TRB

A38 TI D354 L50640-L2180-D670 LED BLUE 0603M BL-HB536G-TRB

A38 TI D355 L50640-L2180-D670 LED BLUE 0603M BL-HB536G-TRB

A38 TI D356 L50640-D5110-D670 Diode SB 0.2A30V RB520S-30

A38 TI D357 L50640-D5110-D670 Diode SB 0.2A30V RB520S-30

A38 TI DZ250 L50640-D3142-D670 Diode ZEN 6.06-6.33V 200MW UMD

A38 TI EN150 L50645-K280-Y427 FILTER EMI 1GHZ CSPEMI202AG

A38 TI F250 L50645-A820-Y47 CHIP FUSE 1A 32V F0603 TR/0603

A38 TI J250 L50634-Z97-C553 JACK DC PWR PA05302-QNJ

A38 TI J300 L50634-Z97-C679 CONN SPK3.1N2P 6.2*4.8*1PT/ASP

A38 TI J450 L50634-Z97-C558 CONN I/O 10P P0.5 215+916+2941

A38 TI JP250 L50634-Z97-C556 CONN BATT 3P D2.5 AB303Y-C0G1G

A38 TI LCD L50651-Z1508-A197 LCDM WD-X0906XE-6CLWB

A38 TI Q1 L50640-C4086-D670 XTOR 2SC5658T2LR VMT3 NPN

A38 TI R604 L50645-K260-Y110 CHIP ATTENUATOR 3DB PAT1010-X

A38 TI RN350 L50653-F4221-J CHIP NTW 220 J 8P 2*1*0.4

A38 TI RN351 L50653-F4221-J CHIP NTW 220 J 8P 2*1*0.4

A38 TI U100 L50645-J4683-Y31 IC ASIC D751749ZHHR BGA 179P

A38 TI U150 L50610-U6243-D670 IC INTF TWL3025BZGMR PBGA 100P

A38 TI U151 L50634-Z97-C713 CONN SIM CARD 6P BM05306-J7G

A38 TI U200 L50610-F6504-D670 IC FLASH S29PL032J70BFI BQ7B.29032.B3U

A38 TI U201 L50610-F6505-D670 IC SRAM SV5P4016UFA-70P BQ7B.54016.03U

A38 TI U250 L50640-C2168-D670 XTOR DTC144EET1G SC-75 NPN

A38 TI U251 L50630-C1187-D670 FET MOS FDC6506P SOT-6 PC

A38 TI U252 L50610-C6126-D670 IC DETECTOR XC61CC4402N SSOT24

A38 TI U253 L50640-C2144-D670 XTOR DTC143ZET1G SC-75 NPN

A38 TI U325 L50610-U6282-D670 IC DC/DC CONV RT9361APE SOT-26

A38 TI U350 L50640-C2144-D670 XTOR DTC143ZET1G SC-75 NPN

A38 TI U400 L50610-C6430-D670 IC POLY AUDIO SPMA120A-EV083

A38 TI U451 L50645-K280-Y423 FILTER 800-2700MHZ CSPEMI204G

A38 TI U452 L50640-C2149-D670 XTOR PEMH9 NPN SOT666 6P

A38 TI U602 L50610-U6244-D670 IC IR XCVR HD155165BPEB BGA

A38 TI U603 L50645-K280-Y428 FILTER RF SAW 942.5MHZ B9017

A38 TI U604 L50645-K280-Y429 FILTER SAW 1842.5/1960M SAWEP1

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A38 TI U606 L50610-U6247-D670 IC PWR AMP RF3166-E6 SMD

A38 TI U608 L50610-B6218-D670 IC DUAL BUFFER NC7WZ16 SC70-6P

A38 TI U609 L50610-U6248-D670 IC SWITCHPLEXER LMSP54CA-272

A38 TI U610 L50645-F102-Y48 XTAL 26MHZ 10PF 8PPM U-860-1-1

A38 TI U611 L50610-C6289-D670 IC VR MAS9124A2GC06 TSOT-5

A38 TI U72 L50615-Z77-C287 SW RF ANTENNA MS-147 HIROSE

A38 TI X100 L50645-F102-Y49 XTAL 32.768K12.5PF20PPM DST520

A38 TI X150 L50634-Z97-C559 CONN MIC 2P TRA21-2K8 56F55

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Technical Documentation Release 1.0

3 Required Equipment for Level 3

GSM-Tester (CMU200 or 4400S incl. Options)

PC-incl. Monitor, Keyboard and Mouse

Power Supply

Board Adapter A38

Spectrum Analyser

Active RF-Probe incl. Power Supply

Oscilloscope incl. Probe

Power Supply Cables

BGA Soldering equipment

Reference: Equipment recommendation V1.6

(Downloadable from the technical support page)

4 Required Software for Level 3

Windows XP

BenQ Troubleshooting Software XCSD Level2

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5 PCB Main Board Overview

PCB Main Board Back Side

Metal Dome Film LCD Module

LED

Louds

eake

Micro

hone

PCB Main Board Top Side

Transceiver (under

shieldin

frame

)

IOT

Power Am

lifie

udio Chi

SRAM Flash Memor

ntenna Switch

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6 Radio Part Introduction

he following session elaborates the basic functionalities of RF-related chip sets: HD155165BP

（Transceiver, Synthesizer and Universal Baseband Interface）. Those will give readers

fundamental concept about how they work.

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6.1 Receiver Operation

The Aero+ transceiver uses a low-IF receiver architecture that allows for the on-chip integration of

the channel selection filters.

The Si4200 integrates three differential-input LNAs. The LNA amplifies the RF signal after selection

by the T/R switch and RF SAW filter before the signal enters the first mixer section. The LNA inputs

are matched to the 200Ωbalanced output SAW filters through external LC matching networks.

A mixer down converts the RF signal to a 100 kHz intermediate frequency (IF) with the RFLO from

the Si4134T frequency synthesizer. The RFLO frequency is between 1737.8 and 1989.9 MHz, and

is divided by two in the Si4200 for GSM850 and EGSM 900 modes. The mixer output is amplified

with an analog programmable gain amplifier (PGA), which dynamic range is 16 dB and gain step is 4

dB.

The quadrature IF signal is digitized with high-resolution A/D converters (ADCs). The Si4201 down

converts the ADC output to base band with a digital 100 kHz quadrature LO signal. The digital

output is scaled with a digital PGA, which dynamic range is 63 dB and gain step is 1 dB. DACs drive

a differential analog signal onto the RXIP, RXIN, RXQP and RXQN pins to interface to standard

analog-input base band ICs.

TD_Repair_L3 _Theory of Operation_S38_R1.0.pdf Page 10 of 59

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