Sony TRINITRON KV-J25MF8J Manuel utilisateur

MODEL COMMANDER DEST. CHASSIS NO.

KV-J25MF8J

RM-873 ME SCC-K57P-A

MODEL COMMANDER DEST. CHASSIS NO.

KV-J29MF8J

RM-873 ME SCC-K57N-A

CHASSIS

TRINITRON

COLOR TV

BG-1L

SERVICE MANUAL

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Note

Power requirements 110-240 VAC, 50/60 Hz

Power consumption (W) Indicated on the rear of the TV

Television system B/G, I, D/K, M

Color system PAL, PAL 60, SECAM, NTSC4.43, NTSC3.58

Channel coverage

B/G VHF: E2 to E12 / UHF: E21 to E69 / CATV: S01 to S03, S1 to S41

IUHF: B21 to B68 / CATV: S01 to S03, S1 to S41

D/K VHF: C1 to C12, R1 to R12 / UHF: C13 to C57, R21 to R60

CATV: Z1 to Z39, S01 to S03, S1 to S41

MVHF:A2 to A13 / UHF: A14 toA79 /

CATV: A-8 to A-2, A to W+4, W+6 to W+84

Antenna 75-ohm external terminal

Audio output (speaker) 6W + 6W

Number of terminal

Video Input: 3 Output:1 Phono jacks; 1 Vp-p, 75 ohms

Audio Input: 3 Output: 1 Phono jacks; 500 mVrms

S Video Input: 1 Y : 1 Vp-p, 75 ohms,

unbalanced, sync negative

C : 0.286 Vp-p, 75 ohms

Headphone Output: 1 Minijack

Picture tube Super Trinitron Super Trinitron Plus

(25 in.) (29 in.)

Tube size (cm) 64 72 Measured diagonally

Screen size (cm) 60 68 Measured diagonally

Dimension (w/h/d, mm) 712 ×521 ×520 780 ×577 ×542

Mass (kg) 33 43

Accessory (optional) TV stand (SU-25H) TV stand (SU-29H)

SPECIFICATIONS

CAUTION

SHORT CIRCUIT THE ANODE OF THE PICTURE TUBE

AND THE ANODE CAP TO THE METAL CHASSIS, CRT

SHIELD, OR CARBON PAINTED ON THE CRT, AFTER

REMOVING THE ANODE.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY SHADING AND MARK !

ON THE SCHEMATIC DIAGRAMS, EXPLODED VIEWS AND

IN THE PARTS LISTARE CRITICALTO SAFE OPERATION.

REPLACE THESE COMPONENTS WITH SONY PARTS

WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS

MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

KV-J25MF8J KV-J29MF8J

Design and specifications are subject to change without notice.

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TABLE OF CONTENTS

Section Title Page

1. GENERAL........................................................................ 4

2. DISASSEMBLY

2-1. Rear Cover Removal................................................ 11

2-2. Speaker Removal ..................................................... 11

2-3. ChassisAssy Removal ............................................. 11

2-4. Service Position ....................................................... 12

2-5. S1 Board Removal ................................................... 12

2-6. A and D Boards Removal ........................................ 12

2-7. F1 and H3 Boards Removal..................................... 13

2-8. Picture Tube Removal.............................................. 13

3. SET-UP ADJUSTMENTS

3-1. Beam Landing.......................................................... 15

3-2. Convergence............................................................. 16

3-3. FocusAdjustment .................................................... 19

3-4. G2 (Screen) and White BalanceAdjustments......... 20

4. SELF DIAGNOSIS FUNCTION................................ 21

5. CIRCUIT ADJUSTMENT

5-1. Adjustments with Commander ................................ 22

5-2. Adjustment Method ................................................. 23

5-3. Picture Quality Adjustment ..................................... 27

5-4. A Board Adjustment ................................................ 27

5-5. ABoardAdjustyment After IC003 (Memory)

Replacement............................................................. 28

5-6. Picture Distortion Adjustment ................................. 28

Section Title Page

6. DIAGRAMS

6-1. Block Diagram ......................................................... 29

6-2. Frame Schematic Diagram ...................................... 31

6-3 Circuit Boards Location .......................................... 34

6-4. Schematic Diagrams and Printed Wiring Boards.... 34

(1) Schematic Diagrams of D, F1 and H3 Boards ........ 35

(2) Schematic Diagram of A Board............................... 43

(3) Schematic Diagram of S1 Board ............................. 50

(4) Schematic Diagram of C2 Board ............................ 53

(5) Schematic Diagrams of VM Board ......................... 55

6-5. Semiconductors........................................................ 57

7. EXPLODED VIEWS

7-1. Picture Tube ............................................................. 59

7-2. Chassis ..................................................................... 60

8. ELECTRICAL PARTS LIST....................................... 61

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SECTION 1

GENERAL The operating instructions mentioned here are partial abstracts from

the Operating Instruction Manual. The page numbers of the

Operating Instruction Manual remain as in the manual.

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