Yamaha MS400 Manuel utilisateur

MS400

SERVICE MANUAL

PA 011556

20001210-98000 1.415K-215 K Printed in Japan 2000.12

HAMAMATSU, JAPAN

This document is printed on chlorine free (ECF) paper with soy ink.

POWERED SPEAKER

CONTENTS

SPECIFICATIONS ................................................... 3

DIMENSIONS ........................................................... 4

BLOCK DIAGRAM

............................ 4

PANEL LAYOUT .................................... 5

CIRCUIT BOARD LAYOUT ................. 6

WIRING ..................................................................... 7

DISASSEMBLY PROCEDURE .............................. 8

IC BLOCK DIAGRAM ................................... 10

CIRCUIT BOARDS ........................................ 11

INSPECTIONS ............................................................ 16

OVERALL CIRCUIT DIAGRAM ........................... 19

PARTS LIST

MS400

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MS400

IMPORTANT NOTICE

This manual has been provided for the use of authorized Yamaha Retailers and their service personnel. It has been assumed

that basic service procedures inherent to the industry, and more specifically Yamaha Products, are already known and under-

stood by the users, and have therefore not been restated.

WARNING : Failure to follow appropriate service and safety procedures when servicing this product may result in per-

sonal injury, destruction of expensive components and failure of the product to perform as specified. For

these reasons, we advise all Yamaha product owners that all service required should be performed by an

authorized Yamaha Retailer or the appointed service representative.

IMPORTANT : This presentation or sale of this manual to any individual or firm does not constitute authorization certifi-

cation, recognition of any applicable technical capabilities, or establish a principal-agent relationship of

any form.

The data provided is belived to be accurate and applicable to the unit(s) indicated on the cover. The research engineering, and

service departments of Yamaha are continually striving to improve Yamaha products. Modifications are, therefore, inevitable

and changes in specification are subject to change without notice or obligation to retrofit. Should any discrepancy appear to

exist, please contact the distributor’s Service Division.

WARNING : Static discharges can destroy expensive components. Discharge any static electricity your body may have

accumulated by grounding yourself to the ground bus in the unit (heavy gauge black wires connect to

this bus.)

IMPORTANT : Turn the unit OFF during disassembly and parts replacement. Recheck all work before you apply power

to the unit.

WARNING: CHEMICAL CONTENT NOTICE!

The solder used in the production of this product contains LEAD. In addition, other electrical/electronic and/or plastic (Where

applicable) components may also contain traces of chemicals found by the California Health and Welfare Agency (and possibly

other entities) to cause cancer and/or birth defects or other reproductive harm.

DO NOT PLACE SOLDER, ELECTRICAL/ELECTRONIC OR PLASTIC COMPONENTS IN YOUR MOUTH FOR ANY REASON WHAT

SO EVER!

Avoid prolonged, unprotected contact between solder and your skin! When soldering, do not inhale solder fumes or expose

eyes to solder/flux vapor!

If you come in contact with solder or components located inside the enclosure of this product, wash your hands before handling

food.

WARNING

Components having special characteristics are marked and must be replaced with parts having specification equal to those

originally installed.

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MS400

SPECIFICATIONS

General speciﬁcations

Type

Amp.unit

HF:100W at 5kHz, THD=1%, RL=16 ohms

Bi-Amp 2-way bass reflex powered speaker

(Bi-amp lifier electronic crossover network))

Speaker unit

LF : 38 cm cone

HF : 5 cm Titanium diaphragm compression driver

Frequency Range .................. 50 Hz~16 kHz (-10 dB)

Maximum Output Level .......... 124.5 dB (1m on Axis)

Directional angle .................... 90˚ (H)/40˚ (V)

Dimension (W x H x D) .......... 449 x 683 x 379 mm

Weight ................................... 24.2 kg

Color ...................................... Black (approx.Munsell value:

5PB 2/1)

Tripod diameter pole .............. 35~36 mm

Accessories ........................... Power cord (AC inlet type, 2.5 m)

Maximum Output Power

LF: 300W at 500Hz, THD=1%, RL=4 ohms

Cross over frequency ............. 1.6 kHz (30dB/oct.)

Input Sensitivity ...................... LINE: +4dB*, MIC: -50dB*

Input impedance ..................... LINE: 30 kohms, MIC: 5 kohms

Controls

LEVEL .............. LINE, MIC , MASTER

EQ .................... LOW: 0 (Max.) ~ -10 dB (Min.) at 55 Hz

HIGH: ±3 dB (HF)

Power switch ........................ On/Off

Connectors (all balanced):

LINE in/out ................... XLR-3-31, XLR-3-32, phone

(They are all connected in parallel

and can be used as line outputs.)

MIC in .......................... XLR-3-31

POWER indicator ................ Green LED

Power Requirement USA and Canada ...... 120 V, 60 Hz

Europe ....................... 230 V, 50 Hz

Others ........................ 240 V, 50 Hz

Power Consumption ............. 120 W

Accessor ies ......................... Bracketadapter BAD251 (for

BWS251-400, BCS251, and BBS251)

* 0 dB=0.775 V

For European Model

Purchaser/User Information specified in EN55103-1 and

EN55103-2.

Inrush Current: 25A

Conformed Environment: E1, E2, E3 and E4

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MS400

DIMENSIONS

BLOCK DIAGRAM

Units: mm

683

379

449

203

241 M8 Remove the cover when you

use optional brackets

LOW CUT P.AMP

P.AMP

Mic Input IC102

VR101 VR104

VR105

VR103

IC104

IC107 IC108

IC106

IC105

VR102

213131

3IC101

Line

Mic Master LPF

HPF

Freq. response

compensation

SPEAKER

Line Input/Output

LOW

HIGH

Phone Jack

HPF

AMP 4/5 AMP 5/5 AMP 1/5

CN102-6

CN101-6

CN102-4

CN101-4

CN201-6

CN103-6

CN201-4

CN203-3(LF-),

CN203-4(LF+)

CN203-1(HF+),

CN203-2(HF-)

CN103-4

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MS400

LOW HIGH

LEVEL LEVEL LEVEL

1 2 3 4

TONE CONTROL

PANEL LAYOUT

POWER switch

AC IN connector

LINE connectors

LINE LEVEL control

MIC connector

MIC control

MASTER LEVEL control

POWER indicator

TONE CONTROL

Rear Panel

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CIRCUIT BOARD LAYOUT

1/5

5/5

4/5

2/5

3/5

AMP

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MS400

WIRING

1/5

Speakers

WF TW

CN203

CN201

CN202

CN103

5/5

CN102

CN101

4/5

Transformer

CN204

3/5

CN205

P.SWAC.IN

2/5

YE BL

CN208

Coil

H only

AMP

AMP AMPAMP

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MS400

DISASSEMBLY PROCEDURE

Fig.1

1. Amplifier assembly

1-1. Remove the sixteen (16) screws marked [180A].The

amplifier assembly can then be removed. (Fig. 1)

2. Cabinet assembly and buffle assembly

2-1. Remove the nineteen (19) screws marked [170].The

buffle assembly can then be removed from the

capinet assembly. (Fig. 1)

3. Speakers (38cm, 25mm)

3-1. Remove the buffle assembly from the cabinet

assembly. (See Procedure 2.)

3-2. To remove the 38cm speaker, remove the four (4)

screws marked [180B] and the front grille. (Fig. 1)

3-3. Remove the eight (8) bolts marked [70].The 38cm

speaker can then be removed. (Fig. 1)

3-4. To remove the 25mm speaker, remove the four (4)

screws marked [120].Then remove the speaker with

the bracket. (Fig. 1)

3-5. Remove the two (2) screws marked [100].The 25mm

speaker can then be removed from the bracket.(Fig.1)

[70]: Hexagonal Bolt 5.0 X 35 MFZN2BL (V6389200)

[120]: Bind Head Tapping Screw-P 5.0 X 30 MFZN2BL (V6405200)

[170]: Bind Head Tapping Screw-P 5.0 X 50 MFZN2BL (V6084800)

[180]: Bind Head Screw-Giza 4 X 16 MFZN2BL (V6396400)

[170]

[180B]

[170]

[180A]

[70]

[170]

38cm Speaker

[100]

Red Black

25mm Speaker

Red marking

Yellow Blue

[120]

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Fig.2

4. AMP Circuit Boards (1/5 to 5/5)

4-1. Remove the amplifier assembly.(See Procedure 1.)

4-2. Remove the screws and the knob from each circuit

board, which can then be removed.(Fig.2)

5. Power transformer

5-1. Remove the amplifier assembly.(See Procedure 1.)

5-2. Remove the four (4) screws marked [80B].The power

transformer can then be removed. (Fig. 2)

[80]: Bonding Screw-B 4.0 X 12 MFZN2BL (V7242900)

AMP1/5 90 Bind Head Tapping Screw-B 3.0 X 12 MFZN2BL (VQ074600) 10

Circuit Board

100 Bind Head Screw SP 3.0 X 8 MFZN2Y (EG330290) 4

AMP2/5 80A Bonding Screw-B 4.0 X 12 MFZN2BL (V7242900) 2

Circuit Board

130 Bind Head Screw 4.0 X 8 MFZN2BL (VP156800) 1

AMP3/5 110A Bonding Screw-B 3.0 X 8 MFZN2BL (VN413300) 2

Circuit Board

AMP4/5 110B Bonding Screw-B 3.0 X 8 MFZN2BL (VN413300) 6

Circuit Board

Hexagonal Nut 1

AMP5/5 150 Knob MX-GREEN/D-GRAY (VU860200) 2

Circuit Board

160 Knob ORANGE/D-GRAY (VV625800) 2

170 Knob RED/D-GRAY (VU860400) 1

200 Button 3 X 25 MFZN2BL (V3289800) 4

PCB Name Ref No. Description Q'ty

[80B] Hexagonal

nut

[80A]

[150]

[160]

[200]

[170]

[110B]

[100]

1/5

[90] [90]

5/5

4/5

[120]

2/5

3/5

[110A]

[130]

AMP

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MS400

IC BLOCK DIAGRAM

Fig.3

[120]: Bonding Screw-B 4.0 X 8 MFZN2BL (VR779900)

6. Handle

6-1. Remove the cabinet assembly. (See Procedure 2.)

6-2. Remove the two (2) screws marked [70] and the two

(2) nuts marked [80]. The handle can then be

removed. (Fig.3)

7. Heat sink

7-1. Remove the amplifier assembly.(See Procedure 1.)

7-2. Remove the AMP 1/5 circuit board.(See Step 4-2.)

7-3. Remove the three (3) screws marked [120].The heat

sink can then be removed.(Fig.2)

[80]

[70]

NJM2068L-D

(

XM356A00

)

NJM4580L

(

XF195A00

)

Operational Amplifier

(IC101,103,104,105,106,107,108)

(IC102)

2 3 4 5 6 7 8

IN V

OUT

AAA

VIN

IN OUT

BBB

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