Sony DVP-S300 Guide d'installation

S®

Training Manual

Troubleshooting

Course: DVD-03

Digital Video Player

Sony DVD Players

Models: DVP-S300 DVP-S570d

DVP-S330 DVP-C600d

DVP-S350 DVP-C650d

DVP-S360 DVP-C660

DVP-S500d DVP-C670d

DVP-S530d DVP-S3000

DVP-S550d DVP-S7000

DVP-S560d DVP-S7700

Model Gen Intro Year MSRP Optical RF Amp ARP A/V Decod A DSP Servo DSP

DVP S300 2 1997 $599.99 KHS180A SSI33P3720A CXD1865R L6402GQC27 MB86342PF CXD8730R

DVP S330 3 1999 $349.00 KHM220AAA SSI33P3722 CXD8784R CXD1930G none CXD8791Q

DVP S350 4 2000 $ KHM220AAA SSI33P3722 CXD9576R CXD1932Q none CXD9569R

DVP S360 4 2000 $299.00 KHM220AAA SSI33P3722 CXD9576R CXD1932Q none CXD9569R

DVP S500d 2 1997 $599.99 KHS180A SSI33P3720A CXD1865R L6402GQC27 MB86342PF CXD8730R

DVP S530d 3 1999 $499.00 KHM220AAA SSI33P3722 CXD8784R CXD1930G CXD1901R CXD8791Q

DVP S550d 3 1999 $599.00 KHM220AAA SSI33P3722 CXD8784R CXD1930G CXD1901R CXD8791Q

DVP S560d 4 2000 $399.00 KHM220AAA SSI33P3722 CXD9576R CXD1932Q CXD1939R CXD9569R

DVP S570d 4 2000 $599.00 KHM220AAA SSI33P3722 CXD9576R CXD1932Q CXD1939R CXD9569R

DVP C600d 2 1998 $699.00 KHS180A SSI33P3720A CXD1865R L6402GQC27 MB86342PF CXD8730R

DVP C650d 3 1999 $599.00 KHM220AAA SSI33P3722 CXD8784R CXD1930BQ CXD1901R CXD8791Q

DVP C660 4 2000 $449.00 KHM220AAA SSI33P3722 CXD9576R CXD1932Q CXD1939R CXD9569R

DVP C670d 4 2000 $549.00 KHM220AAA SSI33P3722 CXD9576R CXD1932Q CXD1939R CXD9569R

DVP S3000 1 1997 $699.00 KHS180A SSI33P3720A discrete ICs CXD2545Q

DVP S7000 1 1996 $999.00 KHS180A SSI33P3720A discrete ICs none CXD2545Q

DVP S7700 2 1998 $999.00 KHS180A SSI33P3720A CXD1865R L6402GQC27 none CXD8730R

Gen = Generation based upon internal ICs used.

MSRP = Manufacturer’s Suggested Retail Price (List price)

ARP = Advanced RF Processor (analog input, separate digital DVD & CD process, spindle motor control)

A/V Decod = (MPEG) Audio/Video Decoder

A DSP = Audio Digital Sound Processor (Dolby AC-3 decoding)

Servo DSP = Focus, Trackin

, Sled Di

ital Servo Processor

Internal IC Numbers

How to Use This Book 2

Modern Soldering Techniques 3

IC Removal - Which Method? 3

IC Installation 7

First Generation DVD Players

Symptom 1 - Intermittent loss of brighness during PB 11

Symptom 2 - No color or color change hue 13

Symptom 3 - No DVD disc detected at start up. CD PB OK 17

Symptom 4 - Intermittent or distorted DVD audio 19

Symptom 5 - No PB or picture freeze on some dual layer discs 21

Second Generation DVD Players

Symptom 1 - No response to the Power ON button 23

Symptom 2 - Powers OFF two seconds after turn ON 27

Symptom 3 - Plays CD, but not DVD discs 31

Symptom 4 - No PB. Disc stops spinning 33

Symptom 5 - One color, picture distortion or dark screen 35

Third Generation DVD Players

Symptom 1 - Green Power light does not stay ON 37

Chip Select Waveforms 48

Symptom 2 - Audio distortion after warm-up 51

Symptom 3 - Spindle motor rotates immediately at Power

ON. No tray open 53

Table of Contents

Symptom 4 - Unit powers OFF during PB or if left ON 55

Symptom 5 - Picture freezes or powers OFF trying to PB

dual layer discs 57

Symptom 6 - DVD-C650 only - Powers ON, but no buttons

work. Error code E27 displayed 59

Symptom 7 - DVP-C650 only - Tray does not rotate 61

Symptom 8 - Tray does not Eject. Displays “LOCKED” 62

Fourth Generation DVD Players

Symptom 1 - No PB. Display = “No disc” or “C:13:00” 63

Symptom 2 - Powers OFF after powering ON 65

Symptom 3 - The tray open button has no effect 65

Symptom 4 - No chroma from the S video output jack 67

Symptom 5 - Digital picture blocks during the movie 71

Symptom 6 - Tray does not Eject. Displays “LOCKED” 72

Test Mode - Third Generation 73

Test Mode Access 73

Tests 73

Appendix

Service Bulletin List i

Service Bulletins iii

NOTES

How to Use This Book

Purpose

DVD players and camcorders have moved into the digital age where sig-

nal routing is less important than IC communications. You can learn a

little about how ICs communicate and add to your service strategy for

DVD player repairs by examining previous DVD player failures that have

occurred across the USA.

Book Structure

This book is organized into five sections:

1. List of DVD Models categorized into generations

2. Table of Contents

3. Modern Soldering Methods

4. Common Symptoms for Sony DVD Players:

First Generation

Second Generation

Third Generation

Fourth Generation

5. Service Bulletins

List of DVD Models categorized into generations

Locate the DVD player you are working on in the chart and note the gen-

eration it falls in.

Modern Soldering Methods

Even though the technician has identified the defective part, the repair

cannot be completed unless the old part is removed without damaging the

board and the new part installed without solder bridges. This skill can

only be acquired by following all the steps that other technicians have

mastered.

Common Symptoms for DVD Players

DVD repairs across the USA were examined and repetitive symptoms

were extracted. For each common symptom, a strategy was developed

to determine which part has failed. This was done to each of the four

generations of DVD players.

Service Bulletins

The first page in this group contains a list of the DVD bulletins, a descrip-

tion of each bulletin, and the models to which the bulletin pertains. This

list is followed by the DVD service bulletins to date.

Using this Book

1. Go to the “DVD Model List” before the Table of Contents.

2. From the DVD Model List, find your DVD model and note the genera-

tion it falls under.

3. Return to the Table of Contents to find the first, second, third or fourth

generation heading that corresponds to your DVD player.

4. Match the symptoms of your DVD player to the ones listed.

5. Go to the corresponding page for the troubleshooting information.

Mechanical problems like broken gears are not listed.

If your symptom is not listed, you do not have a common problem.

Modern Soldering Techniques

This section is an excerpt from the Sony videotape (p/n T-MODSOL-9) by

the same name. This document only shows how to remove and install

multi-pin ICs used on many Sonyproducts. The removal of these fine

lead large-scale integrated circuits (LSI) requires modern methods. After

replacing the IC, checking each pin for solder bridges is essential to pre-

vent IC damage.

ICRemoval -Which method?

Choose one of three methods for removing the ICs based upon the den-

sity of parts about the defective IC.

Cutting the IC’s leads in a high-density board is the best method for IC

removal. If there are many small parts about the defective IC the hot air

and Chip Quick removal methods may desolder local components. If you

choose the chip quick method, keep solder to a minimum on the IC pins.

Use the CUT OUT IC removal method when there

are many parts surrounding the IC

IC Removal - Cut Out method

This method requires a minimum of tools to cut the legs off the IC and

clean the board:

•Knife

•cutters

•dental pick

•soldering iron

•solderwick

Use a sharp knife blade each time you remove an IC because the knife

was not originally intended to cut metal. Break off the old blade segments

of knife before cutting to expose a new sharp blade.

1. You must place the new blade at the legs where they meet the IC

body. Angle the blade into the body slightly to avoid slipping off the IC

legs.

Blade

2. Along the IC legs, hold the knife at a shallow 20 - 30 degree angle.

3. Place your finger above the blade for control as you press down and

rock the blade down.

20-30 degrees

4. You should apply enough pressure to shear off 4-5 legs as you rock

the blade while pressing down. DO NOT let the blade point touch the

board.

5. Reposition the blade back along the legs and repeat. Do not cut the

last leg off or you will lose control and the blade point will hit the board.

Use cutters to nip these last IC legs or unsolder and lift the leg with a

dental pick. Remove the IC body.

6. Use a standard soldering iron to heat and push the legs off the lands.

Push only in the direction of the lands so they are not damaged.

Wipe across

the land

IC Lands

7. Remove the solder on the lands using a solder wick looped about the

soldering iron for better control.

IC Removal - Hot Air method

This method requires the following:

•Hot Air Controller

•Desoldering Tips

•Flux Pen

•Tweezers

In the following steps you will use the Hot Air Controller to heat up all the

pins while you lift the IC off the board with tweezers.

1. Apply flux from a pen to remove the oxide layer from the IC pins dur-

ing heating. Removing the oxide establishes a uniform temperature

on all the IC pins for removal and prevents an IC leg from still being

attached to the land when lifting the IC. These low residue pens are

made by Kester and distributed by companies such as

www.mcmelectronics.com andwww.newark.com.

2. If you cannot find a hot air tip that will cover the IC, attach a single

1/8” (0.125”) diameter tip that will heat all the pins if you move the tip

around the IC pins.

3. Start at 0 air flow and maximum heat so the tip will warm up fast.

4. After warm up increase the air flow slightly (to #1 of 10) and position

the hot air tip over the pins of the IC. Do not touch the IC with the tip.

Count the nearby components and make sure they do not move away

by controlling the airflow. Insert tweezers at the corner of the IC.

5. Gently lift the IC with the tweezers.

6. Remove the solder on the lands using a solder wick looped about the

soldering iron for better control.

IC Removal - Hot Air method using butane torch

The hot air controller is effective, but expensive. The butane torch is

similarinperformanceandinexpensive(about$100). InWeller’sPyroPen,

hot air comes from a controlled flame.

Put safety goggles on before using the butane torch. Circle the IC leads

with the torch flame and flip the IC over when the IC is loose.

IC Removal - Chip Quick Method

Chip Quick is a low temperature solder that remains molten longer than

ordinary solder, giving you time to unsolder the IC. Chip Quick is best for

removing medium to large scale ICs when there are few parts about the

IC. This method takes about the same time as the hot air method and

requires about the same level of skill.

The Chip Quick package (P/N = T99856421) contains:

•Low Temperature Solder

•Flux

•Wick

1. Apply the Chip Quick flux to all the leads of the IC. (Medium size IC

shown for removal).

2. Melt the Chip Quick solder along the IC leads. Keep the solder molten

by running your iron along the IC leads.

3. Insert tweezers and lift the IC up.

4. Remove the blobs of Chip Quick by heating and removing with a solder

sucker.

5. The remaining Chip Quick is removed with a solder wick. Move the

wick in the same direction as the lands of foil.

IC Installation

Once the solder and bridges are cleaned off with a solder wick, the new

IC can be installed. You must prevent static charges from damaging the

new IC by using a grounded wrist strap. The amount of static electric you

generate depends upon the humidity level and the clothing worn that day.

Some days you will not generate enough static electricity to damage the

new IC.

To solder all the IC leads without creating bridges, you need a constant tip

temperature soldering iron.

The constant tip temperature makes soldering uniform and increases the

speed of the soldering so you don’t have to resolder missed leads. Since

these constant tip temperature irons have a 5-10 second warm-up time

there is no reason to leave these irons on when in use.

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