PCB Vapor Phase Manuel utilisateur

Vapor Phase Soldering Machine

Vapor Phase One

Instruction manual

PCB Arts GmbH

Kurgartenstraße 59, 90762 Fürth - DE-Mail

vpo@pcb-arts.com, https://www.pcb-arts.com

Please read this manual before operating the Vapor Phase One and follow the instructions

when operating. Keep these instructions near the machine.

PCB Arts GmbH Instruction Manual Vapor Phase One Page 2 of 27

PCB Arts GmbH Instruction Manual Vapor Phase One Page 3 of 27

Thank you for purchasing a Vapor Phase One.

This document shows you how to use the vapor phase soldering system properly.

Please read this document and the enclosed safety instructions before using the

vapor phase soldering system. If you have any questions, please do not hesitate to

The information in this document corresponds to the software version of delivery .

PCB Arts may make improvements and changes in this documentation and software

at any time without notice.

For an up-to-date version, visit our blog at www.blog.pcb-arts.com.

There you will also find tutorials, tips & tricks.

Enjoy using your new vapor phase soldering system!

PCB Arts GmbH ©

Kurgartenstraße 59, 90762 Fürth, DE

E-mail: vpo@pcb-arts.com

Internet: www.pcb-arts.com

 
PCB Arts GmbH Instruction Manual Vapor Phase One Page 4 of 27 
Content 
Before operation................................................................................................................. 6 
1 Scope of delivery ......................................................................................................... 6 
2 Intended use................................................................................................................ 6 
3 Process description...................................................................................................... 6 
4 Process description...................................................................................................... 6 
5 The heat transfer medium........................................................................................... 7 
6 Footprint ...................................................................................................................... 7 
6.1 Filling quantities....................................................................................................... 8 
7 First commissioning ..................................................................................................... 8 
8 Description of the plant............................................................................................... 8 
9 Safety devices .............................................................................................................. 8 
9.1 Monitoring of the plant cover.............................................................................. 8 
9.2 Housing................................................................................................................. 8 
9.3 Ventilated lid ........................................................................................................ 9 
9.4 Dimensioning of the heating system.................................................................... 9 
9.5 Limitation of steam ceiling height........................................................................ 9 
9.6 Monitoring the cooling circuit temperature ........................................................ 9 
9.7 Heating temperature monitoring......................................................................... 9 
9.8 Monitoring the process chamber temperature ................................................... 9 
9.9 Trial Chamber ....................................................................................................... 9 
10 Cooling system............................................................................................................. 9 
10.1 Initial filling of the vapor phase soldering system with distilled water .............10 
10.2 Draining the cooling medium............................................................................. 10 
11 Damage in transit.......................................................................................................10 
11.1 Transport of the plant............................................................................................11 
12 Power connection......................................................................................................12 
Operation of the plant ...................................................................................................... 13 
1 Technical data............................................................................................................ 13 
2 Part designations .......................................................................................................13 
3 General operation...................................................................................................... 15 
3.1 Operating the touch panel.....................................................................................15 
3.2 Operating the Vapor Phase One ............................................................................ 16 
3.3 SD card ...................................................................................................................17 

 
PCB Arts GmbH Instruction Manual Vapor Phase One Page 5 of 27 
4 Attaching the temperature sensor ............................................................................ 18 
5 Creating your own soldering profile..........................................................................18 
Maintenance .....................................................................................................................20 
1 Cleaning the machine ................................................................................................ 20 
2 Cleaning the process chamber .................................................................................. 20 
3 Temperature sensors detached from heater ............................................................20 
4 Installing software updates ....................................................................................... 21 
5 Running the self-test..................................................................................................22 
Malfunctions ..................................................................................................................... 23 
1 Plant cannot be started .............................................................................................23 
2 Heating does not work ..............................................................................................23 
3 Lid does not travel ..................................................................................................... 23 
4 Lift does not move ..................................................................................................... 23 
5 Profile does not start.................................................................................................23 
6 Cooling water overtemperature................................................................................24 
7 Oscillation of the ACTUAL temperature in the soldering profile .............................. 24 
Operation tips ................................................................................................................... 25 
1 Soldering defects .......................................................................................................25 
1.1 Tombstone effect ............................................................................................... 25 
1.2 Wicking effect.....................................................................................................25 
1.3 Solder beads.......................................................................................................25 
1.4 Solder paste does not melt ................................................................................26 
2 Solder paste selection................................................................................................ 26 
3 Double-sided boards..................................................................................................26 
4 Cleaning of printed circuit boards .............................................................................26 
Warranty ........................................................................................................................... 27 
1 Guarantee and warranty ...........................................................................................27 
2 Disclaimer ..................................................................................................................27 
 
 

PCB Arts GmbH Instruction Manual Vapor Phase One Page 6 of 27

1. Before operation

1.1 Scope of delivery

•Vapor Phase One

•Power cable EU / US

•SD card

•USB SD card adapter

•Injection syringe for emptying the medium

•Brush for cleaning

•One pair of cotton gloves (for touch screen applications)

•Funnel for filling the water tank

•Torx© T20 key for opening the hose cover

•Four Torx© T20 replacement screws for the hose cover

1.2 Intended use

The vapor phase soldering system is to be used for soldering printed circuit boards with

assembled components . Temperatures up to a maximum of 240°C are intended. Other uses

of the equipment are not permitted. The limit values specified in this document must not be

exceeded under any circumstances. The operational safety of the equipment supplied is only

guaranteed if it is used as intended.

1.3 Process description

Vapor phase soldering uses a similar physical principle to a heat pipe. A heat source causes a

liquid to boil, i.e. vaporize. This vapor transports the energy of the heat source to the heat

sink - the assembly. The vapor condenses first at the particularly cool points and thus

releases the greatest amount of energy at these points. In the vapor phase soldering system,

a specially developed inert medium is used, which boils between 230°C and 240°C

depending on the type of medium. The condensing vapor gently heats the assembly to the

maximum boiling temperature. Meanwhile, the solder on the assembly liquefies. When the

assembly is removed from the vapor layer, the solder solidifies.

1.4 Process description

First, the soldering chamber is opened by operating the touch panel. After the assembled

component is placed in the soldering chamber on the soldering grid, it can be closed again

with the help of the touch screen. After the soldering chamber is securely closed, it is

possible to start the soldering process via touch panel input.

The heating element brings the soldering medium to its boiling temperature, while the

soldering grid with the assembled component moves along the specified soldering profile.

When the boiling temperature of the soldering medium has been reached, a vapor layer is

PCB Arts GmbH Instruction Manual Vapor Phase One Page 7 of 27

formed. This then has an identical temperature to the boiling temperature of the inert

medium. This vapor layer thus also defines a large part of the soldering zone. When the

specified temperature profile provides for the soldering temperatures, the assembled

assembly is moved into the vapor layer. The vapor condenses on the surface of the solder as

this is lower than the boiling temperature. The condensation process is finished as soon as

the soldering material has reached the temperature of the steam.

The soldering grid with the soldering material is moved upwards in the process chamber,

and the cooling process of the process chamber begins. The process chamber is cooled down

with the help of fans, which ensures almost complete condensation of the remaining

medium vapor. Once a certain temperature of the medium has been reached, the process

chamber is released for opening. The user can now open the process chamber via touch

panel and remove the still warm or hot solder with cotton gloves.

1.5 The heat transfer medium

PCB Arts uses the process medium of the company "Solvay Solexis" with the brand name

"Galden®". This is perfluoropolyether, which is composed exclusively of carbon, fluorine and

oxygen atoms. The advantages of Galden© are:

•Dielectric properties

•High material compatibility

•No flash point

•High heat transfer coefficient

•Not a hazardous substance in the sense of occupational health and safety

1.6 Footprint

The "Vapor Phase One" must be set up with at least 20cm of protrusion all around. Thus, an

installation area of 900mm (width) x 700mm (depth) x 900mm (height) is required. The

installation surface must be horizontal and temperature resistant (at least 150°C). Ideally,

the soldering machine should be placed near a window to prevent odors from developing.

The temperature of the operating room must not exceed 35°C. Also, the humidity of the air

must not exceed 70%. Make sure that the vapor phase soldering system has enough space

above the lid so that there is no danger of crushing.

•The soldering unit must not be installed near fire detectors or sprinkler systems.

•The soldering system must not be operated in potentially explosive atmospheres.

•With the mains plug disconnected, the cooling water reservoir is to be filled up to

the specified level with distilled water only.

•The process medium reservoir must be filled up to the specified level with the power

plug disconnected; the heating coils at the bottom of the solder pot must always be

covered.

PCB Arts GmbH Instruction Manual Vapor Phase One Page 8 of 27

•The soldering equipment must not be put into operation in places above 2000

meters above sea level.

1.6.1 Filling quantities

Medium: At least 750ml process medium.

Caution: During installation, make sure that the heating tube in the process vessel is always covered with

medium!

Cooling water: Pour approx. 1250ml liters of distilled water into the cooling circuit.

1.7 Initial startup

1. Make sure that the installation surface has been selected correctly.

2. Initialize the SD card as described in 2.3.3

3. First fill the water tank initially with water as described in 1.10.1

4. Set the voltage of the vapor phase correctly as described in 1.12

5. Then plug in the mains plug of the vapor phase soldering system.

6. Turn on the main switch of the vapor phase soldering system so that it starts and

calibrates.

7. You can now swipe to the left and right on the touchscreen to change the operating

views. On the first operating view, you will see the "Open Lid" button. Press this

button and the process lid opens automatically. Now carefully fill the soldering

medium into the process vat so that the filling quantity is between the minimum and

maximum of the dipstick.

1.8 Description of the plant

The system is intended for reflow soldering of small quantities, prototypes and individual

pieces. Continuous operation of the system is not intended. The maximum working speed is

limited by the soldering profile, the corresponding cooling speed and the opening

temperature of the process chamber.

1.9 Safety devices

1.9.1 Monitoring of the plant cover

The travel speed is limited by the hardware with regard to operating voltage and

transmission ratio. There are various current limitations of the motor current as well as

overcurrent shutdowns. When an overcurrent event is registered, the lid automatically

moves up to prevent crushing between the process vat and the lid.

1.9.2 Housing

All contactable edges are rounded by design. No sharp-edged parts are installed. The

hexagons on the housing can lead to chafing, these should be touched with care.

PCB Arts GmbH Instruction Manual Vapor Phase One Page 9 of 27

1.9.3 Ventilated lid

The lid of the process chamber is protected from contact by a polyoxymethylene (POM)

plate. Increased temperatures are reached at the stainless steel lid, which is located under

the POM plastic. This area cannot be touched and is insulated with the polyoxymethylene

plate. In addition, there is an active fan which cools the area between the stainless steel lid

and the POM.

1.9.4 Dimensioning of the heating

The heater is dimensioned so that a maximum energy of 3.125W/cm² is achieved. Thus, the

maximum power, which is specified for Galden©, is not reached.

1.9.5 Limitation of the steam ceiling height

The steam ceiling is limited in the process vessel by cooling blocks, which are mounted at a

certain height on the outer wall of the process vessel. These cooling blocks are part of an

actively cooled water circuit. Thus, the steam ceiling height is physically limited via these.

1.9.6 Monitoring the cooling circuit temperature

The water circuit, which is used to limit the vapor ceiling height, is monitored with a

temperature sensor. If the water temperature rises above X°C / X°F, the Vapor Phase One

will not allow soldering.

1.9.7 Heating temperature monitoring

In addition to the correct dimensioning of the heating, it is monitored and controlled by

software. Should the software control fail to function for inexplicable reasons, dedicated

evaluation electronics ensure an emergency shutdown in the event of overtemperature.

1.9.8 Monitoring the process chamber temperature

The process chamber can open when the temperature of the galde is below a user-

adjustable temperature. This setting can be adjusted in the display ("Eco", "Standard" or

"Fast").

1.9.9 Trial Chamber

The lid of the process chamber cannot be moved manually, this is controlled by a self-locking

motor.

1.10 Cooling system

Caution: Never fill water into the cooling system while the vapor phase soldering

system is connected to the socket!

Attention: Only distilled water may be used for cooling. Damage to the unit due to

calcification is excluded from the warranty.

The water is circulated throughout and cooled down by two radiators. For this purpose, the

fans of the radiators must always be able to push through enough air volume - accordingly,

PCB Arts GmbH Instruction Manual Vapor Phase One Page 10 of 27

care must be taken to ensure that the supply and exhaust air of the vapor phase soldering

system is free of obstructions. The cooling system is necessary for the height limitation of

the vapor phase and is consequently a central component of the functionality.

1.10.1 Initial filling of the vapor phase soldering system with distilled water

Step 1:

Unscrew the cover on the back of the Vapor Phase One using the Torx key and remove the

four screws. Remove the cover, now you can fill the cooling system.

Step 2:

Take the enclosed funnel and fill the system

initially with distilled water up to the marked

maximum at the filler neck, which is located on

the back of the Vapor Phase One above the hose

. When filling the cooling medium, loosen

the level plastic hose of the upper elbow to

allow for pressure equalization. After the system

has been filled to the maximum, reinsert the

hose into the plastic bracket.

Step 3:

After the first soldering with the vapor phase, fill the water level to the maximum once

again. Repeat step 1. Water is also stored in the radiators, which is why the water reservoir

must be refilled after initial use.

1.10.2 Draining the cooling medium

To drain the water from the water reservoir, you must pull the top end of the level hose off

the plastic elbow and then drain it into a dedicated water container. The distilled water

should be changed quarterly. There is always some cooling medium in the radiators or

cooling system, this is normal and can be neglected.

1.11 Transport damage

Please check the vapor phase soldering system directly for visible transport damage. These

are to be noted directly upon delivery and reported to the manufacturer and shipping

company. Transport damage that is discovered later but was not visible must also be

reported directly. If the system shows visible damage, it must not be put into operation

before the manufacturer has given his approval.

Please check also in the process chamber if 4x temperature sensors are fixed to the heater

and 1x temperature sensor is turned away from the heater and hangs in the air. You can

compare this with the following figure:

Figure 1: Filling - nozzle

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