Samsung I8510 Manuel utilisateur

GSM TELEPHONE

Samsung i8510

GSM TELEPHONE CONTENTS

1. Safety Precautions

2. Specification

3. Product Function

4. Array course control

5. Exploded View and Parts List

6. Main Electrical Parts List

7. Block Diagrams

8. PCB Diagrams

9. Flow Chart of Troubleshooting

10. Reference data

11. Disassembly and Assembly

Instructions

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2. Specification

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2-1

EGSM 850 EGSM 900 DCS 1800 PCS 1900 WCDMA 900 WCDMA 2100

Freq.

Band[MHz]

Uplink/Downlink

824~849

869~894

880~915

925~960

1710~1785

1805~1880

1850~1910

1930~1990

880~915

925~960

1920~1980

2110~2170

ARFCN range 128~251 0~124 &

975~1023 512~885 512~810 UL:2712~2863

DL:2937~3088

UL:9612~9888

DL:10562~10838

Tx/Rx spacing 10MHz 10MHz 20MHz 20MHz 45MHz 190MHz

Mod. Bit rate/

Bit Period

270.833kbps

3.692us

270.833kbps

3.692us

270.833kbps

3.692us

270.833kbps

3.692us

3.84Mcps

(chip rate)

3.84Mcps

(chip rate)

Time Slot

Period/

Frame Period

576.9us

4.615ms

576.9us

4.615ms

576.9us

4.615ms

576.9us

4.615ms

Frame length

:10ms

Slot length :

0.667ms

Frame length :

10ms

Slot length :

0.667ms

Modulation 0.3GMSK 0.3GMSK 0.3GMSK 0.3GMSK QPSK

HPSK

QPSK

HPSK

MS Power 33dBm

~5dBm

33dBm

~5dBm

30dBm

~0dBm

30dBm

~0dBm

24dBm

~-50dBm

24dBm

~-50dBm

Power Class

(max

+33dBm)

(max

+33dBm)

(max

+30dBm)

(max

+30dBm)

(max +24dBm)

Sensitivity -102dBm -102dBm -102dBm -102dBm -103.7 -106.7dBm

TDMA Mux 8 8 8 8

Cell Radius 35Km 2Km 2Km 2Km 2Km

2-1. GSM General Specification

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Specification

2-2

TX Power

control level PCS1900

030±3

dBm

128±3

dBm

226±3

dBm

324±3

dBm

422±3

dBm

520±3

dBm

618±3

dBm

716±3

dBm

814±3

dBm

912±4

dBm

10 10±4 dBm

11 8±4 dBm

12 6±4 dBm

13 4±4 dBm

14 2±5 dBm

15 0±5 dBm

TX Power

control level

GSM850

GSM900

533±2

dBm

631±2

dBm

729±2

dBm

827±2

dBm

925±2

dBm

10 23±2 dBm

11 21±2 dBm

12 19±2 dBm

13 17±2 dBm

14 15±2 dBm

15 13±2 dBm

16 11±3 dBm

17 9±3 dBm

18 7±3 dBm

19 5±3 dBm

TX Power

control level DCS1800

030±3

dBm

128±3

dBm

226±3

dBm

324±3

dBm

422±3

dBm

520±3

dBm

618±3

dBm

716±3

dBm

814±3

dBm

912±4

dBm

10 10±4 dBm

11 8±4 dBm

12 6±4 dBm

13 4±4 dBm

14 2±5 dBm

15 0±5 dBm

2-2. GSM TX power class

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3. Product Function

3-1

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Main Function

•HSDPA(900/2100), EDGE, GPRS(850/900/1800/1900)

•2.8 QVGA 16M TFT LCD

•8 Megapixel CMOS with AF and Dual Power LED

•Smart Reader, Image Stabilizer, Auto-Panorama Shot, Smile Shot, Blink Shot,

Wide Dynamic Range (WDR), Face Detection

•Video Player (DivX / H.263 / H.264 / WMV / MP4)

•QVGA 120 fps Video recording, VGA 30 fps recording

•Bluetooth v2.0 +EDR

•USB v2.0 HS compatible

•WLAN 802.11 b/g

•FM Radio with RDS

•A-GPS

•16GB Flash + External Memory slot : microSDHC™ (up to 16GB)

•Optical Mouse, Accelerometer

•Music Player (MP3/ AAC / AAC+ / eAAC+ / WMA / AMR/ RealAudio)

•Instant Messaging capability

•E-mail

•Featured applications provide alarms, calendar, calculator, record audio, converter, timer, stopwatch,

and world time.

•File viewer (MS office, PDF)

•Multimedia Message Service (MMS)

•Multimedia capability (with included Media player)

•Photo caller ID

•Speakerphone capability

•WEB/WAP browser (HTMS, xHTML, WML)

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11.Reference data

11-1

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Reference Abbreviation

-AAC:Advanced Audio Coding.

-AVC :Advanced Video Coding.

-BER :Bit Error Rate

-BPSK:Binary Phase Shift Keying

-CA :Conditional Access

-CDM :Code Division Multiplexing

-C/I :Carrier to Interference

-DMB :Digital Multimedia Broadcasting

-EN :European Standard

-ES :Elementary Stream

-ETSI:European Telecommunications Standards Institute

-MPEG:Moving Picture Experts Group

-PN :Pseudo-random Noise

-PS :Pilot Symbol

-QPSK:Quadrature Phase Shift Keying

-RS :Reed-Solomon

-SI :Service Information

-TDM :Time Division Multiplexing

-TS :Transport Stream

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1. Safety Precautions

1-1

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1-1. Repair Precaution

●Repair in Shield Box, during detailed tuning.

Take specially care of tuning or test,

because specipicty of cellular phone is sensitive for surrounding interference(RF noise).

●Be careful to use akind of magnetic object or tool,

because performance of parts is damaged by the influence of manetic force.

●Surely use astandard screwdriver when you disassemble this product,

otherwise screw will be worn away.

●Use athicken twisted wire when you measure level.

Athicken twisted wire has low resistance, therefore error of measurement is few.

●Repair after separate Test Pack and Set because for short danger (for example an

overcurrent and furious flames of parts etc) when you repair board in condition of

connecting Test Pack and tuning on.

●Take specially care of soldering, because Land of PCB is small and weak in heat.

●Surely tune on/off while using AC power plug, because arepair of battery charger is

dangerous when tuning ON/OFF PBA and Connector after disassembing charger.

●Don't use as you pleases after change other material than replacement registered on SEC

System.

Otherwise engineer in charge isn't charged with problem that you don't keep this rules.

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Safety Precautions

1-2

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1-2. ESD(Electrostatically Sensitive Devices) Precaution

Several semiconductor may be damaged easilly by static electricity. Such parts are called by

ESD(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.

You can prevent from ESD damage by static electricity.

●Remove static electricity remained your body before you touch semiconductor or parts with

semiconductor. There are ways that you touch an earthed place or wear static electricity

prevention string on wrist.

●Use earthed soldering steel when you connect or disconnect ESD.

●Use soldering removing tool to break static electricity. ,otherwise ESD will be damaged by

static electricity.

●Don't unpack until you set up ESD on product. Because most of ESD are packed by box

and aluminum plate to have conductive power,they are prevented from static electricity.

●You must maintain electric contact between ESD and place due to be set up until ESD is

connected completely to the proper place or acircuit board.

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4. Array course control

4-1

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4-1. Software Adjustments

-There is 2set to download the binary image into your device.

[First set]

1. JIG BOX (UMTS TEST JIG; GH80-03308A)

2. USB Cable :JIG to PC

3. Test Cable :JIG to I8510 (0.4M:GH39-01088A, 1.5M: GH39-01090A)

4. Power Cable :JIG to power supply

5. Serial Cable :JIG to PC

6. Power Supply

7. Rf Cable :GH39-00985A

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Array course control

4-2

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[Second Set]

USBDataLinkCable:I8510 to PC (GH39-00922A)

Standard Battery for I8510 (GH43-02986A)

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Array course control

4-3

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4-2. Software Download

4-2-1. Preparation

□ :Downloader application. Proper version for aROM image.

□USB Driver for Apollo: This differs to USB driver for PC Studio.

:Extract SS60_Downloader_Driver.zip to afolder

□UNRAR.DLL :It needs to copy unrar.dll into c:\windows\system32.

□MSXML.MSI :It needs to install MSXML.MSI.

□ROM Images :PDA(*.XML) has several images and one xml file. PHONE(*.BIN) has aone ima

ge.

□USB Cable

□Charged battery(Upper level 3)

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