TechNexion TEP-1010-IMX6 Manuel utilisateur

TEP-1010-IMX6 MODULAR HMI PRODUCT MANUAL

(TEP-1010-IMX6)

VER. 1.00

August 21, 2018

TEP-1010-IMX6 HARDWARE MANUAL –VER 1.00 –AUG 21 2018

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REVISION HISTORY

Revision

Date

Originator

Notes

1.00

August 21, 2018

TechNexion

First public release

TEP-1010-IMX6 HARDWARE MANUAL –VER 1.00 –AUG 21 2018

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TABLE OF CONTENTS

1. Introduction ...............................................................................................................................................5

1.1. General Care and Maintenance .........................................................................................................5

2. TEP-1010-IMX6 Product Overview...........................................................................................................6

2.1. Functional Block Diagram ..................................................................................................................6

2.2. Dimensions.........................................................................................................................................7

2.3. Device Cut-out Dimensions For Mounting Though a Panel...............................................................8

2.4. External Connectors...........................................................................................................................9

2.5. Internal Board Connectors ...............................................................................................................10

2.5.1. Galvanic Isolated (TEP1010-IMX6x-Rxx-Exx-Lxxx-XG20-xxx-xxxx) ........................................10

2.5.2. Non-Galvanic Isolated (TEP1010-IMX6x-Rxx-Exx-Lxxx-XS20-xxx-xxxx).................................11

2.5.3. Board View Without the I/O Expansion Module.........................................................................12

3. External Connectors................................................................................................................................13

3.1. LED Light Indicator...........................................................................................................................13

3.2. Micro-SIM Connector........................................................................................................................13

3.3. MicroSD Connector..........................................................................................................................13

3.4. USB OTG (Type-C) Connector ........................................................................................................14

3.5. USB Host Connector........................................................................................................................14

3.6. HDMI (High Definition Multi-Media Interface) Connector.................................................................14

3.7. VGA (15-pin D-SUB) Connector.......................................................................................................14

3.8. Audio Connectors.............................................................................................................................15

3.9. S1 Button..........................................................................................................................................15

3.10. RST Button.....................................................................................................................................15

3.11. Power Input Connector...................................................................................................................15

3.12. Gigabit Ethernet Interface ..............................................................................................................16

3.13. Antenna Holes................................................................................................................................16

3.14. Galvanic Isolated Connectors (TEP1010-IMX6x-Rxx-Exx-Lxxx-XG20-xxx-xxxx) (optional) .........17

3.14.1. Galvanic Isolated Digital I/O Connectors (GPIO1/GPIO2) (optional) ......................................17

3.14.2. Galvanic Isolated Serial Port (RS-XXX) (optional) ..................................................................19

3.14.3. Galvanic Isolated CAN Bus Connector (CANBus) (optional) ..................................................21

3.15. Non-Galvanic Isolated Connectors (TEP1010-IMX6x-Rxx-Exx-Lxxx-XS20-xxx-xxxx) (optional)..22

3.15.1. Non-Galvanic Isolated Digital I/O Connectors (GPIO1/GPIO2) (optional) ..............................22

3.15.2. Non-Galvanic Isolated Serial Port (RS-XXX) (optional)...........................................................23

3.15.3. Non-Galvanic Isolated CAN Bus Connector (CANBus) (optional) ..........................................24

4. Internal Connectors and Expansion Options ..........................................................................................25

4.1. Mini-PCIe Connectors ......................................................................................................................25

4.2. Mini-SIM Cardslot.............................................................................................................................25

TEP-1010-IMX6 HARDWARE MANUAL –VER 1.00 –AUG 21 2018

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4.3. M.2 KEY-B Slots...............................................................................................................................26

4.4. SW2 Default Boot Mode Switch .......................................................................................................26

4.5. SWITCH1 Boot Mode DIP Switch ....................................................................................................26

4.6. RTC Battery Connector....................................................................................................................26

4.7. Internal Stereo Speaker Connectors................................................................................................27

5. Mounting..................................................................................................................................................28

5.1. VESA Mounting................................................................................................................................28

5.2. Rear Mounting and Mounting Clips Installation................................................................................29

5.3. Surface Mounting and O-ring Installation.........................................................................................30

6. Ordering Information ...............................................................................................................................31

6.1. Custom Part Number Rule ...............................................................................................................31

6.2. Standard Package Contents ............................................................................................................32

7. Important Notice......................................................................................................................................33

8. DISCLAIMER ..........................................................................................................................................34

TEP-1010-IMX6 HARDWARE MANUAL –VER 1.00 –AUG 21 2018

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1. Introduction

1.1. General Care and Maintenance

Your device is a product of superior design and craftsmanship and should be treated with care.

The following suggestions will help you.

•Keep the device dry. Precipitation, humidity, and all types of liquids or moisture can contain

minerals that will corrode electronic circuits. If your device does get wet, allow it to dry completely.

•Do not use or store the device in dusty or dirty areas. Its parts and electronic components can be

damaged.

•Do not store the device in hot areas. High temperatures can shorten the life of electronic devices,

damage batteries, and warp or melt certain plastics.

•Do not store the device in cold areas. When the device returns to its normal temperature,

moisture can form inside the device and damage electronic circuit boards.

•Do not open the device while power is on. Otherwise electrical shock may result.

•Do not drop, knock, or shake the device. Rough handling can break internal circuit boards and

fine mechanics.

•Do not use harsh chemicals, cleaning solvents, or strong detergents to clean the device.

•Do not paint the device. Paint can clog the parts and prevent proper operation.

•Unauthorized modifications or attachments could damage the device and may violate regulations

governing radio devices.

These suggestions apply equally to your device, battery, charger, or any enhancement. If any device is

not working properly, take it to the nearest authorized service facility for service.

Regulatory information

Disposal of Waste Equipment by Users in Private Household in the European Union

This symbol on the product or on its packaging indicates that this product must not be

disposed of with your other household waste. Instead, it is your responsibility to dispose

of your waste equipment by handing it over to a designated collection point for the

recycling of waste electrical and electronic equipment. The separate collection and

recycling of your waste equipment at the time of disposal will help to conserve natural

resources and ensure that it is recycled in a manner that protects human health and the

environment. For more information about where you can drop off your waste equipment

for recycling, please contact your local city office, your household waste disposal service or the shop

where you purchased the product.

We hereby declare that the product is in compliance with the essential requirements and

other relevant provisions of European Directive 1999/5/EC (radio equipment and

telecommunications terminal equipment Directive).

TEP-1010-IMX6 HARDWARE MANUAL –VER 1.00 –AUG 21 2018

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2. TEP-1010-IMX6 Product Overview

2.1. Functional Block Diagram

TEP-1010-IMX6 HARDWARE MANUAL –VER 1.00 –AUG 21 2018

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2.2. Dimensions

The following figure shows the TEP-1010-IMX6 dimensions (unit: mm):

TEP-1010-IMX6 HARDWARE MANUAL –VER 1.00 –AUG 21 2018

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2.3. Device Cut-out Dimensions For Mounting Though a Panel

The TEP-1010-IMX6 can be mounted on the front or the back of the panel. In order to mount it from the

front, a nominal rectangular cutout must be made in the panel. The following drawing shows the

dimensions of the cut-out area (unit: mm):

TEP-1010-IMX6 HARDWARE MANUAL –VER 1.00 –AUG 21 2018

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2.4. External Connectors

The TEP-1010-IMX6 has a number of external connectors.

Bottom view:

1 2 4 5 7 9 10 11 12 13 14 15

6 8

16 17 18 19 20 21

External Connectors:

No.

Description

No.

Description

LED Light indicator

3.5mm jack Line in

Micro-SIM cardslot

3.5mm jack Mic in

MicroSD cardslot

S1 Boot Select button

USB OTG (Type-C) connector

Reset button

USB Host connector

Power Input connector

USB Host connector

LAN RJ45 connector

USB Host connector

GPIO1 connector (optional)

USB Host connector

GPIO2 connector (optional)

HDMI connector

RS-XXX (Serial Port) connector (optional)

VGA (15-pin D-SUB) connector

CAN Bus connector (optional)

3.5mm jack Line out

TEP-1010-IMX6 HARDWARE MANUAL –VER 1.00 –AUG 21 2018

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2.5. Internal Board Connectors

The TEP-1010-IMX6 has several connectors, switches and internal expansion options.

2.5.1. Galvanic Isolated (TEP1010-IMX6x-Rxx-Exx-Lxxx-XG20-xxx-xxxx)

Rear view (opened device) with the galvanic isolated I/0 Expansion module:

I/O Expansion Module

A B C D

F G

Internal Connectors and Switches:

No.

Description

No.

Description

mini-PCIe connector (PCIe + USB)

M.2 KEY-B slot (SATA + USB)

mini-PCIe connector (USB)

SWITCH1 Boot mode DIP switch

SW2 Default Boot mode switch

SW1 DIP switch

M.2 KEY-B slot (USB)

SW3 Terminator Resistor DIP switch

RTC Battery connector

SW2 Terminator Resistor DIP switch

Mini-SIM cardslot

NOTE: Items marked with * are available on the galvanic isolated I/O Expansion module

(TXB-I2-GS2-GC2-GG8) (optional).

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