Sun Microsystems Sun Fire E6900 Manuel utilisateur

All systems: If PCI+ I/O assemblies are to be mixed with CompactPCI I/O

assemblies, install the CompactPCI I/O assemblies only in IB8 or IB9 for

cooling purposes.

Sun Fire™ E6900/6800 systems only: When you install PCI+ I/O assemblies,

you can install them in either the top or bottom I/O locations. Populate the

I/O assemblies from right to left.

Note – Check with your Sun Service representative for compatibility of your

existing PCI adapters in your new assembly.

Location of I/O Assemblies

System Slot Numbers Slot Location

Sun Fire E6900/6800 System IB6, IB7, IB8, and IB9 Rear—bottom right and

left, top right and left

Sun Fire E4900/4800 System IB6, IB8 Rear—bottom and top

Sun Fire™E6900/E4900/6800/4800

Systems PCI+ I/O Assembly

Installation Guide

Firmware and OS Minimum Requirements

Note – If your system requires a software upgrade and a firmware upgrade,

upgrade the firmware first. Upgrade the software second. Install new PCI+ I/O

assemblies only after you have upgraded the firmware and software.

Sun Fire E6900/E4900 systems and upgraded Sun Fire 6800/4800 systems

require these versions:

■Firmware level 5.16.0 or subsequent compatible versions.

■Solaris 8 2/04 Operating System or subsequent compatible versions.

■SPARC III based systems require Solaris 8u7 + latest KU + patch

109873-21. Refer to the SunSolve patch portal at sun.com for the patch

and the latest detail.

Removing a PCI I/O Assembly

1. Power off your system.

Refer to the Sun Fire Midrange Systems Platform Administration Manual

for complete procedures for powering off the assembly.

2. Place a grounded ESD mat close to the system.

3. Attach a wrist strap or foot strap. Connect the ESD strap to the system.

4. Completely loosen the four captive Phillips screws

5. Simultaneously pull the two ejector levers outward to unseat the

I/O assembly.

This action releases the board from the connectors.

6. Remove the assembly from the card cage.

7. Place the I/O assembly on an ESD mat that is on a work surface.

Installing a PCI+ I/O Assembly

1. Line up the I/O assembly with the I/O assembly opening.

2. Slide the I/O assembly into the I/O assembly opening.

The ejector levers should be on the inside of the I/O assembly and in the

open position.

Caution – DO NOT FORCE any assembly into a slot; this can cause

damage to the assembly and system. The assembly should insert and

seat smoothly. If it binds, remove the assembly and inspect the card

cage slot for any obvious obstructions.

3. Simultaneously press the two ejector levers inward.

4. Tighten the four captive Phillips screws.

5. Power on the system.

Refer to the Sun Fire Midrange Systems Platform Administration Manual

for complete system procedures for powering on the assembly.

Note – After the system has been powered on, the Activated LED should be

on (lit).

Ejector lever

Captive

screws (4)

Sun Microsystems, Inc.

www.sun.com

Part No. 819-0225-10, Rev. A

September 2004

Accessing Sun Documentation

You can view, print, or purchase a broad selection of Sun documentation,

including localized versions, at:

http://www.sun.com/documentation

Contacting Sun Technical Support

If you have technical questions about this product that are not answered in this

document, go to:

http://www.sun.com/service/contacting

Sun Welcomes Your Comments

Sun is interested in improving its documentation and welcomes your

comments and suggestions. You can submit your comments by going to:

http://www.sun.com/hwdocs/feedback

Please include the title and part number of your document with your feedback:

Sun Fire E6900/E4900/6800/4800 Systems PCI+ I/O Assembly Installation Guide,

part number 819-0225-10

technology, is copyrighted and licensed from Sun suppliers. Portions may be derived from Berkeley BSD systems, licensed from

U. of CA. Sun, Sun Microsystems, the Sun logo, Sun Fire, and Solaris are trademarks or registered trademarks of Sun

Microsystems, Inc. in the U.S. and in other countries. All SPARC trademarks are used under license and are trademarks or

registered trademarks of SPARC International, Inc. in the U.S. and in other countries. U.S. Government Rights—Commercial

use. Government users are subject to the Sun Microsystems, Inc. standard license agreement and applicable provisions of the

FAR and its supplements.

logiciel détenu par des tiers, et qui comprend la technologie relative aux polices de caractères, est protégé par un copyright et

licencié par des fournisseurs de Sun. Des parties de ce produit pourront être dérivées des systèmes Berkeley BSD licenciés par

l’Université de Californie. Sun, Sun Microsystems, le logo Sun, Sun Fire, et Solaris sont des marques de fabrique ou des

marques déposées de Sun Microsystems, Inc. aux Etats-Unis et dans d’autres pays. Toutes les marques SPARC sont utilisées

sous licence et sont des marques de fabrique ou des marques déposées de SPARC International, Inc. aux Etats-Unis et dans

d’autres pays.

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