Supermicro SSG-5049P-E1CR45L Manuel du propriétaire

Information for Lot 9 of ErP (Ecodesign)

This addendum addresses European Union (EU) Ecodesign requirements for servers and storage

products. All data and ratings within this addendum are in reference only to the Supermicro product(s) in

the manual. The below information conforms to requirements laid down in Annex II of the Commission

Regulation 2019/424.

3(1)(a): See Section 1.1 of the system manual for the product type.

3(1)(b): See the title page and preface of the system manual for the trademark and

manufacturer’s address.

3(1)(c): See the title page of the system manual for product model number(s).

3(1)(d): See the serial number on the physical system to determine the year of manufacture.

3(1)(e-j): PSU Efficiency and Power Factor Value (Table) (From 80 Plus report)

PSU Model #:

PWS-1K66P-1R

Watts: 1600

PSU Efficiency

Power Factor

% of Rated Load

10 %

20 %

50 % 100 %

50 %

Single Output (AC-DC)

91.60 %

93.84 %

94.30

91.23%

0.99

System (EUT) Efficiency in Idle State Power (Table)

Representative

Configurations

Measured Idle State

Power (W)

Calculated Idle Power

Allowance (W)

High-End Performance

Configuration

453.9

504.07

Typical Configuration

N/A

Low-End Performance

Configuration

105.4

168.63

System (EUT) Efficiency in Active State Power (Table)

Representative

Configurations

Active State

Efficiency Score

(Effserver)

Minimum Active State

Efficiency

High-End Performance

Configuration

11.8

Typical Configuration

N/A

Low-End Performance

Configuration

12.6

3(1)(k): The operating condition class is A2.

Dry bulb temp °C

Humidity range, non-condensing

Operati

conditi

Allowab

range

Reco

m

mend

Allowable range

Recommended

range

Max

dew

point (°

Maximu

m rate

change

15- 32

18-27

–

12 °C Dew Point (DP)

and

8 % relative

humidity (RH) to

17 °C DP and 80 % RH

–

9 °C DP to

15 °C DP

and

60 %

5/20

10-35

18-27

–

12 °C DP and 8 % RH

21 °C DP and 80 %

Same as A1

5/20

5-40

18-27

–

12 °C DP and 8 % RH

24 °C DP and 85 %

Same as A1

5/20

5-45

18-27

–

12 °C DP and 8 % RH

24 °C DP and 90 %

Same as A1

5/20

3(1)(l): The idle state power at the higher boundary temperature of the operating conditions

class is 535.60 W.

3(1)(m): The active state efficiency and performance is a minimum of 11.8.

3(1)(n): There are two methods by which a user can securely delete data from this system. The

user performing secure data deletion should be an IT professional.

The first is with a Unified Extensible Firmware Interface (UEFI) shell utility. This utility

works on X10/X11/H11/H12/M11 motherboard series with onboard SATA/NVMe devices.

Any user may access and download this utility through following link:

https://www.supermicro.com/about/policies/disclaimer.cfm?url=/wftp/utility/Lot9_Secure

_Data_Deletion_Utility/

Download the shell utility package and extract it to a USB flash drive, then plug the drive

into the server for which secure data deletion is necessary. Then turn the system on.

Navigate to the BIOS setup menu, then place the server system into the UEFI shell

environment. Follow the instructions in the README file to invoke the utility and

complete the deletion.

The second method is through the secure data deletion tool provided by the original

manufacturer of the hard drive. This should be used in a scenario where the shell utility

is not applicable. Each manufacturer should have the tool available on their website. If

needed, please look on the hard drive label for the name of the manufacturer and model

information.

3(1)(o): List of recommended combinations of blade servers with chassis: N/A.

3(1)(p): List of all current SKUs within this product family: SSG-6049P-E1CR45H, SSG-

6049PE1CR45L, SSG-6049P-E1CR45L+.

3(3)(a): There is no use of cobalt in batteries in this product.

The indicative weight range of neodymium in the HDD is 0.0 if manufactured by Western

Digital, and is between 5-25 grams if manufactured by Seagate.

3(3)(b): Please see the disassembly instructions on the next page.

Illustrated System Disassembly Instructions

Please note:

All the illustrations in the below disassembly instructions are for demonstration only.

Components shown here may not match exactly with the components in your system.

CAUTION: Always power off the system and unplug the power cord(s) first

before disassembling the system!

1. Data Storage Devices

Type and number of fastenings:

One (1) latch and four (4) Phillips screws.

Tools required:

Screwdriver with PH2 bit.

Procedure:

(Rear trays)

Push the release button on the carrier. Swing the handle fully. Grasp the

handle and pull the drive carrier out of its bay.

(Top trays)

Slide the release button on the drive

carrier to open the handle. Then use the handle to pull the drive carrier up and out of the

chassis.

2. Memory

Type and number of fastenings:

Two (2) latches per memory module.

Tools required:

None.

Procedure:

Press both release tabs on the ends of the memory module to unlock it. Once the

module is loosened, remove it from the memory slot.

3. Processor

Type and number of fastenings:

Four (4) T30 Torx screws.

Tools required:

Screwdriver with T30 Torx bit.

Procedure:

Remove the screws in the sequence of 4, then 3, then 2, then 1, as marked in the

illustration below. After removing the screws, lift the processor heatsink module off the processor

socket. Unsnap corners A and B, then C and D of the latch. Push the latch out from the bottom.

4. Motherboard

Type and number of fastenings:

Three (3) thumb screws, 10 Phillips screws, and three (3) fan

housings and airshroud to expose the motherboard. Nine (9) Phillips screws to remove the

motherboard.

Tools required:

Screwdriver with PH2 bit.

Procedure:

Unscrew the two thumb screws and four Phillips screws

(Fig. 1)

. Remove the dual

fan housing

(Fig. 2)

. Remove the three lower fans and the housing. Remove the top cover

airshroud by unscrewing the side thumb screw. Remove the top metal frame plate by unscrewing

the six side screws

(Fig. 3)

. The motherboard is now exposed. To remove it, remove the nine

Phillips screws. Lift the motherboard from its base

(Fig. 4)

Fig. 1

Fig. 2

Fig. 3

Fig. 4

5. Expansion Card

Type and number of fastenings:

One (1) Phillips screw and two (2) latches.

Tools required:

Screwdriver with PH2 bit.

Procedure:

Remove the Phillips screw. Then pull the card out while applying pressure on the

latches as shown by the two arrows below.

6. Power Supply Module

Type and number of fastenings:

One (1) latch per module.

Tools required:

None.

Procedure:

Unplug the power cord from the power supply. Push the release tab on the back of

the power supply module to the side and pull the module straight out.

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