Panasonic TX-L32C2E Manuel utilisateur

Service Manual

Colour LCD Television

TX-L32C2B

TX-L32C2E

GLP25 Chassis

Specifications

Power Source: 220-240V AC, 50Hz

Rated Power Consumption: 93W

Stand-by Power Consumption: 0.3W (Without monitor out recording)

13W (With monitor out recording)

Aerial Impedance: 75Ωunbalanced, Coaxial Type

Receiving System: C2B

PAL-I

PAL-525/60 (AV only)

M.NTSC (AV only)

NTSC (AV only)

DVB-T Digital terrestrial services via UHF aerial input.

C2E

PAL-I/H, B/G, D/K,

SECAM B/G, D/K, L/L’

PAL-525/60 (AV only)

M.NTSC (AV only)

NTSC (AV only)

DVB-T Digital terrestrial services (MPEG2 and MPEG4-AVC(H.264))

DVB-C Digital cable services (MPEG2 and MPEG4-AVC(H.264))

Receiving Chanels: C2B C2E

UHF E21-E68 VHF E2-E12 VHFH1-H2(ITALY)

VHFA-H (ITALY) VHFR1-R2

VHFR3-R5 VHFR6-R12

UHFE21-E69 CATV (S01-S05)

CATV S1-S10 (M1-M10) CATV S11-S20 (U1-U10)

CATV S21-S41 (Hyperband)

Aerial - Rear: C2B C2E

UHF VHF/UHF

Operating Conditions: Temperature: 0°C ÷35°C

Humidity: 20% ÷80% RH (non condensing)

Unauthorized copying and

distribution is a violation of law.

ORDER No. PCZ1006118CE

REVISION 2

Intermediate Frequency:

Video/Audio C2B C2E

Video 38.9MHz 38.9MHz, 33.9MHz

Audio 32.90MHz 33.4MHz (B/G), 33.16MHz (A2)

32.35MHz(NICAM) 33.05MHz (NICAM B/G,D/K,L)

32.4MHz (D/K), 32.66MHz(CZSTEREO)

40.4MHz (L’), 39.75MHz (L’NICAM)

Colour 34.47MHz 34.47MHz (PAL)

34.5MHz,34.65MHz(SECAM)

38.3MHz,38.15MHz(SECAM L’)

Terminals:

AV1 IN Video (21 pin) 1V p-p 75Ω

Audio (21 pin) 500mV rms 10kΩ

RGB (21 pin) 0.7V p-p 75Ω

S-video IN (21-pin) Y: 1V p-p 75Ω

C:0.3V p-p 75Ω

AV1 OUT Video (21 pin) 1V p-p 75Ω

Audio (21 pin) 500mV rms 1kΩ

AV2 IN Video (RCAx1) 1V p-p 75Ω

AUDIO IN Audio (RCAx2) 500mV rms 10kΩ(used for HDMI_ COMPONENT-AUDIO)

COMPONENT Video (RCAx3) Y:1V p-p 75Ω(including synchronization)

Pb, Pr: ±0.35V p-p 75Ω

HDMI Type A Connectors

HDMI(Version 1.4 with Audio Return Channel))

This TV supports “HDAVI Control 5” function.

C2B C2E

DIGITAL AUDIO OUT PCM / Dolby digital, PCM / Dolby digital / DTS

Fiber optic Fiber optic

C2B C2E

CARD SLOT SD CARD slot x1 SD CARD slot x1

Common interface slot x1 Common interface slot (Complies with CI+) x1

LCD screen: L5EDD8Q00063

1,366 x 768, 16:9

Visible Diagonal 800mm

Audio Output: 10W (2 x 5W), 10% THD

Headphones: 3.5mm, 8ΩImpedance

Accessories supplied : Remote Control 2 x R6 (UM3) Batteries

Dimensions:

Height: Width: Depth:

Including TV stand 551mm 798mm 217mm

TV set only 511mm 798mm 87mm

Mass:

Including TV stand 11.0kg

TV set only 9.5kg

Specifications are subject to change without notice.

Mass and dimensions shown are approximate.

This service information is designed for experienced repair technicians only and is not designed for use by the general public. It does not

contain warnings or cautions to advise non-technical individuals of potencial dangers in attempting to service a product. Products

powered by electricity should be serviced or repaired only by experienced professional technicians. Any attempt to service or repair the

product or products deal within this service information by anyone else could result in serious injury or death.

Warning

CONTENTS

SAFETY PRECAUTIONS........................................... 4

GENERAL GUIDE LINES...................................... 4

TOUCH – CURRENT CHECK............................... 4

PREVENTION OF ELECTROSTATIC DISCHARGE

(ESD) TO ELECTROSTATICALLY SENSITIVE (ES)

DEVICES.................................................................... 5

ABOUT LEAD FREE SOLDER (PBF)......................... 6

SUGGESTED PB FREE SOLDER........................ 6

APPLICABLE SIGNALS.............................................. 7

SERVICE HINTS ........................................................ 8

CHASSIS BOARD LAYOUT....................................... 9

LOCATION OF LEAD WIRING………………………... 9

TECHNICAL DESCRIPTION ................................….10

SPECIFICATION OF KEY FOR CI PLUS,

DTCP-IP AND ONE-TO-ONE.............................. 10

GENERAL INFORMATION................................. 10

REPLACEMENT OF ICS..................................... 10

MODEL AND KEYS ............................................ 10

SETTING INSPECTION............................................ 11

SELF CHECK ........................................................... 12

POWER LED BLINKING TIMING CHART ............... 13

POWER ON TIME, ON/OFF..................................... 16

HOTEL MODE .......................................................... 17

DATA COPY BY SD CARD....................................... 18

DATA COPY FROM TV SET TO SD CARD............. 19

DATA COPY FROM SD CARD TO TV SET .............20

OPTION BYTES DESCRIPTION.............................. 21

ADJUSTMENT METHOD.......................................... 22

WIRING DIAGRAM................................................... 23

BLOCK DIAGRAM.................................................... 24

PARTS LOCATION................................................... 25

REPLACEMENT PARTS LIST.................................. 27

SCHEMATIC DIAGRAMS......................................... 38

A-BOARD (1 OF 20) SCHEMATIC DIAGRAM.... 39

V-BOARD SCHEMATIC DIAGRAM .................... 59

CONDUCTOR VIEWS .............................................. 60

SERVICE MODE FUNCTION................................... 14

SERVICE.................................................................. 15

SERVICE TOOL MODE .......................................... 16

DISPLAY OF SOS HISTORY ................................... 16

Safety Precautions

General Guide Lines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated

or damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following touch current checks to prevent the customer from being exposed to shock hazards.

4. Always ensure panel TKP0E16001 is correctly replaced before returning to customer (see Fig.1).

Touch-Current Check

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth

ground such as a water pipe, as shown in Fig. 2.

3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reserve the AC plug in the AC outlet and repeat each of the above measure.

6. The potential at any point (TOUCH CURRENT) expressed as voltage U1 and U2, does not exceed the following values:

For a. c.: U1 = 35 V (peak) and U2 = 0.35 V (peak);

For d. c.: U1 = 1.0 V,

Note:

The limit value of U2 = 0.35 V (peak) for a. c. and U1 = 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and

2.0 mA d. c.

The limit value U1 = 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100

kHz.

7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should

be repaired and rechecked before it is returned to the customer.

Fig. 2

APPLIANCES

EXPOSED

METAL PARTS

Resistance values in ohms (Ω)

R0=500

RS=1500

CS=0.22

10k

0.022

COLD

WATER PIPE

(EARTH GROUND)

V: Voltmetr or oscilloscope

(r.m.s. or peak reading)

Measuring network for TOUCH CURRENTS

Input resistance: ≥ 1M

Input capacitance: ≤ 200pF

Frequency range: 15Hz to 1MHz and d.c.respectively

NOTE – Appropriate measures should be taken to obtain the correct value in case of non-sinusoidal waveforms

U2(V)

Fig. 1

Prevention of Electrostatic Discharge (ESD) to Electrostatically

Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are

called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect

transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of

component damage caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on

your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD

wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as

aluminum foil, to prevent electrostatic charge build up or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD

protected)" can generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it.

(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil

or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective

material to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the

brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity

(ESD) sufficient to damage an ES device).

There are special components used in this equipment which are important for safety.

These parts are marked by in schematic diagrams, exploded views and replacement parts list. It is essential that

these critical parts should be replaced with manufacturer’s specified parts to prevent shock, fire, or other hazards. Do

not modify the original design without permission of manufacturer.

IMPORTANT SAFETY NOTICE

About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements.

In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.

The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).

That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work,

we’d suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol

stamped on the back of PCB.

Caution

•Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40°C)

higher. Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

•Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before

applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

•After applying PbF solder to double layered boards, please check the component side for excess solder which may

flow onto the opposite side. (see Fig.3)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.

However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used. (see Fig.4)

Fig.3

Fig.4

Applicable Signals

Applicable input signal.

Applicable input signal for PC is basically compatible to HDMI standard timing.

Signal name Horizontal frequency (kHz) Vertical frequency (Hz)

640 ×480 @60 Hz 31.47 60.00

750 (720) / 60p 45.00 60.00

1,125 (1,080) / 60p 67.50 60.00

Note:

•Signals other than above may not be displayed properly.

•The above signals are reformatted for optimal viewing on your display.

•PC signal is magnified or compressed for display, so that it may not be possible to show fine detail

with sufficient clarity.

Signal name COMPONENT HDMI

525 (480) / 60i * *

525 (480) / 60p * *

625 (576) / 50i * *

625 (576) / 50p * *

750 (720) / 60p * *

750 (720) / 50p * *

1,125 (1,080) / 60i * *

1,125 (1,080) / 50i * *

1,125 (1,080) / 60p *

1,125 (1,080) / 50p *

1,125 (1,080) / 24p *

PC (from HDMI terminal)

Component (Y, Pb, Pr), HDMI

Service Hints

How to remove the backcover

Lay the main unit face down. (see Fig.5)

Remove the 4 fixing screws and the pedestal assembly. (see Fig.6)

Remove the 16 fixing screws and the backcover. (see Fig.7)

Fig.6

SCREWS

Fig.7

SCREWS SCREWS

Fig.5

[XYN4+F12FJK]

Chassis Board Layout

Location of Lead Wiring

To find the Part Number of required wire in Replacement Parts List click on the wire name in red box.

Board Name Function

A-Board AV Terminal, HDMI, Digital Audio Out, TV tuner, SD Card, DVB-T/C Dem,

sLD, AV Switch, EEPROM, Flash Memory, Speaker out, HP

V-Board Remote Receiver, Power and Timer LED

P-Unit Main Input, Power Supply

P-UNIT

V-BOARD

A-BOARD

A02

SP_L

V10

S01

A10

P1 TU2901A

A12

A09

A14

SP_R

CN0100

LVDS WIRE

A09-P2 WIRE

WIRE ASSY

Technical Description

Specification of KEY for CI Plus, DTCP-IP and One-to-One

General information:

1.EEPROM (IC8950) for spare parts has the seed of KEY for each.

2.The final KEY data will be generated by sLD IC (IC8001) when SELF CHECK was done and are stored in both sLD IC

(IC8001) and EEPROM (IC8950).

Three KEY are not generated for all models.

The necessary KEY are only generated and stored depend on the feature of models.

Replacement of ICs:

When sLD IC (IC8001) is replaced, EEPROM (IC8950) should be also replaced with new one the same time.

When EEPROM (IC8950) is replaced, sLD IC (IC8001) is not necessary to be replaced the same time.

After the replacement of IC, SELF CHECK should be done to generate the final KEY data.

How to SELF CHECK: While pressing [VOLUME ( - )] button on the main unit, press [MENU] button on the remote

control for more than 3 seconds.

TV will be forced to the factory shipment setting after this SELF CHECK.

Model and Keys:

Keys

Model No. CI PLUS DTCP-IP One-to_one

(for USB Rec.)

TX-L32C2B None None None

TX-L32C2E Yes None None

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