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The Aoyue Int883 IR-Preheating System is a reworking equipment
that combines infrared (IR) heating technology, enhanced pre-heating
area, versatile board holder, and profile control of heating in one
sophisticated package. It is designed for reworking double-sided, diverse
technology printed circuit boards (PCB) which utilizes traditional or lead
free solder.
The system is equipped with a high powered IR-heating elements
combined with multiple types of preheating operation with built in
safety control of heat and over heat protection. Finally, the unique,
innovative design with digital control panel offers precision, safety, and
ease of use to meet all reworking.
PRODUCT DESCRIPTION
FUNCTIONS and FEATURES
● Microprocessor-controlled ESD safe unit.
● Utilizes infrared heat wave technology.
● Versatile board holder to fit various board types.
● Enhanced pre-heating area to fit large PCBs.
● Widely used for reworking BGAs, micro BGAs, QFPs, PLCCs, SOICs,
small SMD, and other circuit board components.
● Large pre-heating area minimizes board warping
● Easy-to-adjust pre-heat temperatures with digital display.
● Built in extra temperature sensor for more accurate monitoring of board
temperature.
● Built-in temperature sensor for stable (temperature) measurements.
● Closed loop system for precise temperature control.
● Profile adjustment functionality for automating reworking tasks under
user defined temperature and time settings.
● Three modes of operation to suite different reworking requirements.
● Temperature and Profile settings are stored into CPU memory for easy
configuration.
● Compatible for use with either hot air or IR top heating systems.
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OPERATING PROCEDURES
D. TYPE “1” OPERATION
Before proceeding with this type of operation, attach the first external
temperature probe to the underside of the PCB to be worked on. The
second probe can be placed near areas of interest.
This type of operation utilizes the first external temperature sensor
(Marked “B”) to control the heat. Using this type of operation allows us to
closely control the temperature at board level. While freeing up the second
external temperature probe for additional monitoring.
1. To set the desired temperature press the selection button repeatedly
until the top display shows “Set”. The bottom display would show the
current set temperature followed by a suffix “A”.
2. Press the increase or decrease button to adjust the set temperature
level. The set temperature is adjustable from 50 to 280 C in this type
of operation.
3. For this type of operation we must closely monitor the actual
temperature of the first external temperature probe. To view the
actual temperature readout of this probe repeatedly press the
selection button until the top display shows the word “Act1”, and the
bottom display shows the actual temperature of first external
temperature probe followed by a suffix “b”.
4. To view the temperature of the second external temperature probe or
simultaneously view both external temperature probe's temperature:
● Repeatedly press the selection button until the top display shows
“Act 2” and bottom’s suffix shows “c” this displays the second
temperature probe.
● Repeatedly press the selection button until the top shows the first
temperature probe with suffix “b” and the bottom shows the second
temperature probe with suffix “c”.
5. Under type “1” mode of operation it is not necessary to monitor the
internal temperature sensor’s read out.
