Samsung MM-77 Manuel utilisateur

MICRO

COMPONENT

SYSTEM

MM-77

S

ERVIC

Manual

i

MICRO

COMPONENT

SYSTEM

APF

CCAUT

ON

-csateistans

doce

Sale

dtaaaroeeeacsanrs

1~9

2;

SDOCITICATION

a:iinescetcctevecdav

unten

10

3.

Location

of

controls

........ccee

11~13

4.

Disassembly

instruction............

14~15

5.

Basic

circuit

operation...............

16~17

6.

TroubleSHOOTING

......ecceseeeeeeeees

18~26

FAQUUSUMIENT

siasrmiccihddiariereds

27~32

8.

Block

diagram........ccessseseseees

33~34

a

—

“SSE

vec

]

9.Exploded

view

&

parts

list........

35~41

10.Schematic

diagram...

42~44

11.PCB

Pattern

and

Marking

HAGMAN

asia

ste

senetuetrsannslncensadagenas

45~48

12.

Wiring

diagram

.....cccccccseseeeeeeeeens

49

13.IC

&

TR

internal

diagram

..........

50~57

14.

Electrical

parts

list...

eee

58~67

15.

List

of

Abbreviation

..........cccceeeees

68

*Design

and

specification

are

subject

to

change

upon

improvement

without

prior notice.

1.

Safety

precaution

1-1.

Class

1

laser

product

This

laser

disc

player

is

classified

as

a

CLASS

1

laser

product.

1-2.

Laser

warning

label

The

label

shown

below

may

be

affixed

or

not

according

to

country.

(UL)

(CSA)

(EU)

This

Product

Complies

with

CERTIFIED

ONLY

TO

CANADIAN

DHHS

Rules

21CFR,

Sub

ELECTRICAL

CODE.

chapter

J.At

date

of

Manu-

CLASS

1

facture

CERTIFIE

EN

VERTU

DU

CODE

LASER

PRODUCT

CANADIAN

DE

LELETRICITE

SEULEMENT

L

Location:

Enclosure

back.

(SCAN)

CAUTION

!

invisi8Le

LASER

RADIATION

WHEN

OPEN

AND

INTERLOCKS

DEFEATEO

AVOIDEXPOSURE

TO

BEAM

(EU)

ADVARSEL

USYNLIG

LASERSTRALING

VED

ABNING

NAR

SIKKERHEDSAFBRYDERE

ER

UDE

AF

FUNKTION

UL

:

Manufactured

for

U.S.A.

Market.

CSA

__

:

Manufactured

for

Canadian

Market.

UNDGAUDSAETIELSE

FOR

STRAUNG

EU

:

Manufactured

for

European

Market.

VARO:AVATTAESSA

JA

SUOJALUKITUS

OHITETTAESSA

;

‘

OLET

ALTTINA

NAKYMATTOMALLE

LASERSATEILYLLE

ALA

SCAN

:

Manufactured

for

Scandinavian

KATSO

SATEESEEN!

Market

arket.

VARNING\OSYNUG

LASERSTRALNING

NAR

DENNA

DEL

AR

OPPNAD

OCH

SPARREN

AR

URKOPPLAD

BETRAKTA

EJSTRALENI

Location

:

on

the

disc

clamper

or

inner

side

of

UNIT

door

or

nearby

UNIT

chassis.

1-3.Laser

beam

warning

1-4.

1-5.

ADVERSEL

-Usynlig

saserstraling

ved

abning,

nar

Sikkerhedsafbrydere

er

ude

af

funktion.

Undga

udsaettelse

for

straling.

VARNING

-Osylig

laserstralning

nar

denna

del

ar

Gppnad

och

sparr

ar

urkopplad.

Stralen

ar

farlig.

VARITUS

-Laite

sisaltaa

laserdiodin,

joka

lahettaa

nakymatonta

silmille

vaarallista

lasersateilya.

CAUTION

-Invisible

laser

radiation

when

door

is

open

and

interlocks

defeate.

Avoid

exposure

to

beam.

Laser

diode

specification

(Optical

pick-up)

¢

Material

:

GaAs+GaAlAs

*

Wavelength

:

760-800nm

*

Emission

duration

:

Continuous

*

Laser

Output

:

0.2mW

*

This

output

is

the

value

measured

at

distance

1.6mm

from

the

objective

lens

surface

on

the

optical

pick-

up

block.

*

Classification

:

CLASS

1

Warning

for

servicing

WARNING:

When

servicing,

do

not

approach

the

LASER

exit

with

the

eye

too

closely.

In

case

it

is

necessary

to

confirm

LASER

beam

emission,

be

sure

to

observe

from

a

distance

of

more

than

30cm

from

the

surface

of

the

objective

lens

on

the

optical

pick-up

block.

VARNING:

Nar

underhailningsarbeten

utfors,

narma

dig

forsiktigt

och

se

inte

pa

laserutstralningen

pa

for

nare

hall.

If

all

det

ar

n6dvandigt

att

betrygga

laserstralens

utstromning.

Var

saker

att

kontrollera

detta

fran

ett

avstaand

av

mer

an

30cm

(11.81

inch.)

fraan

den

objektiva

linsens

yta

pa

den

optiska

utsandningspunkten.

ADVARSEL:

Nar

repareringsarbejdet

udfoeres,

naerm

dig

forsigtigt

og

se

ikke

pa

laserudstralingen

paa

for

naer

haand.

“t

ilfaeldet

at

det

er

noedvaendigt

at

bestemme

laserstralens

udstraling.

Vaer

sikker

pa

kontrollere

dette

fra

en

afstand

af

mere

end

30cm

(11.81

inch.)

fra

den

objektive

linses

overflade

pa

den

optiske

udsendningspunkt.

VAROITUS:

Silmia

on

varottava

viemasta

liian

labeile

laser-poistokanavaa

huoiion

aikana.

Jos

on

valttamatonta

varmistaa

Laser-Sateen

paasto,

pysyttels

sita

tarkasteltaessa

vahintaan

30cm

etaiyydella

optisen

lukon

objecktiivilinssin

pinnasta..

MM-77

—1—

1-1-6.

(2

—

(3)

MM-77

Before

returning

an

instrument

to

the

customer,

always

make

a

safety

check

of

the

entire

instrument,

including,

but

not

limited

to,

the

following

items:

Be

sure

that

no

built-in

protective

devices

are

defective

or

have

been

defeated

during

servicing.

(1)

Protective

shields

are

provided

to

protect

both

the

technician

and

the

customer.

Correctly

replace

all

missing

protective

shields,

including

any

remove

for

servicing

convenience.

(2)

When

reinstalling

the

chassis

and/or

other

assembly

in

the

cabinet,

be

sure

to

put

back

in

place

all

protective

devices,

including,

but

not

limited

to,

nonmetallic

control

knobs,

insulating

fishpapers,

adjustment

and

compartment

covers/shields,

and

isolation

resistor/

capacitor

networks.

Do

not

operate

this

instrument

or

permit

it

to

be

operated

without

all

protective

devices

correctly

installed

and

functioning.

Be

sure

that

there

are

no

cabinet

openings

throught

which

adults

or

children

might

be

able

to

insert

their

fingers

and

contact

a

hazardous

voltage.

Such

openings

include,

but

are

not

limited

to,

excessively

wide

cabinet

ventilation

slots,

and

an

improperly

fitted

and/or

incorrectly

secured

cabinet

back

cover.

Leakage

Current

Hot

Check-With

the

instrume-nt

completely

reassembled,

plug

the

AC

line

cord

directly

into

a

120V

AC

outlet.

(Do

not

use

a

isolation

transformer

during

this

test.)

Use

a

leakage

current

tester

or

a

metering

system

that

complies

with

American

National

Standards

institute

(ANSI)

C101.1

Leakage

Current

for

App-

liances

and

Underwriters

Laboratories

(UL)

1270

(40.7).

With

the

instrument's

AC

switch

first

in

the

ON

positin

and

then

in

the

OFF

position,

measure

from

a

known

earth

ground

(metal

waterpipe,

conduit,

etc.)

to

all

exposed

metal

parts

of

the

instrument

(antennas,

handle

brackets,

metal

cabinets,

screwheads,

metallic

overlays,

control

shafts,

etc.),

especially

any

exposed

metal

parts

that

offer

an

electrical

return

path

to

the

chassis.

Any

current

measured

must

not

exceed

0.5

millamp.

Reverse

the

instrument

power

cord

plug

in

the

outlet

and

repeat

the

test.

See

Figure

1.

Any

measurements

not

within

the

limits

specified

herein

indicate

a

potential

shock

hazard

that

must

be

ellminated

before

returning

the

instrument

to

the

customer.

(Reading

should

not

be

above

0.5mA)

Leakahe

Currant

Tester

Test

all

exposed

metal

surfaces

2-Wire

Cord

Also

test

with

plug

reversed

(using

AC

adapter

plug

as

required)

FIG.

1

AC

Leakage

Test

(4)

Insulation

Resistance

Test

Cold

Check-(1)

Unplug

the

power

supply

cord

and

connect

a

jumper

wire

between

the

two

prongs

of

the

plug.

(2)

Turn

on

the

power

switch

of

the

instrument.

(3)

Measure

the

resistance

with

an

ohmmeter

between

the

jumpered

AC

plug

and

all

exposed

metallic

cabinet

parts

on

the

instrument,

such

as

screwheads,

antenna,

control

shafts,

handie

brackets,

etc.

When

an

exposed

metallic

part

has

a

return

path

to

the

chassis,

the

reading

should

be

between

1

and

5.2

megohm.

When

there

is

no

return

path

to

the

chassis,

the

reading

must

be

infinite.

If

the

reading

is

not

within

the

limits

specified,

there

is

the

possibility

of

a

shock

hazard,

and

the

instrument

must

be

repared

and

rechecked

before

it

is

returned

to

the

customer.

See

Figure

2.

Antenna

Terminal

Exposed

Melal

Part

Ohmmeter

1-1-7.

1-1-8.

1-1-9.

FIG.

2

Insulation

Resistance

Test

Read

and

comply

with

all

caution

and

safety-

non

or

inside

the

cabinet,

or

on

the

chassis.

Design

Afteration

Warning-Do

not

alter

or

add

to

the

mechanical

or

electrical

design

of

this

instrument.

Design

alterations

and

additions,

including

but

not

limited

to,

circuit

modifications

and

the

addition

of

items

such

as

auxiliary

audio

output

connections,

might

alter

the

safety

characteristics

of

this

instrument

and

create

a

hazard

to

the

user.

Any

design

alterations

or

additions

will

make

you,

the

servicer,

responsible

for

personal

injury

or

property

damage

resulting

therefrom.

Observe

original

lead

dress.

Take

extra

care

to

assure

correct

lead

dress

in

the

following

areas:

(1)

near

sharp

edges,

(2)

near

thermally

hot

parts

(be

sure

that

leads

and

components

do

not

touch

thermally

hot

parts),

(3)

the

AC

supply,

(4)

high

voltage,

and

(5)

antenna

wiring.

Always

inspect

in

all

areas

for

pinched,

out-of-place,

or

frayed

wiring.

Do

not

change

spacing

between

a

component

and

the

printed-circuit

board.

Check

the

AC

power

cord

for

damage.

MM-77

1-1-10.

Components,

parts,

and/or

wiring

that

appear

to

have

overheated

or

that

are

otherwise

damaged

should

be

replaced

with

components,

parts

and/or

wiring

that

meet

original

specifications.

Additionally,

determine

the

cause

of

overheating

and/or

damage

and,

if

necessary,

take

corrective

action

to

remove

any

potential

safety

hazard.

Product

Safety

Notice-Some

electrical

and

mechanical

parts

have

special

safety-related

characteristics

which

are

often

not

evident

from

visual

inspection,

nor

can

the

protection

they

give

necessarily

be

obtained

by

replacing

them

with

components

rated

for

higher

voltage,

wattage,

etc.

Parts

that

have

special

safety

characteristics

are

identified

by

shading,

an

(x)

or

a

(

A\,)

on

sc-

hematisc

and

parts

lists.

Use

of

a

substitute

replacement

that

does

not

have

the

same

safety

characteristics

as

the

recommended

replacement

part

might

created

shock,

fire

and/or

other

hazards.

Product

safety

is

under

review

continuously

and

new

instructions

are

issued

whenever

appropriate.

2.

Servicing

notes

2-1.

Before

servicing

the

unit

Be

sure

to

observe

the

safety

notes

attached

on

label,

chassis,

cabinet

top,

cabinet

bottom

and

printed

circuit

board.

2-1-1.

Caution

on

laser

beammalfunction

Do

not

try

to

access

objective

lens,

when

DISC

is

not

on

the

tray.

When

pick-up

mechanism

replacement

is

required,

be

sure

to

turn

power

off.

2-1-2.

When

handling

parts

Tube,

tape

or

insulating

parts

are

used

for

sepa-ration

or

insulation

purposes.

Especially

parts

which

generate

excessive

heat

are

kept

away

from

PCB

or

any

other

sensitive

parts.

Therefore,

when

replacing

parts,

be

sure

to

replace

them

in

their

original

position.

2-1-3.

When

fixing

wires

Wires

should

be

fixed

in

such

a

way

with

cable-tie

so

they

won't

move.

When

finished

servicing,

be

sure

to

leave

unit

in

it's

original

configuration.

2-1-4.

Use

specified

parts

only

The

safety

specification

built

into

the

electronics

of

this

unit

require

that

you

use

specified

parts

only.

Do

not

use

any

other

replacements.

Using

other

parts

can

result

in

electrical

and

fire

hazard.

2-1-5.

After

servicing

is

complete

After

servicing

is

complete,

check

if

there

are

any

missing

parts

or

that

wires

are

properly

fixed

and

any

place

where

over

heating

or

shock

is

likely

to

occur,

can

be

found.

short

terminal

SOH91C1(CAR,

walkman)

SOH91VI(LDP)

MM-77

2-1-6.

Handling

the

optical

pick-up

*

The

laser

diode

in

the

optical

pick

up

may

suffer

electrostatic

breakdown

because

of

potential

static

electricity

from

clothing

and

your

body.

The

following

method

is

recommended.

(1)

Place

a

conductive

sheet

on

the

work

bench

(The

black

sheet

used

for

wrapping

repair

parts.)

(2)

Place

the

set

on

the

conductive

sheet

so

that

the

chassis

is

grounded

to

the

sheet.

(3)

Place

your

hands

on

the

conductive

sheet

(This

gives

them

the

same

ground

as

the

sheet).

(4)

Remove

the

optical

pick

up

block.

(5)

Perform

work

on

top

of

the

conductive

sheet.

Be

careful

not

to

let

your

clothes

or

any

other

static

sources

to

touch

the

unit.

*

Be

sure

to

put

on

a

wrist

strap

grounded

to

the

sheet.

*

Be

sure

to

lay

a

conductive

sheet

made

of

copper

etc.

which

is

grounded

to

the

table.

4

Mr

Pek

SSte5

vee

sy,

=

cp

Notes

vy

aay

*

OSES

IM

¢

1M

;

'

Pe

APS”

Lr

ea

a

SS

‘0

THE

UNIT

AA

|

a

\s

WS,

Ant

a

<

A

(1)

WRIST-STRAP

oe

CONDUCTIVE

SHEET

FOR

GROUNDING

1M

f

(6)

Short

the

short

terminal

on

the

PCB,

which

is

inside

the

Pick-Up

ASS'Y,

before

replacing

the

Pick-Up.

(The

short

terminal

is

shorted

when

the

Pick-Up

Ass'y

is

being

lifted

or

moved.)

(7)

After

replacing

the

Pick-up,

open

the

short

terminal

on

the

PCB.

ON

Sal

a

EF)

terminal

SOH-A1

(CMS-V10,CMS-V30)

terminal

SOH94T4N

(CMS-V10,CMS-V30)

2-2.

Servicing

Precautions

CAUTION:

Before

servicing

Instruments

covered

by

this

service

manual

and

its

supplements,

read

and

follow

the

Safety

Precautions

section

of

this

manual.

Note:

If

unforseen

circument

create

conflict

between

the

following

servicing

precautions

and

any

of

the

safety

precautions,

always

follow

the

safety

precautions.

Remember:

Safety

First.

2-2-1.

General

Servicing

Precautions

(1)

a.

Always

unplug

the

instrument's

AC

power

cord

from

the

AC

power

source

before

(1)

removing

or

reinstalling

any

component,

circuit

board,

module

or

any

other

instrument

assembly,

(2)

disconnecting

any

instrument

electrical

plug

or

other

electrical

connection,

(3)

connecting

a

test

substitute

in

parallel

with

an

electrolytic

capacitor

in

the

instrument.

b.

Do

not

defeat

any

plug/socket

B+

voltage

interlocks

with

which

instruments

covered

by

this

service

manual

might

be

equipped.

c.

Do

not

apply

AC

power

to

this

instrument

and/or

any

of

its

electrical

assemblies

unless

all

solid-state

device

heat

sinks

are

correctly

installed.

d.

Always

connect

a

test

instrument's

ground

lead

to

the

instrument

chassis

ground

before

connecting

the

test

instrument

positive

lead.

Always

remove

the

test

instrument

ground

lead

last.

Note:

Refer

to

the

Safety

Precautions

section

ground

lead

last.

(2)

The

service

precautions

are

indicated

or

printed

on

the

cabinet,

chassis

or

components.

When

servicing,

follow

the

printed

or

indicated

service

precautions

and

service

materials.

(3)

The

components

used

in

the

unit

have

a

specified

flame

resistance

and

dielectric

strength.

When

replacing

components,

use

components

which

have

the

same

ratings.

Components

identified

by

shading,

by

(x)

or

by

(.1

)

in

the

circuit

diagram

are

important

for

safety

or

for

the

characteristics

of

the

unit.

Always

replace

them

with

the

exact

replacement

components.

MM-77

(4)

An

insulation

tube

or

tape

is

sometimes

used

and

some

components

are

raised

above

the

printed

wiling

board

for

safety.

The

internal

wiring

is

sometimes

clamped

to

prevent

contact

with

heating

components.

Install

such

elements

as

they

were.

(5)

After

servicing,

always

check

that

the

removed

screws,

corponents,

and

wiring

have

been

installed

correctly

and

that

the

portion

around

the

serviced

part

has

not

been

damaged

and

so

on.

Further,

check

the

insulation

between

the

blades

of

the

attachment

plug

and

accessible

conductive

parts.

2-2-2.

Insulation

Checking

Procedure

Disconnect

the

attachment

plug

from

the

AC

outlet

and

turn

the

power

ON.

Connect

the

insulation

resistance

meter

(500V)

to

the

blades

of

the

attachment

plug.

The

insulation

resistance

between

each

blade

of

the

attachment

plug

and

accessible

conductive

parts

(see

note)

should

be

more

than

1

Megohm.

Note:

Accesible

conductive

parts

include

metal

panels,

input

terminals,

earphone

jacks,

etc.

2-3.

ESD,

Precautions

Electrostatically

SensitiveDevices

(ESD)

Some

semiconductor

(solid

state)

devices

can

be

damaged

easily

by

static

electricity.

Such

components

commonly

are

called

Electro-

statically

Sensitive

Devices

(ESD).

Examples

of

typical

ESD

devices

are

integrated

circuits

and

some

field-

effect

transistors

and

semiconductor

chip

com-

ponents.

The

following

techniques

should

be

used

to

help

reduce

the

incidence

of

component

damage

caused

by

static

electricity.

(1)

Immediately

before

handling

any

semiconductor

component

or

semiconductor-equipped

assembly,

drain

off

any

electrostatic

aharge

on

your

body

by

touching

a

known

earth

ground.

Alternatively,

obtain

and

wear

a

commercially

available

discharging

wrist

strap

device,

which

should

be

removed

for

potential

shock

reasons

prior

to

applying

power

to

the

unit

under

test.

(2)

After

removing

an

electrical

assembly

equipped

with

ESD

devices,

place

the

assembly

on

a

con-

ductive

surface

such

as

aluminum

foil,

to

prevent

electrostatic

charge

buildup

or

exposure

of

the

assembly.

(3)

Use

only

a

grounded-tip

soldering

iron

to

solder

or

unsolder

ESD

devices.

(4)

Use

only

an

anti-static

solder

removal

device.

Some

solder

removal

devices

not

classified

as

"anti-static"

can

generate

electrical

charges

sufficient

to

damage

ESD

devices.

(5

—

Do

not

use

freon-propelled

chemicals.

These

can

generate

electrical

charges

sufficient

to

damge

ESD

devices.

MM-77

(6)

Do

not

remove

a

replacement

ESD

device

from

its

protective

package

until

immediately

before

your

are

ready

to

install

it.

(Most

replacement

ESD

devices

are

packaged

with

leads

electrically

shorted

together

by

conductive

foam,

aluminum

foil

or

comparable

conductive

materials).

(7)

Immediately

before

removing

the

protective

materials

from

the

leads

of

a

replacement

ESD

device,

touch

the

protective

material

to

the

chassis

or

circuit

assembly

into

which

the

device

will

be

installed.

CAUTION:

Be

sure

no

power

is

applied

to

the

chassis

or

circuit,

and

observe

all

other

safety

precautions.

@

Minimize

bodily

motions

when

handling

unpack-

aged

replacement

ESD

devices.

(Otherwise

harmless

motion

such

as

the

brushing

together

of

your

clothes

fabric

or

the

lifting

of

your

foot

from

a

carpeted

floor

can

generate

static

electricity

sufficient

to

damage

an

ESD

device).

3.

Chip

replacement

3-1.

Precaution

for

the

Chip

Replacement

(1)Do

not

touch

the

part

body

directly

with

the

soldering

iron.

ICS,

especially

TSOP,

are

easily

damaged

by

heat.

(2)

Use

care

regarding

soldering

iron

tip

and

avoid

rapidly

heating

parts.

Some

parts

can

be

damaged

by

sudden

heating.

Preheat

the

part

at

about

100°C

for

several

minutes

before

installing

it.

(3)

Use

soldering

tip

temperature

of

about

240°C

or

larger

parts,

use

a

slightly

higher

temperature

(about

280°C).

(4)

The

thin

(0.3mm)

solder

for

miniature

parts

does

not

contain

adequate

flux.

Supplementary

flux

is

thus

needed

in

most

cases.

The

NoteMaster

486S/25N

series

systems

are

manufactured

using

flux

which

can

be

cleaned

by

water

in

the

factory.

When

your

replace

the

part

or

troubleshooting,

use

proper

flux

and

solder

which

can

be

cleaned

by

water.

Soldering

area

will

corrode,

if

proper

flux

and

solider

are

not

used

in

replace.

And

it

may

cause

a

fatal

error

to

the

system.

(5)

Use

care

not

to

damage

the

circuit

pattern,

especially

when

removing.

(6)

Because

of

the

many

pins,

cleanliness

of

the

pattern

is

extremely

important

after

removing

the

IC.

(7)

Use

care

to

avoid

solder

bridges.

Remove

any

that

occurs.

(8)

Position

the

part

carefully.

This

will

also

affect

the

soldering

operation.

Be

very

precise

in

positioning

the

IC.

Soldering

opposite

pins

first

holds

the

IC

in

place

and

makes

soldering

the

other

pins

easier.

(9)

Do

not

reuse

removed

parts.

(10)

Check

for

solder

joints,

especially

miniature

parts

with

small

lead.

(11)

A

defective

trimming

resistor

cannot

be

adjusted

externally.

Replace

with

an

ordinary

variable

resistor.

(12)

It

is

important

to

inspect

the

work

with

a

magnifier.

Check

after

installing

(cold

solder

joints,

etc).

3-2.

Tools

for

the

Chip

Replacement

The

tools

for

the

chip

replacement

are

as

follows:

(1)

Thin

tip

type

soldering

iron

(2)

Small

flat-blade

tip

type

soldering

iron

(3)

Special

desoldering

tip

iron

(4)

Airblower

unit

(5)

Flat

Package

Pick-up

MM-77

6)

Flux

can

be

cleaned

by

water

7)

0.3mm

thin

solder

can

be

cleaned

by

water

8)

Desoldering

wire

9)

Tweezers

3-3.

Chip

Resistors

and

Chip

Capacitors

3-3-1.

Kind

jof

the

Part

The

kind

of

chip

resistors

and

chip

capacitors

as

follows

(1)

Thick

Film

Chip

Resistors

(2)

Carbon

Film

Chip

Resistors

(3)

Metal

Film

Chip

Resistors

(4)

Chip

Ceramic

Capacitors

(5)

Chip

Trimming

Resistors

3-3-2.

Removing

the

Part

The

kind

of

chip

resistors

and

chip

capacitors

as

follows

(1)

Using

two

soldering

irons:

(D

Use

thin

tip

soldering

irons.

)

Use

soldering

tip

temperature

of

about

280°C

@)

Simultaneously

heat

both

ends

of

the

part.

@

While

heating,

grasp

the

part

with

the

tips

of

the

soldering

irons

and

remove

it.

©)

Use

desoldering

wire

to

completely

remove

the

old

solder

from

the

part

location

of

the

board.

©

A

clean

pattern

for

installing

the

new

part

is

very

important.

FIG,

4

3-3-3.

Installing

the

Part

(1)

Clean

the

area

where

the

new

part

is

to

be

mounted.

(2)

Apply

flux.

(3)

Set

part

correctly

into

position,

prevent

it

from

shifting.

(4)

Bring

the

soldering

iron

tip

close

to

the

part

contact

without

actually

touching

it.

Melt

thin

(0.3mm)

solder

between

the

tip

and

part

so

that

it

flows

into

the

part

contact.

(5)

Check

work

quality

with

a

magnifier.

3-4.

Chip

Tantalum

Capacitors

and

Chip

Filters

3-4-1.

Kind

of

the

Part

The

kind

of

chip

tantalum

capacitors

and

chip

filters

are

as

follows:

(1)

Chip

Inductors

(2)

Chip

Tantalum

Capacitors

(3)

Chip

Tantalum

Electrolytic

Capacitors

(4)

Chip

Aluminum

Electrolytic

Capacitors

(5)

Chip

Transformers

(6)

Chip

Filters

3-4-2.

Removing

the

Part

(1)

Using

special

desoldering

iron:

(D

Select

soldering

tip

according

to

part

size.

@

Bring

the

tip

into

contact

with

the

soldered

points.

When

the

solder

melts,

remove

the

part.

@Remove

the

old

solder

with

desoldering

wire.

(1)

Using

two

soldering

irons:

(D

Use

small

flat-blade

tips.

(Heat

both

ends

of

the

part

simultaneously.

@

When

the

solder

melts,

grasp

and

remove

the

part

with

the

soldering

iron

tips.

@

Remove

the

old

solder

with

desoldering

wire.

W..

\b=

Awe

wy

!

NE

Wwe

3-4-3.

Installing

the

Part

(1)

Clean

the

area

where

the

new

part

is

to

be

mounted.

(2)

Apply

flux

(3)

In

part

correctly

into

position,

prevent

it

from

shifting.

(4)

Use

sharp

soldering

iron

tip.

Bring

close

to

the

Part

contact

without

actually

touching

it.

Melt

thin

solder

between

the

tip

and

part

so

that

if

flows

into

the

part

contact.

(5)

Check

work

quality

with

a

magnifier.

FIG.

5

MM-77

3-5.

Chip

VRs,

Chip

Trimmer

Capacitors,

Diodes

and

Tr.

3-5-1.

Kind

of

the

Part

The

kind

of

the

part

is

as

follows:

(1)

Chip

VRs

(2)

Chip

Trimmer

Capacitors

(3)

Diode

(4)

Transistors

3-5-2.

Removing

the

Part

(1)

Using

two

soldering

irons:

@

Use

small

flat-blade

tips.

@

Heat

the

leads

of

the

part

simultaneously.

@)

When

the

solder

melts,

grasp

and

remove

the

part

with

the

soldering

iron

tips.

@

Remove

the

old

solder

with

desoldering

wire.

3-5-3.

Installing

the

Part

Oy

YS

/

Y

FIG.

6

(1)

Clean

the

area

where

the

new

part

is

to

be

mounted.

(2)

Apply

flux

(3)

Set

part

correctly

into

position,

prevent

it

from

shifting.

(4)

Use

sharp

soldering

iron

tip.

Bring

close

to

the

part

contact

without

actually

touching

it.

Melt

thin

solder

between

the

tip

and

part

so

that

it

flows

into

the

part

contact.

3-6.

Chip

ICs

3-6-1.

The

kind

of

the

Chip

ICs

The

kind

of

the

chip

ICs

are

as

follows:

(1)

SOP

(Small

Outline

Package)

IC

(2)

SSOP

(Shrink

Small

Outline

Package)

IC

(3)

VSOP

(Very

Small

Outline

Package)

IC

(4)

QFP

(Quad

Fiat

Package)

IC

(5)

VOFP

(Very

Quad

Flat

Package)

IC

(6)

PLCC

(Plastic

Leaded

Chip

Carrier)

IC

(7)

TSOP

(Thin

Small

Outline

Package)

IC

3-6-2.

Removing

the

Part

(1)

Using

special

desoldering

iron:

Select

the

tip

according

to

the

size

and

shape

of

the

IC.

@

Thin"

the

tip

with

a

small

amount

of

the

IC

leads.

@)

Set

the

tip

squarely

over

the

IC

leads.

@

When

the

solder

melts,

carefully

twist

the

iron.

©)

Raise

and

remove

the

IC.

(2)

Using

shaped

airblower

unit:

@

Select

the

correct

nozzle.

@)

Select

the

temperature

and

airblow

(suggested:

temperature:

7,

airblow:

4)

@)

Engage

the

IC

removing

tool.

@

Use

the

airblow

to

preheat

the

IC

for

about

5

seconds,

then

heat

with

the

nozzle

until

the

IC

remover

lifts

the

part

from

the

board.

=

ea

|

FIG.

7

MM-77

3-6-3.

Installing

the

Part

(1)

Use

desoldering

wire

to

remove

the

(2)

Clean

the

location.

(3)

Apply

flux.

(4)

Position

the

IC

and

solder

two

pins

at

opposite

sides.

(5)

Use

a

sharp

tipped

soldering

iron

and

carefully

solder

each

pin.

(After

graining

experience,

a

thicke

tip

can

be

used

for

better

work

efficiency.)

(6)

Remove

any

solder

bridges

with

desoldering

wire.

(7)

Inspect

the

work

with

a

magnifier.

Samsung MM-77 Manuel utilisateur

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