Quectel M10 Manuel utilisateur
M10
Quectel Cellular Engine
M10 User Guide
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Document Title M10 User Guide
Version 1.00
Date 2009-07-07
Status Release
Document Control ID M10_User_Guide_V1.00
General Notes
Quectel offers this information as a service to its customers, to support application and
engineering efforts that use the products designed by Quectel. The information provided is
based upon requirements specifically provided to Quectel by the customers. Quectel has not
undertaken any independent search for additional relevant information, including any
information that may be in the customer’s possession. Furthermore, system validation of this
product designed by Quectel within a larger electronic system remains the responsibility of the
customer or the customer’s system integrator. All specifications supplied herein are subject to
change.
Copyright
This document contains proprietary technical information which is the property of Quectel
Limited., copying of this document and giving it to others and the using or communication of
the contents thereof, are forbidden without express authority. Offenders are liable to the
payment of damages. All rights reserved in the event of grant of a patent or the registration of a
utility model or design. All specification supplied herein are subject to change without notice at
any time.
Copyright © Shanghai Quectel Wireless Solutions Co., Ltd. 2009
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1 .EVB kit introduction
1.1 EVB top and bottom view
EVB top view
EVB bottom view
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A: Debug port
B: Main UART port
C: Test points
D: Adapter interface
E: Module operating status indication LEDs
F: PWRKEY button
G: EMERG_OFF button
H: VBAT switch
I: VCHG switch (charge function)
J: Download switch
K: Connector for M10-TE-A board
L: Screw holes for fixing the M10-TE-A
M: Headset socket
N: Handset socket of audio channel 2
O: Handset socket of audio channel 1
P: Antenna connector fixing hole
Q: Screw holes for EVB placement
R: SIM card socket
1.2 EVB accessory
Accessory introduction
A: 5V DC switching adapter
B: USB to UART converter cable
C: Antenna
D: RF cable
E: Headset
F: Bolts and nuts for fixing module and EVB
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EVB and accessories
2. Operational description
2.1 Tune up procedure
Firstly，please equip the module and accessories as the figure 4.
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Then ,switching the H switch to ON state, J switch to ON state；Press the Fbutton PWRKEY for about
2 second, then the LED glint，and the module is tuningup successfully；( the location of All Switches and
buttons please see the Figure 1)
2.2 Serial interfaces
The module provides two unbalanced asynchronous serial ports. One is the serial port ,the other is the
debug port. The module is designed as a DCE (Data Communication Equipment), following the traditional
DCE-DTE (Data Terminal Equipment) connection. The module and the client (DTE) are connected
through the following signal (as following figure shows). Autobauding supports baud rate from 4800bps to
115200bps.
Serial port
zTXD: Send data to the RXD signal line of the DTE
zRXD: Receive data from the TXD signal line of the DTE
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TXD
RXD
RTS
CTS
DTR
DCD
RI
TXD
RXD
RTS
CTS
DTR
DCD
/RING
DBG_TX
DBG_RX
/TXD
/RXD
MODULE (DCE) CUSTOMER (DTE)
Serial port1
Serial port
Debug port Serial port2
Connection of serial interfaces
Note: The RTS PIN must be connected to the GND in the customer circuit when only the TXD and RXD are
used in the SerialPort communication.
2.3 Antenna interface
The Pin 43 is the RF antenna pad. The RF interface has an impedance of 50Ω.
2.3.1 Antenna installation
M10 provides an RF antenna PAD for customer’s antenna installation. The customer’s antenna should be
located in the customer’s main board and connect to module’s antenna pad through microstrip line or other
type RF trace which the impendence must be controlled in 50Ω. To help the customer to ground the
antenna, M10 comes with 2 grounding pads located close to the antenna pad.
Pin definition of the RF_ANT
Name Pin Function
RF_ANT 43 RF antenna pad
GND 42
GND 44
If the customer installs the antenna via a soldered microwave coaxial cable, we would suggest the customer
to choose RF cable carefully so as to minimize the loss on the RF cable. And the recommended insertion
loss should try to meet the following requirements:
zGSM850/EGSM900<0.5dB
zDCS1800/PCS1900<1dB
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2.3.2 RF output power
The module conducted RF output power
Frequency Max Min
GSM850 33dBm ±2dB 5dBm±5dB
EGSM900 33dBm ±2dB 5dBm±5dB
DCS1800 30dBm ±2dB 0dBm±5dB
PCS1900 30dBm ±2dB 0dBm±5dB
2.3.3 RF receiving sensitivity
The module conducted RF receiving sensitivity
Frequency Receive sensitivity
GSM850 < -107dBm
EGSM900 < -107dBm
DCS1800 < -107dBm
PCS1900 < -107dBm
2.3.4 Operating frequencies
The module operating frequencies
Frequency Receive Transmitting channel
GSM850 869 ～894MHz 824 ～849MHz 128 ～251
EGSM900 925 ～960MHz 880 ～915MHz 0～124, 975～1023
DCS1800 1805 ～1880MHz 1710 ～1785MHz 512 ～885
PCS1900 1930 ～1990MHz 1850 ～1910MHz 512 ～810
2.3.5 Recommended impedance matching circuit
The impedance of M10’s RF_ANT port is 50Ω. If the impedance of antenna is close to 50Ωin all working
frequency bands, the antenna could be connected to the RF_ANT port directly via 50Ωtransmission line.
But if the impedance of antenna is not close to 50Ω, a T-type or π-type matching circuit should be inserted
between transmission line and antenna. The matching components should be placed as close as possible to
the antenna’s feed point.
The following 2 figures show the reference designs of T-type and π-type matching circuits.
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T‐typematchingcircuit
π‐typematchingcircuit
NOTE: The impedance of traces in Bold type must be 50Ω.
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3. M10 features
3.2.1 General specification
M10 is a Quad-band GSM/GPRS module delivers GSM/GPRS 850/900/1800/1900MHz performance for
voice, SMS, Data, and Fax in a small form factor and with low power consumption. M10 can be used for WLL
applications/M2M application and much more.
Quad- band GSM/GPRS module with a size of 29x29x3.6mm
●Customized MMI and keypad/LCD support
●An embedded Powerful TCP/IP protocol stack
●Supply voltage range 3.4 ... 4.5 V
●Normal Operation Temperature: -35°C ~80°C
●GPRS multi-slot Class 12
●GSM R99
3.2.2 Hardware Specification
The following figure shows a block diagram of the M10 module and illustrates the major functional part:
zThe GSM baseband engine
zFlash and SRAM
zThe GSM radio frequency part
zThe SMT pads interface
—LCD interface
—SIM card interface
—Audio interface
—Key board interface
—UART interface
—Power supply
—RF interface
The PCB for M10 is 6 layers.
The mechanical architecture of SIM card holder and the definition of SIM card are shown below:
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Autres manuels pour M10
4
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