Samsung GT-B6520 Manuel utilisateur
GSM TELEPHONE
GT-B6520
GSM TELEPHONE CONTENTS
1. Safety Precautions
2. Specification
3. Product Function
4. Exploded View and Parts list
5. MAIN Electrical Parts List
6. Level 1Repair
7. Level 2Repair
8. Level 3Repair
9. Reference data
Notice
All functionality, features, specifications and o
ther product information provided in this docu
ment including, but not limited to, the benefit
s, design, pricing, components, performance,
availability, and capabiliti-es of the product
are subject to change without notice or oblig
ation. Samsung reserves the right to make
changes to this document and the product
described herein, at anytime, without
obligation on Samsung to provide notification
of such change.
SAMSUNG Proprietary-Contents may change without notice
1. Safety Precautions
1-1
This Document can not be used without Samsung's authorization
1-1. Repair Precaution
―Repair in Shield Box, during detailed tuning.
Take specially care of tuning or test, because the specification of cellular phone is sensitive for
surrounding interference(RF noise).
―Be careful to use akind of magnetic object or tool, because performance of parts is damaged by
the influence of magnetic force.
―Surely use astandard screwdriver when you disassemble this product, otherwise screw will be
worn away.
―Use athicken twisted wire when you measure level.
Athicken twisted wire has low resistance, therefore error of measurement is few.
―Repair after separate Test Pack and Set because for short danger (for example an overcurrent
and furious flames of parts etc) when you repair board in condition of connecting Test Pack and
tuning on.
―Take specially care of soldering, because Land of PCB is small and weak in heat.
―Surely tune on/off while using AC power plug, because arepair of battery charger is dangerous
when tuning ON/OFF PBA and Connector after disassembling charger.
―Don't use as you pleases after change other material than replacement registered on SEC System.
Otherwise engineer in charge isn't charged with problem that you don't keep this rules.
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Safety Precautions
1-2
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1-2. ESD(Electrostatically Sensitive Devices) Precaution
Several semiconductor may be damaged easily by static electricity. Such parts are called by ESD
(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.
You can prevent from ESD damage by static electricity.
―Remove static electricity remained your body before you touch semiconductor or parts with
semiconductor. There are ways that you touch an earthed place or wear static electricity prevention
string on wrist.
―Use earthed soldering steel when you connect or disconnect ESD.
―Use soldering removing tool to break static electricity. Otherwise ESD will be damaged by static
electricity.
―Don't unpack until you set up ESD on product. Because most of ESD are packed by box and
aluminum plate to have conductive power,they are prevented from static electricity.
―You must maintain electric contact between ESD and place due to be set up until ESD is
connected completely to the proper place or acircuit board.
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2. Specification
This Document can not be used without Samsung's authorization
2-1
2-1. GSM General Specification
GSM 850 EGSM 900 DCS1800 PCS1900 W-CDMA
900 W-CDMA
2100
Freq. Band[MHz]
Uplink/Downlink 824~849
869~894 880~915
925~960 1710~1785
1805~1880 1850~1910
1930~1990 882~913
927~958 1920~1980
2110~2170
ARFCN range 128~25 0~124 &
975~1023 512~885 512~810 UL:2712~2863
DL:2937~3088
UL:9612~9888
DL:10562~
10838
Tx/Rx spacing 45MHz 45MHz 95MHz 80MHz 45MHz 130MHz
Mod. Bit rate/
Bit Period 270.833kbps
3.692us 270.833kbps
3.692us 270.833kbps
3.692us 270.833kbps
3.692us 3.84Mcps 3.84Mcps
Time Slot
Period/Frame
Period
576.9us
4.615ms 576.9us
4.615ms 576.9us
4.615ms 576.9us
4.615ms
Frame length:
10ms
Slot length :
0.667ms
Frame length:
10ms
Slot length :
0.667ms
Modulation 0.3GMSK 0.3GMSK 0.3GMSK 0.3GMSK QPSK
HQPSK QPSK
HQPSK
MS Power 33dBm
~5dBm 33dBm
~5dBm 30dBm
~0dBm 30dBm
~0dBm 24dBm~- 50dBm 24dBm ~ -
50dBm
Power Class 4
(max
+33dBm)
4
(max
+33dBm)
1
(max
+30dBm)
1
(max
+30dBm)
3
(max +24dBm) 3
(max +24dBm)
Sensitivity -102dBm -102dBm -100dBm -100dBm -106.7dBm -106.7dBm
TDMAMux8888
Cell Radius 35Km 35Km 2Km 2Km 2Km 2Km
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Specification
2-2
This Document can not be used without Samsung's authorization
TX Power
control level GSM850
GSM900
533±2
dBm
631±2
dBm
729±2
dBm
827±2
dBm
925±2
dBm
10 23±2 dBm
11 21±2 dBm
12 19±2 dBm
13 17±2 dBm
14 15±2 dBm
15 13±2 dBm
16 11±3 dBm
17 9±3 dBm
18 7±3 dBm
19 5±3 dBm
TX Power
control level DCS1800
030±3
dBm
128±3
dBm
226±3
dBm
324±3
dBm
422±3
dBm
520±3
dBm
618±3
dBm
716±3
dBm
814±3
dBm
912±4
dBm
10 10±4 dBm
11 8±4 dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
TX Power
control level PCS1900
030±3
dBm
128±3
dBm
226±3
dBm
324±3
dBm
422±3
dBm
520±3
dBm
618±3
dBm
716±3
dBm
814±3
dBm
912±4
dBm
10 10±4 dBm
11 8±4 dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
2-2. GSM Tx Power Class
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3. Operation Instruction and Installation
3-1
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Main Function
－HSDPA /UMTS, EDGE, GPRS
－BT 2.0 + EDR
－Camera: 2.0 Mega Pixel, CMOS
CIF CAMERA(Video Call)
－LCD :2.4"
LQVGA TFT-LCD
－Size : 116.5x61.8x11.5 mm
－GPRS/EDGE :class 10
－Battery: 1500mAH
－Band: GSM 900/1800/1900, FDDⅠ/Ⅷ
－BB: Qualcomm MSM7225
－RF: Qualcomm RTR6285
－WLAN 802.11 b/g
－A-GPS
－FM RADIO
－Video Sharing /Streaming
－USB 2.0
－MMS /SMS
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4. Exploded View and Parts List
4-1
This Document can not be used without Samsung's authorization
4-1. Cellular phone Exploded View
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Exploded View and Parts List
4-2
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Design LOC Discription SEC CODE
QCR03 SCREW-MACHINE 6001-001811
QCR49 SCREW-MACHINE 6001-001823
QCR101 SCREW-MACHINE 6001-002005
QAN02 INTENNA-GTB6520 MAIN GH42-02531A
QSM01 KEY FPCB-SIM ASSY GH59-09370A
QSP01 MODULE-SPK+RCV+MOT GH59-09396A
QCA01 CAMERA MODULE-GT-B6520 GH59-09505A
QVK01 KEY FPCB-VOL KEY GH59-09683A
QME01 ASSY MODULE-TF KEY PBA+LCD BRACKET(GTB65 GH96-04892A
QMP01 A/S ASSY-PBA MAIN (COMM) GH82-05107A
QLC01 ASSY LCD-2.4" TFT GT-B6520 GH96-04551A
QCA02 ASSY CAMERA-CIF MODULE(GT-B6520) GH96-04577A
QKP01 ASSY KEYPAD-(BLACK/OPEN) GH98-16968A
QBC00 ASSY CASE-BATT COVER GH98-17868A
QFR01 ASSY CASE-FRONT GH98-16965A
QMW01 ASSY COVER-MAIN WINDOW GH98-17562A
QRE01 ASSY CASE-REAR GH98-16964A
QRF06 PMO COVER-USB GH72-59495A
QSD01 PMO COVER-SD GH72-59496A
QVO01 PMO KEY-VOLUME GH72-59497A
QCK01 PMO KEY-CAMERA GH72-59498A
4-2. Cellular phone Parts list
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5. MAIN Electrical Parts List
5-1
This Document can not be used without Samsung's authorization
SEC Code Design Location Description
0403-001741 ZD400 DIODE-ZENER
0406-001231 ZD401 DIODE-TVS
0406-001231 ZD402 DIODE-TVS
0406-001231 ZD403 DIODE-TVS
0406-001231 ZD502 DIODE-TVS
0406-001231 ZD503 DIODE-TVS
0406-001231 ZD505 DIODE-TVS
0406-001231 ZD507 DIODE-TVS
0406-001231 ZD508 DIODE-TVS
0406-001231 ZD510 DIODE-TVS
0406-001231 ZD511 DIODE-TVS
0406-001231 ZD512 DIODE-TVS
0406-001231 ZD600 DIODE-TVS
0406-001231 ZD602 DIODE-TVS
0406-001231 ZD603 DIODE-TVS
0406-001231 ZD606 DIODE-TVS
0406-001390 ZD513 DIODE-TVS
0406-001413 D601 DIODE-TVS
0406-001413 D602 DIODE-TVS
0406-001413 D603 DIODE-TVS
0406-001413 D604 DIODE-TVS
0406-001413 D605 DIODE-TVS
0406-001413 D606 DIODE-TVS
0406-001413 D607 DIODE-TVS
0406-001413 D608 DIODE-TVS
0406-001413 ZD501 DIODE-TVS
0406-001413 ZD504 DIODE-TVS
0406-001413 ZD509 DIODE-TVS
0407-001002 D400 DIODE-ARRAY
0407-001002 D500 DIODE-ARRAY
0504-001138 TR500 TR-DIGITAL
0505-001325 TR600 FET-SILICON
0505-002341 TR400 FET-SILICON
0801-003200 U302 IC-CMOS LOGIC
0801-003265 U301 IC-CMOS LOGIC
1001-001488 U402 IC-ANALOG SWITCH
1001-001607 U205 IC-RF SWITCH
1001-001645 U500 IC-ANALOG MULTIPLEX
1108-000348 UME300 IC-MCP
1201-002971 U202 IC-RF AMP
1201-003057 PAM101 IC-POWER AMP
1201-003060 PAM102 IC-POWER AMP
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Main Electrical Parts List
5-2
This Document can not be used without Samsung's authorization
SEC Code Design Location Description
1201-003112 PAM100 IC-POWER AMP
1202-001068 U502 IC-VOLTAGE COMP.
1203-003924 U400 IC-VOL. DETECTOR
1203-004776 U501 IC-POSI.FIXED REG.
1203-006291 U401 IC-POWER SUPERVISOR
1203-006346 U405 IC-RESET
1203-006370 U601 IC-DC/DC CONVERTER
1205-003297 U100 IC-TRANSCEIVER
1205-003883 U203 IC-BLUETOOTH
1205-004047 UCP300 IC-MODEM
1205-004076 U201 IC-WIFI
1404-001221 TH300 THERMISTOR-NTC
2007-000137 R319 R-CHIP
2007-000138 R100 R-CHIP
2007-000138 R321 R-CHIP
2007-000138 R335 R-CHIP
2007-000138 R415 R-CHIP
2007-000138 R500 R-CHIP
2007-000138 R515 R-CHIP
2007-000140 R330 R-CHIP
2007-000140 R331 R-CHIP
2007-000140 R332 R-CHIP
2007-000140 R333 R-CHIP
2007-000140 R518 R-CHIP
2007-000140 R606 R-CHIP
2007-000141 R108 R-CHIP
2007-000141 R303 R-CHIP
2007-000141 R304 R-CHIP
2007-000141 R309 R-CHIP
2007-000141 R310 R-CHIP
2007-000143 R311 R-CHIP
2007-000143 R312 R-CHIP
2007-000144 R400 R-CHIP
2007-000148 R305 R-CHIP
2007-000148 R430 R-CHIP
2007-000148 R502 R-CHIP
2007-000149 R112 R-CHIP
2007-000149 R423 R-CHIP
2007-000153 R603 R-CHIP
2007-000157 R207 R-CHIP
2007-000157 R208 R-CHIP
2007-000157 R417 R-CHIP
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