TQ TQMx130 Manuel utilisateur

TQMx130

User's Manual

TQMx130 UM 0101

04.10.2023

TABLE OF CONTENTS

1. ABOUT THIS MANUAL ........................................................................................................................................................................5

1.1 Copyright and License Expenses ....................................................................................................................................................5

1.2 Registered Trademarks ......................................................................................................................................................................5

1.3 Disclaimer...............................................................................................................................................................................................5

1.4 Imprint.....................................................................................................................................................................................................5

1.5 Service and Support............................................................................................................................................................................5

1.6 Tips on Safety........................................................................................................................................................................................6

1.7 Symbols and Typographic Conventions.......................................................................................................................................6

1.8 Handling and ESD Tips.......................................................................................................................................................................6

1.9 Naming of Signals................................................................................................................................................................................7

1.10 Further Applicable Documents / Presumed Knowledge.........................................................................................................7

2. INTRODUCTION ....................................................................................................................................................................................8

2.1 Overview.................................................................................................................................................................................................8

2.2 Compliance......................................................................................................................................................................................... 10

2.3 Versions................................................................................................................................................................................................ 11

2.4 Accessories.......................................................................................................................................................................................... 15

3. FUNCTION ........................................................................................................................................................................................... 16

3.1 Block Diagram.................................................................................................................................................................................... 16

3.2 Electrical Characteristics ................................................................................................................................................................. 16

3.2.1 Supply Voltage .................................................................................................................................................................................. 16

3.2.2 Power Consumption........................................................................................................................................................................ 17

3.2.3 Real Time Clock Power Consumption ........................................................................................................................................ 20

3.3 Environmental Conditions ............................................................................................................................................................. 20

3.4 System Components........................................................................................................................................................................ 21

3.4.1 Processor ............................................................................................................................................................................................. 21

3.4.1.1 Intel®Turbo Boost Technology .................................................................................................................................................... 24

3.4.1.2 Intel®Configurable Thermal Design Power.............................................................................................................................. 24

3.4.2 Graphics............................................................................................................................................................................................... 24

3.4.3 Chipset ................................................................................................................................................................................................. 24

3.4.4 Memory................................................................................................................................................................................................ 25

3.4.4.1 DDR5 SDRAM SO-DIMM.................................................................................................................................................................. 25

3.4.4.2 SPI Boot Flash..................................................................................................................................................................................... 25

3.4.4.3 SPI General Purpose......................................................................................................................................................................... 25

3.4.4.4 EEPROM ............................................................................................................................................................................................... 25

3.4.5 Real Time Clock ................................................................................................................................................................................. 26

3.4.6 Trusted Platform Module ............................................................................................................................................................... 26

3.4.7 Hardware Monitor ............................................................................................................................................................................ 26

3.4.8 TQ Flexible I/O Configuration (TQ-flexiCFG)............................................................................................................................. 26

3.5 Interfaces............................................................................................................................................................................................. 27

3.5.1 PCI Express.......................................................................................................................................................................................... 27

3.5.2 PCI Express Graphics (PEG-Port)................................................................................................................................................... 27

3.5.3 2.5 Gigabit Ethernet ......................................................................................................................................................................... 28

3.5.4 Serial ATA ............................................................................................................................................................................................ 28

3.5.5 Digital Display Interface.................................................................................................................................................................. 28

3.5.6 LVDS / eDP Interface........................................................................................................................................................................ 28

3.5.7 USB 2.0 and USB 3.2 Interfaces ..................................................................................................................................................... 29

3.5.8 USB4 interface.................................................................................................................................................................................... 29

3.5.9 General Purpose Input / Output................................................................................................................................................... 29

3.5.10 High Definition Audio Interface ................................................................................................................................................... 29

3.5.11 LPC / eSPI Bus..................................................................................................................................................................................... 30

3.5.12 I2C Bus................................................................................................................................................................................................... 30

3.5.13 SMBus................................................................................................................................................................................................... 30

3.5.14 MIPI-CSI Camera Serial Interface .................................................................................................................................................. 30

3.5.15 Serial Ports .......................................................................................................................................................................................... 31

3.5.16 Watchdog Timer................................................................................................................................................................................ 31

3.6 Connectors.......................................................................................................................................................................................... 32

3.6.1 .............................................................................................................................................................. 32

3.6.2 Debug Header.................................................................................................................................................................................... 32

3.6.3 TQM Debug Card .............................................................................................................................................................................. 33

3.6.4 Debug Module LED .......................................................................................................................................................................... 33

3.7 ................................................................................................................................................ 34

3.7.1 Signal Assignment Abbreviations ............................................................................................................................................... 34

3.7.2 ............................................................................................................................... 35

4. MECHANICS ........................................................................................................................................................................................ 43

4.1 Dimensions......................................................................................................................................................................................... 43

4.2 Component Placement and Labels............................................................................................................................................. 44

4.3 Heat Spreader .................................................................................................................................................................................... 45

4.4 Mechanical and Thermal Considerations.................................................................................................................................. 45

4.5 Protection against External Effects.............................................................................................................................................. 45

5. SOFTWARE .......................................................................................................................................................................................... 46

5.1 System Resources ............................................................................................................................................................................. 46

5.1.1 I2C Bus Devices................................................................................................................................................................................... 46

5.1.2 SMBus Devices................................................................................................................................................................................... 46

5.1.3 Memory Mapping ............................................................................................................................................................................. 46

5.1.4 Interrupt Mapping............................................................................................................................................................................ 46

5.2 Operating Systems ........................................................................................................................................................................... 47

5.2.1 Supported Operating Systems ..................................................................................................................................................... 47

5.2.2 Driver Download............................................................................................................................................................................... 47

5.3 TQ-Systems Embedded Application Programming Interface (EAPI) ................................................................................ 47

5.4 Software Tools ................................................................................................................................................................................... 47

6. BIOS MENU ...................................................................................................................................................................................... 48

6.1 Continue.............................................................................................................................................................................................. 48

6.2 Boot Manager .................................................................................................................................................................................... 48

6.3 Device Manager ................................................................................................................................................................................ 49

6.3.1 Driver Health Manager.................................................................................................................................................................... 49

6.3.2 Network Device List ......................................................................................................................................................................... 49

6.4Boot from File..................................................................................................................................................................................... 49

6.5 Administer Secure Boot .................................................................................................................................................................. 49

6.6Setup Utility........................................................................................................................................................................................ 50

6.6.1 Main ...................................................................................................................................................................................................... 50

6.6.2 Advanced ............................................................................................................................................................................................ 51

6.6.2.1 Boot Configuration........................................................................................................................................................................... 51

6.6.2.2 USB Configuration............................................................................................................................................................................ 52

6.6.2.3 Chipset Configuration ..................................................................................................................................................................... 52

6.6.2.4 ACPI Table/Features Control ......................................................................................................................................................... 52

6.6.2.5 CPU Configuration............................................................................................................................................................................ 53

6.6.2.6 Power & Performance...................................................................................................................................................................... 53

6.6.2.7 Memory Configuration.................................................................................................................................................................... 57

6.6.2.8 System Agent (SA) Configuration................................................................................................................................................ 58

6.6.2.9 PCH-IO Configuration...................................................................................................................................................................... 61

6.6.2.10 PCH-FW Configuration.................................................................................................................................................................... 65

6.6.2.11 ACPI D3Cold settings....................................................................................................................................................................... 65

6.6.2.12 SIO TQMx86 ........................................................................................................................................................................................ 65

6.6.2.13 SIO Hardware Monitor Nuvoton NCT7802Y ............................................................................................................................. 66

6.6.2.14 Console Redirection......................................................................................................................................................................... 67

6.6.2.15 SIO F81214E........................................................................................................................................................................................ 69

6.6.3 Security ................................................................................................................................................................................................ 69

6.6.4 Power.................................................................................................................................................................................................... 69

6.6.5 Boot....................................................................................................................................................................................................... 69

6.6.6 Exit......................................................................................................................................................................................................... 70

6.7 BIOS Update.................................................................................................................................................................................... 71

6.7.1 Step 1: Preparing USB Stick............................................................................................................................................................ 71

6.7.2 Step 2: Preparing Management Engine (ME) FW for update .............................................................................................. 71

6.7.3 Step 3a: Updating uEFI BIOS via EFI Shell.................................................................................................................................. 73

6.7.4 Step 3b: Updating uEFI BIOS via Windows Operating System ........................................................................................... 74

6.7.5 Step 4: BIOS update check on the TQMx130 Module............................................................................................................ 74

7. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS.................................................................................................. 75

7.1 EMC ....................................................................................................................................................................................................... 75

7.2 ESD ........................................................................................................................................................................................................ 75

7.3 Shock & Vibration ............................................................................................................................................................................. 75

7.4 Operational Safety and Personal Security................................................................................................................................. 75

7.5 Reliability and Service Life.............................................................................................................................................................. 75

7.5.1 RoHS...................................................................................................................................................................................................... 75

7.5.2 WEEE®................................................................................................................................................................................................... 75

7.6 REACH®................................................................................................................................................................................................ 75

7.7 EuP......................................................................................................................................................................................................... 75

7.8 Battery .................................................................................................................................................................................................. 75

7.9 Packaging............................................................................................................................................................................................ 75

7.10 Other Entries....................................................................................................................................................................................... 76

8. APPENDIX............................................................................................................................................................................................ 77

8.1 Acronyms and Definitions.............................................................................................................................................................. 77

8.2 References........................................................................................................................................................................................... 79

TABLE DIRECTORY

Table 1: Terms and Conventions .............................................................................................................................................................6

Table 2: ....... 11

Table 3: ....... 12

Table 4: ....... 13

Table 5: 14

Table 6: TQMx130 Power Consumption Turbo Mode ON........................................................................................................... 18

Table 7: TQMx130 Power Consumption Turbo Mode OFF ......................................................................................................... 18

Table 8: RTC Current Consumption...................................................................................................................................................... 20

Table 9: 13th Generation Intel®-Series................................................................... 21

Table 10: 13th Generation Intel®-Series ................................................................... 22

Table 11: 13th Generation Intel®ndustrial U-Series................................................................... 23

Table 12: 13th Generation Intel®-Series............................................................................... 23

Table 13: Maximum Resolution Display Configuration.................................................................................................................... 24

Table 14: PCI Express port 0 7 Configuration Options ..................................................................................... 27

Table 15: PCI Express Graphics port Configuration Options ............................................................................. 27

Table 16: ............................................................................................................................ 31

Table 17: LED Boot Messages................................................................................................................................................................... 33

Table 18: Signal Assignment Abbreviations ........................................................................................................................................ 34

Table 19: ....................................................................................................................... 35

Table 20: Labels on TQMx130 .................................................................................................................................................................. 44

Table 21: I2 2C Port ................................................................................................................... 46

Table 22: I2........................................................................................................... 46

Table 23: Acronyms..................................................................................................................................................................................... 77

Table 24: Further Applicable Documents and Links ......................................................................................................................... 79

FIGURE DIRECTORY

Figure 1: TQMx130 block diagram ......................................................................................................................................................... 16

Figure 2: TQM Debug Card....................................................................................................................................................................... 33

Figure 3: Debug Module LED................................................................................................................................................................... 33

Figure 4: TQMx130 three view drawing ............................................................................................................................................... 43

Figure 5: TQMx130 Bottom View Drawing .......................................................................................................................................... 43

Figure 6: TQMx130 Component Placement Top ............................................................................................................................... 44

Figure 7: TQMx130 Component Placement Bottom........................................................................................................................ 44

Figure 8: TQMx130-HSP Heat Spreader................................................................................................................................................ 45

Figure 9: InsydeH2O BIOS Front Page................................................................................................................................................... 48

Figure 10: PCH-FW Configuration menu ................................................................................................................................................ 72

Figure 11: Firmware Update Configuration menu .............................................................................................................................. 72

Figure 12: ME FW Image Re-Flash option............................................................................................................................................... 72

Figure 13: EFI Shell......................................................................................................................................................................................... 73

Figure 14: EFI Shell uEFI BIOS Update...................................................................................................................................................... 73

Figure 15: Screen during BIOS Update.................................................................................................................................................... 73

Figure 16: TQMx130 Debug LED ............................................................................................................................................................... 74

Figure 17: EFI BIOS Main Menu.................................................................................................................................................................. 74

REVISION HISTORY

Rev.

Date

Name

Pos.

Modification

0100

12.09.2023

First release

0101

04.10.2023

2.1

Temperature range supplemented

1. ABOUT THIS MANUAL

1.1 Copyright and License Expenses

This User's Manual may not be copied, reproduced, translated, changed or distributed, completely or partially in electronic,

machine readable, or in any other form without the written consent of TQ-Systems GmbH.

The drivers and utilities for the components used as well as the BIOS are subject to copyrights of the respective manufacturers.

The licence conditions of the respective manufacturer are to be adhered to.

BIOS-licence expenses are paid by TQ-Systems GmbH and are included in the price.

Licence expenses for the operating system and applications are not taken into consideration and have to be calculated/declared

separately.

1.2 Registered Trademarks

TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original

or license-free graphics and texts.

All brand names and trademarks mentioned in this User's Manual, including those protected by a third party, unless specified

otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the present

registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by

a third party.

1.3 Disclaimer

TQ-Systems GmbH does not guarantee that the information in this User's Manual is up-to-date, correct, complete or of good

quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against

TQ-Systems GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information

given in this User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven

intentional or negligent fault of TQ-Systems GmbH.

TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this User's Manual or parts of it without

special notification.

1.4 Imprint

TQ-Systems GmbH

Gut Delling, Mühlstraße 2

D-82229 Seefeld

Tel: +49 8153 9308 0

Fax: +49 8153 9308 4223

E-Mail: Info@TQ-Group

Web: TQ-Group

1.5 Service and Support

Please visit our website www.tq-group.com for latest product documentation, drivers, utilities and technical support.

You can register on our website www.tq-group.com to have access to restricted information and automatic update services.

For direct technical support you can contact our FAE team by email: [email protected].

Our FAE team can also support you with additional information like 3D-STEP files and confidential information, which is not

provided on our public website.

For service/RMA, please contact our service team by email ([email protected]) or your sales team at TQ-Systems GmbH.

1.6 Tips on Safety

Improper or incorrect handling of the product can substantially reduce its life span.

1.7 Symbols and Typographic Conventions

Table 1: Terms and Conventions

Symbol

Meaning

This symbol represents the handling of electrostatic-sensitive modules and / or components. These

components are often damaged / destroyed by the transmission of a voltage higher than about 50 V.

A human body usually only experiences electrostatic discharges above approximately 3,000 V.

This symbol indicates the possible use of voltages higher than 24 V.

Please note the relevant statutory regulations in this regard.

Non-compliance with these regulations can lead to serious damage to your health and also cause

damage / destruction of the component.

This symbol indicates a possible source of danger. Acting against the procedure described can lead to

possible damage to your health and / or cause damage / destruction of the material used.

This symbol represents important details or aspects for working with TQ-products.

Command

A font with fixed-width is used to denote commands, contents, file names, or menu items.

1.8 Handling and ESD Tips

General handling of your TQ-products

The TQ-product may only be used and serviced by certified personnel who have taken note of the

information, the safety regulations in this document and all related rules and regulations.

A general rule is: do not touch the TQ-product during operation. This is especially important when

switching on, changing jumper settings or connecting other devices without ensuring beforehand

that the power supply of the system has been switched off.

Violation of this guideline may result in damage / destruction of the TQMx130 and be dangerous

to your health.

Improper handling of your TQ-product would render the guarantee invalid.

Proper ESD handling

The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).

Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-

product in an ESD-safe environment. Especially when you switch modules on, change jumper settings,

or connect other devices.

1.9 Naming of Signals

A hash mark (#) at the end of the signal name indicates a low-active signal.

Example: RESET#

If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked

with a hash mark and shown at the end.

Example: C / D#

If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring.

The identification of the individual functions follows the above conventions.

Example: WE2# / OE#

1.10 Further Applicable Documents / Presumed Knowledge

•Specifications and manual of the modules used:

These documents describe the service, functionality and special characteristics of the module used.

•Specifications of the components used:

The manufacturer's specifications of the components used, for example CompactFlash cards, are to be taken note of.

They contain, if applicable, additional information that has to be taken note of for safe and reliable operation.

These documents are stored at TQ-Systems GmbH.

•Chip errata:

It is the user's responsibility to make sure all errata published by the manufacturer of each component are taken note of.

•Software behaviour:

No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.

•General expertise:

Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.

Implementation information for the carrier board (3), maintained by the

PICMG®

It includes detailed information with schematics and detailed layout guidelines.

Please refer to the official PICMG®documentation for additional information (2), (4).

2. INTRODUCTION

Based on the internationally established PICMG®(COM.0 Rev. 3.1), the TQMx130 enables the design of

not only powerful but also economical x86 based systems. The user has access to all essential interfaces of the CPU at the Type 6

compliant pin out connector. Hence all features of the 13th Generation Intel®can be used. The direct access to all

interfaces gives the user the freedom to use the features of the CPU in the most suitable way for his application.

The compact and robust design as well as the option of conformal coating extends the use cases to applications within rugged

industry, transportation and aviation environments. Based on the very low-power consumption and the extended temperature

support it is also possible to realize outdoor applications in an easy and reliable way.

2.1 Overview

The following key functions are implemented on the TQMx130:

Processor:

13th Generation Inte embedded H-series (Raptor Lake-P / H45) with up to 14 processor cores

•Intel®i7-13800HE 6P+8E / 96EU, 24 MB Cache, up to 5.0 GHz , 45 W (cTDP 35 W), 0 °C 100 °C

•Intel®i5-13600HE 4P+8E / 80EU, 18 MB Cache, up to 4.8 GHz , 45 W (cTDP 35 W), 0 °C 100 °C

•Intel®i3-13300HE 4P+4E / 48EU, 12 MB Cache, up to 4.6 GHz , 45 W (cTDP 35 W), 0 °C 100 °C

13th Generation Inte industrial H-series (Raptor Lake-P / H45) with up to 14 processor cores

•Intel®i7-13800HRE 6P+8E / 96EU, 24 MB Cache, up to 5.0 GHz , 45 W (cTDP 35 W), -40 °C 100 °C

•Intel®i5-13600HRE 4P+8E / 80EU, 18 MB Cache, up to 4.8 GHz , 45 W (cTDP 35 W), -40 °C 100 °C

•Intel®i3-13300HRE 4P+4E / 48EU, 12 MB Cache, up to 4.6 GHz , 45 W (cTDP 35 W), -40 °C 100 °C

13th Generation Inte P-series (Raptor Lake-P / P28) with up to 14 processor cores

•Intel®i7-1370PE 6P+8E / 96EU, 24 MB Cache, up to 4.8 GHz , 28 W (cTDP 35 W / 20 W), 0 °C 100 °C

•Intel®i5-1350PE 4P+8E / 80EU, 12 MB Cache, up to 4.6 GHz , 28 W (cTDP 35 W / 20 W), 0 °C 100 °C

•Intel®i5-1340PE 4P+8E / 80EU, 12 MB Cache, up to 4.5 GHz , 28 W (cTDP 35 W / 20 W), 0 °C 100 °C

•Intel®i3-1320PE 4P+4E / 48EU, 12 MB Cache, up to 4.5 GHz , 28 W (cTDP 35 W / 20 W), 0 °C 100 °C

13th Generation Inte P-series (Raptor Lake-P / P28) with up to 14 processor cores

•Intel®i7-1370PRE 6P+8E / 96EU, 24 MB Cache, up to 4.8 GHz , 28 W (cTDP 35 W / 20 W), -40 °C 100 °C

•Intel®i5-1350PRE 4P+8E / 80EU, 12 MB Cache, up to 4.6 GHz , 28 W (cTDP 35 W / 20 W), -40 °C 100 °C

•Intel®i3-1320PRE 4P+4E / 48EU, 12 MB Cache, up to 4.5 GHz , 28 W (cTDP 35 W / 20 W), -40 °C 100 °C

13th Generation Inte and Processor embedded U-series (Raptor Lake-P / U15) with up to 10 processor cores

•Intel® i7-1365UE 2P+8E / 96EU, 12 MB Cache, up to 4.9 GHz , 15 W (cTDP 28 W / 12 W), 0 °C 100 °C

•i5-1345UE 2P+8E / 80EU, 12 MB Cache, up to 4.6 GHz , 15 W (cTDP 28 W / 12 W), 0 °C 100 °C

•i5-1335UE 2P+8E / 80EU, 12 MB Cache, up to 4.5 GHz , 15 W (cTDP 28 W / 12 W), 0 °C 100 °C

•Intel® i3-1315UE 2P+4E / 64EU, 10 MB Cache, up to 4.3 GHz , 15 W (cTDP 28 W / 12 W), 0 °C 100 °C

•Intel®Processor U300E 1P+4E / 48EU, 8 MB Cache, up to 4.3 GHz , 15 W (cTDP 28 W / 12 W), 0 °C 100 °C

13th Generation Inte -series (Raptor Lake-P / U15) with up to 10 processor cores

•Intel® i7-1365URE 2P+8E / 96EU, 12 MB Cache, up to 4.9 GHz , 15 W (cTDP 28 W / 12 W), -40 °C 100 °C

•i5-1345URE 2P+8E / 80EU, 12 MB Cache, up to 4.6 GHz , 15 W (cTDP 28 W / 12 W), -40 °C 100 °C

•Intel® i3-1315URE 2P+4E / 64EU, 10 MB Cache, up to 4.3 GHz , 15 W (cTDP 28 W / 12 W), -40 °C 100 °C

Memory:

•2 × DDR5 SO-DIMM socket with max. 64 Gbyte, dual channel DDR5 up to 5200 MT/s SO-DIMM modules

•EEPROM: 32 kbit (24AA32) (optional)

Graphics:

•3 × Digital Display Interface / DP++ with up to 8K; DisplayPort 1.4a with support for Multi-Stream Transport (MST)

•1 × Embedded Digital Display Interface (eDP) or dual channel LVDS interface (eDP 1.4b or dual LVDS)

Peripheral interfaces:

•1 × 2.5 Gigabit Ethernet (Intel®i226)

•4 × USB 3.2 Gen 2 (up to 10 Gb/s) with USB 3.0 compatibility

•2 × USB4 Support, pins shared with Digital Display Interface (optional)

•8 × USB 2.0

•2 × SATA Gen 3 (up to 6 Gb/s) or 2x PCIe Gen 3 (up to 8 Gb/s)

•4 × PCIe Gen 3 (up to 8 Gb/s) (4 (×1), 2 (×2), or 1 (×4))

•4 × PCIe Gen 4 (up to 16 Gb/s) (1 (×1), 1 (×2), or 1 (×4))

•1 × PCIe PEG port Gen 4 (up to 16 Gb/s) (1 (×4) and 1 (x8) H series only)

•1 × LPC or eSPI bus

•1 × Intel®HD audio (HDA)

•1 × I2C (2nd I2C optional)

•1 × SMBus

•1 × SPI for external uEFI BIOS flash

•1 × SPI general purpose interface (optional)

•2 × Serial port (Rx/Tx, legacy compatible), 4-wire (Rx/Tx/RTS/CTS) optionally through TQ-flexiCFG

•8 × GPIO through TQ-flexiCFG

•1 × MIPI-CSI Camera input interface connector (option)

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