Panasonic TH-50PHW6BX Manuel utilisateur

ORDERNO. ITD0309034C0

D10 Canada:B07

High Definition PlasmaDisplay

TH-50PHW6BX/ TH-50PHW6EX / TH-50PHD6EX / TH-

50PHD6BX/ TH-50PHD6UY

GPH6D2Chassis

SPECIFICATIONS

Specifications

PowerSource: AC120V50 / 60Hz(UYversion)

AC220-240V50 / 60Hz

(ExceptUYversion model)

PowerConsumption:445 W

Saveoff 1.6W, Saveon 0.9W (stand-by

condition)

(UYversion)

Saveoff 1.9W, Saveon 1.1W (stand-by

condition)

(ExceptUYversion model)

0.2W (Poweroff condition)

(UYversion model)

0.4W (Poweroff condition)

(ExceptUYversion model)

Plasma Displaypanel:

Drivemethod ACtype

16:9aspectratio

ContrastRatio 3000:1

Screen size: 1,106 mm (W)×622 mm (H)

1,269 mm (diagonal)

No. ofpixels

1,049,088 (1,366 (W)×768 (H))

[4,098 ×768 dots]

Operating condition:

Temperature 34 ° F -104 ° F (0° C-40 ° C)

Humidity 20 %-80 %

Horizontal scanning frequency15 -

110kHz

Vertical scanning frequency48 -120Hz

Connection terminals:

Video in 1.0Vp-p (75-ohm)

S-VIDEOIN/

(MINI DIN4PIN) Y:1Vp-p (75-ohm), C:0.286 Vp-p

(75-ohm)

AUDIOIN/ (RCA

PINJACK ×2) 0.5Vrms (high impedance)

COMPONENT/ RGB

Y/ G 1.0Vp-p / composite(75-ohm)

0.7Vp-p / non-composite(75-ohm)

P B / B 0.7Vp-p (75-ohm)

P R / R 0.7Vp-p (75-ohm)

HD 1.0-5.0Vp-p (high impedance)

VD 1.0-5.0Vp-p (high impedance)

AUDIOIN

(RCAPINJACK ×2) 0.5Vrms (high impedance)

(HIGH-DENSITY

D-SUB15PIN) R,G,B/ 0.7Vp-p (75-ohm)

HD, VD/ 1.0-5.0Vp-p (high

impedance)

AUDIOIN(M3JACK) 0.5Vrms (high impedance)

SERIAL

EXTERNAL CONTROL

TERMINAL (D-

SUB9PIN)

RS-232CCOMPATIBLE

SPEAKERS(External

speakers)(6) 16W [8W +8W](10 %THD)

Dimensions(W ×H×

D): 1,210 mm ×724 mm 95 mm

Weight(Mass) approx. 43.5kg net(main unitonly)

approx. 48.1kg net(with speakers)

Unauthorizedcopying and distribution isaviolation oflaw.

1. Applicablesignals

2. SafetyPrecautions

2.1. General Guidelines

1. Whenservicing, observetheoriginal leaddress. Ifashortcircuit

isfound, replace all parts whichhavebeenoverheatedor

damagedbytheshortcircuit.

2. Afterservicing, see toitthat all theprotectivedevices suchas

insulation barriers, insulation papersshieldsareproperlyinstalled.

3. Afterservicing, make thefollowing leakagecurrentchecks to

preventthecustomerfrombeing exposedtoshock hazards.

2.1.1. LeakageCurrentColdCheck

1. Unplug theACcordand connect ajumperbetweenthetwoprongs

on theplug.

2. Measuretheresistance value, withanohmmeter, betweenthe

jumperedACplug and eachexposedmetalliccabinet parton the

equipmentsuchas screwheads, connectors, control shafts, etc.

Whentheexposedmetallicparthas areturnpathtothechassis,

thereading shouldbebetween1M and 5.2M . / Whenthe

exposedmetal does nothaveareturnpathtothechassis, the

reading must be . Figure1

2.1.2. LeakageCurrentHotCheck (See Figure 1 .)

1. Plug theACcorddirectlyintotheACoutlet. Donotuse an

isolation transformerforthischeck.

2. Connect a1.5k , 10 watts resistor, inparallel witha0.15 F

capacitors, betweeneachexposedmetallicparton theset and a

good earthground suchas awaterpipe, as shownin Figure 1.

3. Use anACvoltmeter, with1000 ohms/voltormoresensitivity, to

measurethepotential across theresistor.

4. Check eachexposedmetallicpart, and measurethevoltageat

eachpoint.

5. Reverse theACplug intheACoutlet and repeat eachoftheabove

measurements.

6. Thepotential at anypointshouldnotexceed0.75 volts RMS. A

leakagecurrenttester(Simpson Model 229 orequivalent) maybe

usedtomake thehotchecks, leakagecurrentmust notexceed1/2

milliamp. Incase ameasurementisoutsideofthelimits specified,

thereisapossibilityofashock hazard, and theequipmentshould

berepairedand recheckedbeforeitisreturnedtothecustomer.

3. Prevention of ElectroStaticDischarge (ESD) to

ElectrostaticallySensitive(ES) Devices

Somesemiconductor (solidstate)devices canbedamagedeasilybystaticelectricity. Such

componentscommonlyarecalledElectrostaticallySensitive (ES)Devices. Examples oftypical

ES devices areintegratedcircuitsand somefield-effecttransistorsand semiconductor "chip"

components. Thefollowing techniques shouldbeusedtohelpreduce theincidence of

componentdamagecausedbyelectro staticdischarge(ESD).

1. Immediatelybeforehandling anysemiconductorcomponentor

semiconductor-equippedassembly, drainoff anyESDon your

bodybytouching aknownearthground. Alternatively, obtainand

wearacommerciallyavailabledischarging ESDwrist strap,

whichshouldberemovedforpotential shock reasonspriorto

applying powertotheunitundertest.

2. Afterremoving anelectrical assemblyequippedwithES devices,

place theassemblyon aconductivesurface suchas alminumfoil,

topreventelectrostaticchargebuildup orexposureofthe

assembly.

3. Use onlyagrounded-tipsoldering iron tosolderorunsolderES

devices.

4. Use onlyananti-staticsolderremoval device. Somesolder

removal devices notclassifiedas "anti-static(ESDprotected)"can

generate electrical chargesufficienttodamageES devices.

5. Donotuse freon-propelledchemicals. These cangenerate

electrical charges sufficienttodamageES devices.

6. DonotremoveareplacementES device fromits protective

packageuntil immediatelybeforeyou arereadytoinstall it. (Most

replacementES devices arepackagedwithleadselectrically

shortedtogetherbyconductivefoam, alminumfoil or

comparableconductivematerial).

7. Immediatelybeforeremoving theprotectivematerial fromthe

leadsofareplacementES device, touchtheprotectivematerial to

thechassisorcircuitassemblyintowhichthedevice will be

installed.

Caution

Besureno powerisappliedtothechassisorcircuit, and observe

all othersafetyprecautions.

8. Minimizebodilymotionswhenhandling unpackagedreplacement

ES devices. (Otherwise hamless motion suchas thebrushing

togetherofyourclothes fabricorthelifting ofyourfootfroma

carpetedfloorcangenerate staticelectricity(ESD)sufficient

todamageanES device).

4. About lead free solder(PbF)

Note:Leadislistedas (Pb)intheperiodictableofelements.

Intheinformation below, Pbwill refertoLeadsolder, and PbF will refertoLeadFree Solder.

TheLeadFree Solderusedinour manufacturing process and discussedbelowis(Sn+Ag+Cu).

ThatisTin(Sn), Silver(Ag)and Copper(Cu)although othertypes areavailable.

Thismodel uses PbFree solderinit’smanufactureduetoenvironmental conservation issues.

For service and repairwork, we’dsuggesttheuse ofPbfree solderas well, although Pbsolder

may beused.

PCBsmanufacturedusing leadfree solderwill have thePbF withinaleafSymbol

stampedon theback ofPCB.

Caution

-Pbfree solderhas ahighermelting pointthanstandardsolder.

Typicallythemelting pointis50 ~70 °F(30~40 °C)higher. Please

use ahigh temperaturesoldering iron and set itto700 ±20 °F(370

±10 °C).

-Pbfree solderwill tend tosplashwhenheatedtoo high (about1100

°For600 °C).

Ifyou must use Pbsolder, please completelyremoveall ofthePb

free solderon thepinsorsolderarea beforeapplying Pbsolder. If

thisisnotpractical, besuretoheat thePbfree solderuntil itmelts,

beforeapplying Pbsolder.

-Afterapplying PbF soldertodoublelayeredboards, please check

thecomponentsideforexcess solderwhichmayflow ontothe

opposite side. (see figurebelow)

SuggestedPbfree solder

Thereareseveral kindsofPbfree solderavailablefor purchase. Thisproductuses Sn+Ag+Cu

(tin, silver, copper)solder. However, Sn+Cu(tin, copper), Sn+Zn+Bi (tin, zinc, bismuth)soldercan

alsobeused.

5. PCB Structuresheet of GPH6D2chassis

Board Name Function Remarks

DDigital Signal Processor 1

JSlotInterface &SYNC

processor 1

ZAudioout, DC-DC converter

SS SustainOut 1

SC Scanout 1

SU Sustainconnection (Upper) 1

SD Sustainconnection (Lower) 1

C1 DataDrive (UpperRight)

C2 DataDrive (UpperCenter)

C3 DataDrive (LowerLeft)

C4 DataDrive (LowerLeft)

C5 DataDrive (LowerCenter)

C6 DataDrive (LowerRight)

H3 Speakerterminal

S1 Powerswitch

SS2 Sustainconnection (Upper)

SS3 Sustainconnection (Lower)

V1 FrontSW. &Remotereceiver

PF Linefilter

PPowersupply 1

HX PC_type_Inputterminal

HY BNC Composite/Component

Video 2

HZ BNC ComponentVideo 3

Remarks

1. Recommend PCB'sforinitial service forGPH6D2chassis.

2. ForSystemmodel exceptBX, EX version

3. ForConsumermodel exceptBX, EX version

6. Service Hint

7. Location of Lead Wiring

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