Panasonic LH-32RM1MX Manuel utilisateur
HD/FHD LCD Display
Model No. LH-32RM1MX
Chassis. 2M01M
WARNING
This service information is designed for experienced repair technicians only and is not designed for use by the general public.
It dose not contain warnings or cautions to advise non -technical individuals of potential dangers in attempting to service a product.
Products powered by electricity should be serviced or repaired only by experienced professional technicians. Any attempt to ser-
vice or repair the product or products dealt with in this service information by anyone else could result in serious injury or death.
IMPORTANT SAFETY NOTICE
There are special components used in this equipment which are important for safety. These parts are marked by 7in the schematic
diagram, circuit board diagrams, exploded views and replacement parts list. It is essential that these critical parts should be replaced
with manufacturer’s specified parts to prevent shock, fire, or other hazards. Do not modify the original design without permission of
manufacturer.
© Panasonic Corporation 2015. Unauthorized
copying and distribution is a violation of law.
PREFACE
Table of Contents
1.Safety Precautions
2.Warning
3.Specifications
SECTION 1 SERVICE INFORMATION
1.Name of each part
2.Notes on Service
3.Service Mode
4.Troubleshooting Guide
SECTION 2 DISASSEMBLY PROCEDURES
1.Preparations
2.Parts Disassembly
3.Replacement of LCD Panel Module
SECTION 3 ADJUSTMENTS
1.Software Update Procedures
2.Software Update BY USB
3.How to catch log file
4.Hotel Mode Setting
5.User Manual of RS232
SECTION 4 DIAGRAMS
1. Block Diagrams
SECTION 5 PARTS LIST
1.Exploded views
2.IGP List
2
PREFACE
1. Safety Precautions
1.1.General Guidelines
1. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.
2. When wiring units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the
wires have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.
3. When conducting repairs and servicing, do not twist the Fasten connectors but plug them straight in or unplug them straight
out.
4. When servicing, observe the original lead dress. If a short circuit is found, replace all parts have been overheated or
damaged by the short circuit.
5. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.2.Touch Current check
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground
such as a water pipe, as shown in Figure 1.
3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reserve the AC plug in the AC outlet and repeat each of the above measure.
6. The potential at any point (TOUCH CURRENT) shall not exceed 0.5 MIU.
7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the customer.
Figure 1
3
PREFACE
1.3.Touch current check
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground
such as a water pipe, as shown in Figure 1.
3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reserve the AC plug in the AC outlet and repeat each of the above measure.
6. The potential at any point (TOUCH CURRENT) expressed as voltage U1and U2, does not exceed the following values:
For a. c.: U1= 35 V (peak) and U2= 0.35 V (peak);
For d. c.: U1= 1.0 V,
Note:
The limit value of U2= 0.35 V (peak) for a. c. and U1= 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and
2.0 mA d. c.
The limit value U1= 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100 kHz.
7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the customer.
4
PREFACE
2. Warning
2.1.Prevention of Electrostatic Dischargearge(ESD) to Electrostatically Sensitive (ES)
Devictive
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Elec-trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors
and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component
damage caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)”
can generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the
brush-ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD)
sufficient to damage an ES device).
5
PREFACE
2.2. About lead free solder(PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
6
PREFACE
3. Specifications
7
8
SECTION 1 SERVICE INFORMATION
Service Information
Model No. LH-32RM1MX
CONTENTS
SECTION 1 SERVICE INFORMATION
1. Name of each part. . . . . . . . . . . . . . . . . . . . . INF-2
1. 1. Display body
1. 2. Connecting terminals
1. 3. Remote controls
2. Notes on Service. . . . . . . . . . . . . . . . . . . . . . INF-5
2. 1. Before service operation
2. 2. Service
3. Service Mode. . . . . . . . . . . . . . . . . . . . . . . INF-6
3. 1. Watching display
3. 2. Using Media Player
4. Troubleshooting Guide. . . . . . . . . . . . . . . . . . . INF-11
4. 1. Troubleshooting flow
INF-1
SECTION 1 SERVICE INFORMATION
1. Name of each part
1. 1. Display body
INF-2
Table des matières
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