Samsung GT-C6712 Manuel utilisateur

GSM TELEPHONE

GT-C6712

1. Safety Precautions

2. Specification

3. Product Function

4. Exploded View and Parts list

5. MAIN Electrical Parts List

6. Level 1Repair

7. Level 2Repair

8. Level 3Repair

9. Reference data

Notice :

All functionality, features, specifications and other

product information provided in this document inclu

ding, but not limited to, the benefits, design, pricing,

components, performance, availability, and capabiliti

-es of the product are subject to change without

notice or obligation. Samsung reserves the right to

make changes to this document and the product

described herein, at anytime, without obligation on

Samsung to provide notification of such change.

GSM TELEPHONE CONTENTS

SAMSUNG Proprietary-Contents may change without notice

1. Safety Precautions

1-1

This Document can not be used without Samsung's authorization

1-1. Repair Precaution

―Repair in Shield Box, during detailed tuning. Take specially care of tuning or test, because

specipicty of cellular phone is sensitive for surrounding interference(RF noise).

―Be careful to use akind of magnetic object or tool, because performance of parts is damaged by

the influence of magnetic force.

―Surely use astandard screwdriver when you disassemble this product, otherwise screw will be

worn away.

―Use athicken twisted wire when you measure level.

Athicken twisted wire has low resistance, therefore error of measurement is few.

―Repair after separate Test Pack and Set because for short danger (for example an overcurrent

and furious flames of parts etc) when you repair board in condition of connecting Test Pack and

tuning on.

―Take specially care of soldering, because Land of PCB is small and weak in heat.

―Surely tune on/off while using AC power plug, because arepair of battery charger is dangerous

when tuning ON/OFF PBA and Connector after disassembling charger.

―Don't use as you pleases after change other material than replacement registered on SEC System.

Otherwise engineer in charge isn't charged with problem that you don't keep this rules.

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Safety Precautions

1-2

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1-2. ESD(Electrostatically Sensitive Devices) Precaution

Several semiconductor may be damaged easily by static electricity. Such parts are called by ESD

(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.

You can prevent from ESD damage by static electricity.

―Remove static electricity remained your body before you touch semiconductor or parts with

semiconductor. There are ways that you touch an earthed place or wear static electricity prevention

string on wrist.

―Use earthed soldering steel when you connect or disconnect ESD.

―Use soldering removing tool to break static electricity. ,otherwise ESD will be damaged by static

electricity.

―Don't unpack until you set up ESD on product. Because most of ESD are packed by box and

aluminum plate to have conductive power,they are prevented from static electricity.

―You must maintain electric contact between ESD and place due to be set up until ESD is

connected completely to the proper place or acircuit board.

2. Specification

2-1

2-1. GSM General Specification

EGSM900 DCS1800

Freq. Band[MHz]

Uplink/Downlink

880~915

925~960

1710~1785

1805~1880

ARFCN range 0~124 &

975~1023 512~885

Tx/Rx spacing 45MHz 95MHz

Mod. Bit rate

/BitPeriod

270.833kbps

3.692us

270.833kbps

3.692us

Time Slot Period

/ Frame Period

576.9us

4.615ms

576.9us

4.615ms

Modulation 0.3GMSK 0.3GMSK

MS Power 33dBm~5dBm 30dBm~0dBm

Power Class 5~19(class4) 0~15(class1)

Sensitivity -102dBm -100dBm

TDMA Mux 8 8

Cell Radius 35Km 2Km

Speclflcation

2-2

TX Power

control level DCS1800

030±3

dBm

128±3

dBm

226±3

dBm

324±3

dBm

422±3

dBm

520±3

dBm

618±3

dBm

716±3

dBm

814±3

dBm

912±4

dBm

10 10±4 dBm

11 8±4dBm

12 6±4 dBm

13 4±4 dBm

14 2±5 dBm

15 0±5 dBm

TX Power

control level GSM900

533±2

dBm

631±2

dBm

729±2

dBm

827±2

dBm

925±2

dBm

10 23±2 dBm

11 21±2 dBm

12 19±2 dBm

13 17±2 dBm

14 15±2 dBm

15 13±2 dBm

16 11±3 dBm

17 9±3 dBm

18 7±3 dBm

19 5±3 dBm

2-2. GSM TX power class

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3. Operation Instruction and Installation

3-1

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Main Function

•EDGE RX (850/900/1800/1900)

•3.2”

WQVGA LCD

•3.2

MP Camera

•Dual SIM, Dual Standby

•BTv3.0 ,Micro USB 2.0

•FM Radio Support

•Micro SD Card support

•3.5

pi Earjack Support

•Wi-Fi 802.11(b/g/n)

•SMS, MMS

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4. Exploded View and Parts List

4-1

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4-1. Cellular phone Exploded View

QME03

QFR01

QLC01

QLB01

QMI03

QAR01

QCA01

QCK02 QRE01

QSP01

QBA01

QCR101

QBC00

QMP01

QKP01

QVK02

QCK01

QMO01

QME01

QRF06

QSD01

QVO01

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Exploded View and Parts List

4-2

This Document can not be used without Samsung's authorization

Design LOC Description SEC CODE

QCR101 SCREW-MACHINE 6001-002005

QBA01 INNER BATTERY PACK-1200MAH,BLK,ENG,MAIN GH43-03447A

QSP01 MODULE-SPK +INT GH59-10668A

QCA01 CAMERA MODULE-3M LSI 1/5" 5CC SOCKET TYP GH59-10764A

QVK02 KEY FPCB-PWR KEY FPCB GH59-10787A

QME03 TOUCH/PANEL-GT-C6712 GH59-10814A

QMI03 RMO RUBBER-MIC TOP GH73-14863A

QMP01 A/S ASSY-PBA MAIN (COMM) GH82-05721A

QLC01 ASSY LCD-3.2"WQVGA GT-C6712 ASSY GH96-05076A

QAR01 ASSY MODULE-RCV(+EARJACK)+BRACKET FPCB GH96-05141A

QFR01 ASSY CASE-FRONT GH98-19406A

QKP01 ASSY KEYPAD-(EU) GH98-19408A

QBC00 ASSY COVER-BATT(IML) GH98-19784A

QLB01 ASSY BRACKET-LCD GH98-19407A

QME01 KEY FPCB-KEY FPCB ASSY GH59-10786A

QRE01 ASSY CASE-REAR GH98-19409A

QMO01 MOTOR DC GH31-00534A

QRF06 PMO COVER-USB GH72-62923A

QSD01 PMO COVER-SD GH72-62924A

QCK02 PMO KEY-SIM GH72-62926A

QVO01 PMO KEY-VOL GH72-62927A

QCK01 PMO KEY-HOLD GH72-62928A

4-2. Cellular phone Parts list

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5. MAIN Electrical Parts List

5-1

This Document can not be used without Samsung's authorization

SEC CODE Design LOC Description

0403-001870 ZD300 DIODE-ZENER

0404-001172 D401,D402 DIODE-SCHOTTKY

0404-001504 D100,D101 DIODE-SCHOTTKY

0406-001286 ZD301,ZD403 DIODE-TVS

0406-001293 ZD401,ZD402 DIODE-TVS

0406-001413 ZD408,ZD411 DIODE-TVS

0406-001446 U411,ZD404,ZD405 DIODE-TVS

0406-001446 ZD409,ZD410 DIODE-TVS

0801-003130 U200 IC

1001-001410 U403 IC

1001-001607 U104 IC

1001-001655 U401 IC

1001-001687 U100 IC

1108-000395 UME200 MEMORY

1201-003166 PAM100 IC

1203-006589 U402 IC

1203-006660 PM300 IC

1205-003868 U102 IC

1205-004046 UCP200 IC

1205-004113 U105 IC

1209-001945 U301 IC

1404-001221 VR300 THERMISTOR

1405-001298 V400,V401,V405,V407 VARISTOR

1405-001298 V408 VARISTOR

2007-000138 R422,R423,R424,R425 R-CHIP

2007-000138 R430 R-CHIP

2007-000139 R137 R-CHIP

2007-000140 R111,R420 R-CHIP

2007-000141 R206,R207,R208,R209 R-CHIP

2007-000141 R219,R220,R406 R-CHIP

2007-000143 R202,R433 R-CHIP

2007-000144 R211,R212,R213,R214 R-CHIP

2007-000148 R312 R-CHIP

2007-000156 R305,R404 R-CHIP

2007-000159 R204 R-CHIP

2007-000162 R134,R135,R136,R216 R-CHIP

SAMSUNG Proprietary-Contents may change without notice

Main Electrical Parts List

5-2

This Document can not be used without Samsung's authorization

SEC CODE Design LOC Description

2007-000162 R217,R218,R222 R-CHIP

2007-000165 R300 R-CHIP

2007-000169 R438 R-CHIP

2007-000170 R402,R408 R-CHIP

2007-001244 R205 R-CHIP

2007-001292 R301,R302 R-CHIP

2007-001294 R100,R405 R-CHIP

2007-001333 R409 R-CHIP

2007-002796 R418 R-CHIP

2007-003014 R316 R-CHIP

2007-003018 R108,R110 R-CHIP

2007-007008 R304 R-CHIP

2007-007014 R411 R-CHIP

2007-007015 R439 R-CHIP

2007-007132 R114,R128,R410 R-CHIP

2007-007156 R460,R462 R-CHIP

2007-007193 R200 R-CHIP

2007-007312 R215 R-CHIP

2007-007315 R221 R-CHIP

2007-007981 R313,R315 R-CHIP

2007-008401 R314 R-CHIP

2203-000233 C234,C450,C451,C452 C-CERAMIC

2203-000233 C453,C456 C-CERAMIC

2203-000254 C137,C222,C231 C-CERAMIC

2203-000278 C125,C126,C136,C143 C-CERAMIC

2203-000278 C169,C170,C171 C-CERAMIC

2203-000330 C118 C-CERAMIC

2203-000386 C236,C402,C413,C415 C-CERAMIC

2203-000386 C460 C-CERAMIC

2203-000425 C219 C-CERAMIC

2203-000438 C150,C229 C-CERAMIC

2203-000627 C116,C312,C313 C-CERAMIC

2203-000679 C130 C-CERAMIC

2203-000696 C144 C-CERAMIC

2203-000714 C182 C-CERAMIC

2203-000725 C464,C465 C-CERAMIC

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