TDK Memory Bus Interface Type Manuel utilisateur
(1/1)
001-04 / 20070219 / ew_004.fm
• All specifications are subject to change without notice.
NAND-type Flash Memory Controller IC GBDriver XR
Memory Bus Interface Type
For Small Embedded Systems without an ATA/IDE interface
NAND-type Flash Memory has occupied significant place in embedded systems. In many cases the system size is small and an ATA
interface is not used. The TDK GBDriver XR bridges those host interfaces without an ATA bus to NAND-type Flash Memory. The built-in
engine is the TDK GBDriver RA3 controller. The GBDriver RA3 is the recipient of numerous design wins and strong interest from our
customer base.
GBDriver XR interfaces with a common memory bus such as SRAM bus, enabling CPU to connect with and thus control NAND-type
Flash Memory directly. GBDriver XR makes it possible to build storage systems even if they do not have hard disk interface such as ATA/
IDE. The XR is packaged in an ultra-small, ultra-thin VFBGA. This simplifies insertion into portable devices, mobile terminals, and small
IT home appliances.
FEATURES
• World’s first NAND-type Flash Memory controller interfacing with
common memory bus, such as a one chip LSI solution.
• Realizes 6MB/s burst writes when directly connected with the
system bus.
• Controls NAND-type Flash Memory up to 4GB. Confirmed
compatibility with Flash Memories of several makers.∗
• High reliability in Write and Read by TDK original systematic
control over NAND-type Flash Memory.
• ATA compatible register interface, suitable for use with the FAT
file system, only low level driver required.
• Available in 8mmVFBGA100pin package.
• Supports auto recovery function (option)
• Conforms to the RoHS directives.
∗Please contact us to confirm the Flash Memory compatibility.
MAIN APPLICATIONS
• Flash memory modules
• Silicon storage
• Boot devices for embedded systems
APPLICATIONN EXAMPLES
• For NOR Flash-/HDD- replacement applications.
• For user data storage applications; home information
appliances, STBs, PDAs, mobile phones, etc.
• For booting embedded systems of WindowsXP Embedded-base
or Linux-base.
SHAPES AND DIMENSIONS
VFBGA100pin Single Chip
SPECIFICATIONS
Conformity to RoHS Directive
Timing specifications Host I/F 120ns[Burst cycle]
180ns[Single cycle]
Flash I/F 90ns
Power specifications
Host I/F 2.7 to 3.6V
Core 2.7 to 3.6V
Flash I/F 2.7 to 3.6V
System clock 33.33MHz
[External clock support]
Temperature ranges Operating –40 to +85°C
Storage –55 to +125°C
Power consumption
(ref.)
Reading 41mA[3.0V]
Writing 40mA[3.0V]
8.0
ø0.25
0.38
6.75
0.75
8.00.18 to 0.28
1.0max.
6.75
Dimensions in mm
C
Solder
ball
Detail of ball
1098765432112345678910
A
B
C
D
E
F
G
H
J
K
A
B
C
D
E
F
G
H
J
K
A1 corner
marking
A1 corner
marking
0.10 C
100-ø0.25 to 0.35
Land & lead
Solder resist
Substrate
Opening size
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• GBDriver is a registered trademark of TDK Corporation
• CompactFlashTM is a trademark of SanDisk Corporation
Autres manuels TDK Carte réseau
Manuels Carte réseau populaires d'autres marques
3Com
3Com EtherLink 3C509B Manuel utilisateur
TRENDnet
TRENDnet TEG-PCITX Manuel utilisateur
Cisco
Cisco MC16E Manuel utilisateur
Delta Electronics
Delta Electronics Braking Modules VFDB Series Manuel utilisateur
TwinMOS
TwinMOS Booming Manuel utilisateur
Dialogic
Dialogic Media Board DM/V1200BTEPEQ Manuel utilisateur
Buffalo
Buffalo AirStation WLI-PCM-L11GP Manuel utilisateur
National Instruments
National Instruments NI 9234 Manuel utilisateur
Hama
Hama 49276 Manuel utilisateur
Linksys
Linksys WCF54G - Wireless-G Compact Flash Card Manuel d'utilisation
Compaq
Compaq Wireless LAN 100 Manuel utilisateur
Bose
Bose PowerMatch Dante Manuel utilisateur