Sony TA-FB740R Manuel utilisateur
1
AEP Model
UK Model
E Model
Australian Model
SPECIFICATIONS
SERVICE MANUAL
INTEGRATED STEREO AMPLIFIER
TA-FB740R
Amplifier section
DIN power output
100 W + 100 W (4 Ωat 1 kHz)
60 W + 60 W (8 Ωat 1 kHz)
Total harmonic distortion
Less than 0.008% (at 10 W output 1 kHz)
Frequency response
PHONO (20 Hz - 20 kHz): RIAA equalization curve
±0.5 dB
TUNER, SACD/CD, AUX, TAPE1/DAT, TAPE2/MD:
7 Hz - 300 kHz
+0
–3
dB
S/N (network A)
PHONO
TUNER, SACD/CD, AUX, TAPE1/DAT, TAPE2/MD:
105 dB
90 dB
Output voltage/impedance
REC OUT 1, 2: 150 mV, 1 kΩ
PHONES: 10 mW (at 8 Ω)
Speakers impedance
4 - 16 Ω, 8 - 16 Ω(SPEAKERS A+B)
Damping factor
500 (8 Ω, 1 kHz)
General
System
Power amplifier: Pure-complementary SEPP OCL
power amplifier with all stages directly coupled
Preamplifier: Low-noise, equalizer amplifier
Power requirements
230 V AC, 50/60 Hz
Power consumption
180 W
Dimensions (approx.) (w/h/d)
430 ×150 ×420 mm
incl. projecting parts and controls
Mass (approx.)
8.6 kg
Supplied accessories
•Remote commander (remote) (1) RM-S336
•Sony batteries R6 (size-AA) (2)
Design and specifications are subject to change without
notice.
2
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINE
WITH MARK 0ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
TABLE OF CONTENTS
1. GENERAL .......................................................................... 3
2. ELECTRICAL ADJUSTMENT ..................................... 4
3. DIAGRAMS
3-1. Circuit Boards Location ........................................................ 5
3-2. Schematic Diagram –Input Section –.................................. 6
3-3. Printed Wiring Board –Input Section –................................ 7
3-4. Schematic Diagram –Main Section –.................................. 8
3-5. Printed Wiring Board –Main Section –................................ 9
3-6. Schematic Diagram –Panel Section –................................ 10
3-7. Printed Wiring Board –Panel Section –............................. 11
3-8. Schematic Diagram –Power Section –............................... 12
3-9. Printed Wiring Board –Power Section –............................ 13
3-10. IC Block Diagrams ............................................................ 14
3-11. IC Pin Function ................................................................. 14
4. EXPLODED VIEW
4-1. Case Section ........................................................................ 15
4-2. Front Panel Section ............................................................. 16
4-3. Chassis Section ................................................................... 17
5. ELECTRICAL PARTS LIST ........................................ 18
3
Front Panel Descriptions
SECTION 1
GENERAL
This section is extracted from
instruction manual.
Rear Panel Descriptions
SPEAKERS
EON CONTROL
R
B
A
L
++––
RL
++––
TAPE1/DAT
L
REC OUT IN
IMPEDANCE USE 4–16Ω
A+B USE 8–16Ω
BI WIRE USE 4–16Ω
IN
R
L
R
TAPE2/MD
REC OUT IN
AUX
IN
SACD/
CD
IN
TUNER
IN
L
R
PHONO
IN
SIGNAL
GND
U
AC OUTLET
SWITCHED 100W MAX
42 3 51
0qa 9 8 7 6
1PHONO
2U(SIGNAL GND)
3SPEAKERS A/B
6Mains lead
7TAPE1/DAT
8TAPE2/MD
4EON CONTROL IN
5AC OUTLET
(Except UK, Singapore, Malaysia)
9AUX
0SACD/CD
qa TUNER
1PROTECTION indicator
2POWER button
3Remote sensor
4TAPE 1/DAT indicator
5TAPE 2/MD indicator
6AUX indicator
7CD indicator
8TUNER indicator
9PHONO indicator
10 INPUT SELECTOR knob
11 VOLUME knob
12 SUBSONIC button
13 SOURCE indicator
14 SOURCE DIRECT button and indicator
15 LOUDNESS button
16 TAPE MONITOR knob
17 BALANCE knob
18 TREBLE knob
19 BASS knob
20 SPEAKERS knob
21 PHONE jack
22 EON LINK button
23 EON LINK indicator
22
23
13 12
1415
16
1718
19
20
21
3
2
1
978465
10
11
4
SECTION 2
ELECTRICAL ADJUSTMENT
Bias Adjustment
NOTE:
1. Perform the adjustment after the unit has warmed up sufficiently.
2. Perform the bias adjustment if the power transistor has been
replaced.
Procedure:
1. Rotate fully the bias adjusting semi-fixed resistors (RV500,
RV600) to the MIN position (counterclockwise).
2. Connect a digital voltmeter to the CN500 and CN600.
1 pin 2 pin
–
–
+
+
CN500 (L-CH)
CN600(R-CH)
3. Set the slide regulator to 0V, and press the POWER button
(ON) on the set.
4. Raise gradually the slide regulator voltage up to the rated voltage.
5. At this time, confirm that the SP relay is turned on (it will click).
6. Adjust the RV500 and RV600 so that a reading of digital
voltmeter is 7 ± 1 mV.
7. Return the slidack to 0 V, and press the POWER button (OFF)
on the set.
Adjustment Location :
[MAIN BOARD] – COMPONENT SIDE –
+
CN600
(R-CH)
CN500
(L-CH)
12
21
RV600
Bias (R-CH)
RV500
Bias (L-CH)
DIGITAL
VOLTMETER
DIGITAL
VOLTMETE
R
+
55
SECTION 3
DIAGRAMS
3-1. CIRCUIT BOARDS LOCATION THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed
in each block.)
For schematic diagrams.
Note:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ωand 1/4W or less unless otherwise
specified.
•f: internal component.
•2: nonflammable resistor.
•5: fusible resistor.
•C: panel designation.
For printed wiring boards.
Note:
•X: parts extracted from the component side.
•Y: parts extracted from the conductor side.
•b: Pattern from the side which enables seeing.
•U: B+ Line.
•V: B– Line.
•H: adjustment for repair.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : POWER ON
• Voltages are taken with aVOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F: TUNER
WAVEFORM
1
IC902 1XOUT
• Indication of transistor
C
These are omitted
EB
4MHz
3.8Vp-p
PANEL board
INPUT board
MAIN board
SP-TM board
PHONO boar
d
PS board
OUTLET board
(EXCEPT UK, SP, MY)
VOL board
SIRCS board
SIRCS SUB board
HP board
SP-SW board
•Abbreviation
G : German model
SP : Singapore model
MY : Malaysia model
AUS : Australian model
EE : East European model
Note: The components identified by mark 0or dotted line
with mark 0are critical for safety.
Replace only with part number specified.
66
TA-FB740R
3-2. SCHEMATIC DIAGRAM –INPUT SECTION –•See Page 14 for IC Block Diagrams.
(Page 8)
(Page 10)
(Page 10)
*
C101–105
C201–205
2SD2525
470
470
R140
R240
82 1W
82 1W
63V
63V
10
10
22
22
2SB1640
,MY
,MY
,MY
JW12
JW12
MODEL
,MY
MODEL
16V
16V
EXCEPT UK, SP, MY
*
*
*
*
*
*
*
*
*
*
Note: The components identified by mark 0or dotted line
with mark 0are critical for safety.
Replace only with part number specified.
77
TA-FB740R
91111
3-3. PRINTED WIRING BOARD –INPUT SECTION –•See page 5 for Circuit Boards Location.
Ref. No. Location
•Semiconductor
Location
(INPUT Board)
D100 D-5
D101 D-4
D102 D-4
D103 C-4
D104 B-4
D105 A-4
D106 A-4
D107 D-5
D108 C-7
D140 C-9
D240 C-9
Q100 C-6
Q101 C-6
Q102 C-6
Q103 C-7
Q104 C-7
Q105 C-7
Q140 C-9
Q240 D-9
Ref. No. Location
•Semiconductor
Location
(PHONO Board)
D170 B-1
IC150 A-2
Q150 A-3
Q151 A-3
Q250 B-3
Q251 B-3
88
TA-FB740R
3-4. SCHEMATIC DIAGRAM –MAIN SECTION –•See page 14 for IC Block Diagrams.
EXCEPT UK, SP, MY
EXCEPT
UK, SP, MY
99
TA-FB740R
3-5. PRINTED WIRING BOARD –MAIN SECTION –•See page 5 for Circuit Boards Location.
Ref. No. Location
•Semiconductor
Location
(SP-TM Board)
D511 E-3
D512 E-3
D513 F-4
D700 A-2
D701 A-2
D702 B-2
IC700 B-3
Q700 A-4
Q701 C-2
D500 C-11
D501 C-11
D502 C-11
D503 D-11
D504 D-11
D505 D-10
D506 D-5
D507 C-6
D600 F-11
D601 F-11
D602 F-11
D603 F-11
D604 F-11
D605 F-10
D606 E-5
D607 D-5
D703 F-5
IC701 E-10
Q500 C-12
Q501 D-12
Q502 D-12
Q503 D-12
Q504 D-12
Q505 D-12
Q506 C-10
Q507 D-11
Q508 D-11
Q509 D-11
Q510 D-10
Q511 D-9
Q512 D-9
Q513 C-6
Q514 C-9
Q515 C-7
Q516 D-6
Q600 F-12
Q601 F-12
Q602 F-12
Q603 E-12
Q604 F-12
Q605 F-12
Q606 F-10
Q607 F-11
Q608 F-11
Q609 F-11
Q610 F-10
Q611 F-9
Q612 F-9
Q613 F-9
Q614 F-6
Q615 F-7
Q616 E-5
Q702 F-5
Ref. No. Location
•Semiconductor
Location
(MAIN Board)
10 10
TA-FB740R
3-6. SCHEMATIC DIAGRAM –PANEL SECTION –•See page 5 for Waveforms. •See page 14 for IC Block Diagram. •See page 14 for IC Pin Function.
(Page 6)
(Page 8)
(Page 6)
(Page
8)
(Page 8)
0.01
*
*
*
*
R807-810
SACD/CD
SACD/CD
*
390: AEP,G,EE,CIS,AUS
330: UK,SP,MY
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