Panasonic TH-L32C53T Manuel utilisateur

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ORDER NO. MTV1207163CE

LCD TV

Model No. TH-L32C53T

Chassis: KM17

Destination: THAILAND

TABLE OF CONTENTS

PAGE PAGE

1 Safety Precautions----------------------------------------------- 3

1.1. General Guidelines---------------------------------------- 3

1.1.1. Leakage Current Cold Check---------------------- 3

1.1.2. Leakage Current Hot Check (See Figure

1.) --------------------------------------------------------- 3

2 Warning -------------------------------------------------------------- 4

2.1. Prevention of Electrostatic Discharge (ESD)

to Electrostatically Sensitive (ES) Devices---------- 4

2.2. About lead free solder (PbF)---------------------------- 5

3 Service Navigation ----------------------------------------------- 6

3.1. Service Hint ------------------------------------------------- 6

4 Specifications ----------------------------------------------------- 7

5 Service Mode ------------------------------------------------------ 9

5.1. How to enter into Service Mode ----------------------- 9

5.1.1. Contents of adjustment mode --------------------- 9

5.1.2. How to exit---------------------------------------------- 9

5.2. SRV-TOOL -------------------------------------------------10

5.2.1. How to access ----------------------------------------10

5.2.2. Display of SOS History -----------------------------10

5.2.3. POWER ON TIME/COUNT -----------------------10

5.2.4. Exit ------------------------------------------------------ 10

5.2.5. Self Check (Device) -------------------------------- 11

5.2.6. Hotel Mode Adjustment---------------------------- 11

5.2.7. Hotel Mode-------------------------------------------- 11

6 Troubleshooting Guide --------------------------------------- 12

6.1. Check of the IIC bus lines------------------------------ 12

6.1.1. How to access --------------------------------------- 12

6.1.2. Exit ------------------------------------------------------ 12

6.1.3. Screen display --------------------------------------- 12

6.2. Power LED Blinking timing chart --------------------- 13

6.3. No Power--------------------------------------------------- 13

7 Disassembly and Assembly Instructions--------------- 14

7.1. Control Button Assembly------------------------------- 14

7.2. Speaker Unit Installation ------------------------------- 16

7.3. LCD Panel Assembly ----------------------------------- 18

7.4. LCD Panel Fixing & Handling Method -------------- 20

7.5. LED Panel Assembly------------------------------------ 21

7.6. LVDS & Barrier Assembly------------------------------ 22

7.7. Metal Part Assembly ------------------------------------ 24

7.8. Screws Fixing --------------------------------------------- 25

TH-L32C53T

7.9. PCB Installation------------------------------------------- 26

7.10. Back Cover Installation --------------------------------- 28

8 Measurements and Adjustments -------------------------- 30

8.1. Voltage chart of A-board-------------------------------- 30

8.2. Voltage chart of IP-board------------------------------- 30

8.3. Target of WB adjustment value ----------------------- 30

9 Block Diagram --------------------------------------------------- 31

9.1. Main Block Diagram ------------------------------------- 31

10 Wiring Connection Diagram --------------------------------- 32

10.1. Wire Dressing --------------------------------------------- 32

11 Schematic Diagram--------------------------------------------- 34

11.1. Schematic Diagram Notes ----------------------------- 34

11.2. A-Board (1/16) Schematic Diagram ----------------- 35

11.3. A-Board (2/16) Schematic Diagram ----------------- 36

11.4. A-Board (3/16) Schematic Diagram ----------------- 37

11.5. A-Board (4/16) Schematic Diagram ----------------- 38

11.6. A-Board (5/16) Schematic Diagram ----------------- 39

11.7. A-Board (6/16) Schematic Diagram ----------------- 40

11.8. A-Board (7/16) Schematic Diagram ----------------- 41

11.9. A-Board (8/16) Schematic Diagram ----------------- 42

11.10. A-Board (9/16) Schematic Diagram ----------------- 43

11.11. A-Board (10/16) Schematic Diagram --------------- 44

11.12. A-Board (11/16) Schematic Diagram---------------- 45

11.13. A-Board (12/16) Schematic Diagram --------------- 46

11.14. A-Board (13/16) Schematic Diagram --------------- 47

11.15. A-Board (14/16) Schematic Diagram --------------- 48

11.16. A-Board (15/16) Schematic Diagram --------------- 49

11.17. A-Board (16/16) Schematic Diagram --------------- 50

11.18. GK-Board Schematic Diagram ----------------------- 51

11.19. K-Board Schematic Diagram-------------------------- 52

11.20. IP-Board Schematic Diagram ------------------------- 53

12 Printed Circuit Board ------------------------------------------ 54

12.1. A-BOARD -------------------------------------------------- 54

12.2. GK-BOARD------------------------------------------------ 56

12.3. K-BOARD -------------------------------------------------- 57

12.4. IP-BOARD ------------------------------------------------- 58

13 Exploded View and Replacement Parts List ----------- 59

13.1. Exploded View and Mechanical Replacement

Parts List --------------------------------------------------- 59

13.2. Electrical Replacement Parts List-------------------- 59

13.2.1. Replacement Parts List Notes ------------------- 59

13.2.2. Electrical Replacement Parts List --------------- 60

TH-L32C53T

1 Safety Precautions

1.1. General Guidelines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

4. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.

5. When wiring units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the

wires have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.

6. When conducting repairs and servicing, do not twist the Faston connectors but plug them straight in or unplug them straight

out.

1.1.1. Leakage Current Cold Check

1. Unplug the AC cord and connect a jumper between the

two prongs on the plug.

2. Measure the resistance value, with an ohmmeter,

between the jumpered AC plug and each exposed

metallic cabinet part on the equipment such as

screwheads, connectors, control shafts, etc. When the

exposed metallic part has a return path to the chassis, the

reading should be 100 Mohm and over.

When the exposed metal does not have a return path to

the chassis, the reading must be .

1.1.2. Leakage Current Hot Check (See

Figure 1.)

1. Plug the AC cord directly into the AC outlet. Do not use

an isolation transformer for this check.

2. Connect a 1.5kohm, 10 watts resistor, in parallel with a

0.15μF capacitors, between each exposed metallic part

on the set and a good earth ground such as a water pipe,

as shown in Figure 1.

3. Use an AC voltmeter, with 1000 ohms/volt or more

sensitivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the

voltage at each point.

5. Reverse the AC plug in the AC outlet and repeat each of

the above measurements.

6. The potential at any point should not exceed 0.75 volts

RMS. A leakage current tester (Simpson Model 229 or

equivalent) may be used to make the hot checks, leakage

current must not exceed 1/2 milliamp. In case a

measurement is outside of the limits specified, there is a

possibility of a shock hazard, and the equipment should

be repaired and rechecked before it is returned to the

customer.

Figure 1

TH-L32C53T

2Warning

2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically

Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called

Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and

semiconductor [chip] components. The following techniques should be used to help reduce the incidence of component damage

caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,

which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as

aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as [anti-static (ESD protected)] can

generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or

comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the

brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD)

sufficient to damage an ES device).

TH-L32C53T

2.2. About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements.

In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.

The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).

That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d

suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.

Caution

• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please

use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb

solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the

opposite side. (see figure below)

TH-L32C53T

3 Service Navigation

3.1. Service Hint

Board Name Main Device Remarks

A BOARD AVSW, TUN, OFDM, P-SLD2, EEP Repairable

IP BOARD Power Supply and Inverter Repairable

K BOARD Remote, LED, Luminunce Sensor Repairable

GK BOARD Power Switch, Keyscan Repairable

TH-L32C53T

4 Specifications

Power Source AC 110 - 240 V, 50 / 60 Hz

Power Consumption

(Power Rating) 99 W

Display panel

Panel system Liquid Crystal Display

Visible screen size (diagonal) 80 cm / 32 inches

Number of pixels 1,049,088 (1,366 (W) ×768 (H))

Dimensions (W ×H ×D) 825 mm ×533 mm ×196 mm (With Pedestal)

825 mm ×483 mm ×86 mm (TV only)

Mass 9.0 kg Net (With Pedestal)

8.0 kg Net (TV only)

Sound

Speaker Speakers ×2

Audio Output 30 W (15 W + 15 W)

Receiving Systems / Band name 17 SYSTEMS FUNCTIONS

1PAL B, G, H

Reception of broadcast transmission and

Playback from Video Cassette Tape

Recorders.

2PAL I

3PAL D, K

4SECAM B, G

5SECAM D, K

6SECAM K1

7NTSC M (NTSC 3.58 / 4.5MHz)

8NTSC 4.43 / 5.5 MHz

Playback from Special VCR’s or DVD.

9NTSC 4.43 / 6.0 MHz

10 NTSC 4.43 / 6.5 MHz

11 NTSC 3.58 / 5.5 MHz

12 NTSC 3.58 / 6.0 MHz

13 NTSC 3.58 / 6.5 MHz

14 SECAM I

15 PAL 60 Hz / 5.5 MHz Playback from Special Disc Players and

Special VCR’s or DVD.

16 PAL 60 Hz / 6.0 MHz

17 PAL 60 Hz / 6.5 MHz

Receiving Channels

VHF BAND 2 - 12 (PAL / SECAM B, K1)

0 - 12 (PAL B AUST.)

1 - 9 (PAL B N.Z.)

1 - 12 (PAL / SECAM D)

1 - 12 (NTSC M Japan)

2 - 13 (NTSC M USA)

UHF BAND 21 - 69 (PAL G, H, I / SECAM G, K, K1)

28 - 69 (PAL B AUST.)

13 - 57 (PAL D, K)

13 - 62 (NTSC M Japan)

14 - 69 (NTSC M USA)

CATV S1 - S20 (OSCAR)

1 - 125 (USA CATV)

C13 - C49 (JAPAN)

S21 - S41 (HYPER)

Z1 - Z37 (CHINA)

5A, 9A (AUST.)

Aerial - Rear VHF / UHF

Operating Conditions Temperature : 0°C - 40°C

Humidity : 20 % - 80 % RH (non-condensing)

Connection Terminals

AV1 IN AUDIO L-R RCA PIN Type ×2 0.5 V [rms]

COMPONENT Y 1.0 V [p-p] (including synchronisation)

PB/CB, PR/CR±0.35 V[p-p]

VIDEO RCA PIN Type ×1 1.0 V [p-p] (75 Ω)

AV2 IN AUDIO L-R RCA PIN Type ×2 0.5 V [rms]

VIDEO RCA PIN Type ×1 1.0 V [p-p] (75 Ω)

AUDIO OUT AUDIO L-R RCA PIN Type ×2 0.5 V[rms] (high impedance)

HDMI 1 / 2 input TYPE A Connectors

• This TV supports ‘HDAVI Control 5’ function.

TH-L32C53T

Note

• Design and Specifications are subject to change without notice. Mass and Dimensions shown are approximate.

PC HIGH-DENSITY D-SUB 15 PIN

R, G, B: 0.7 V[p-p] (75 Ω)

HD,VD: TTL Level 2.0-5.0 V [p-p] (high impedance)

• Applicable input signals:

VGA, SVGA, WVGA, XGA

SXGA, WXGA ······ (compressed)

Horizontal scanning frequency 31 - 69 kHz

Vertical scanning frequency 60 Hz

Card Slot SD Card slot ×1

USB 1 / 2

USB 2.0 TYPE A Connectors

DC 5 V, Max. 500 mA

TH-L32C53T

5 Service Mode

5.1. How to enter into Service Mode

While pressing [VOLUME ( - )] button of the main unit, press [INFO] button of the remote control three times within 2 seconds.

5.1.1. Contents of adjustment mode

• Value is shown as a hexadecimal number.

• Preset value differs depending on models.

• After entering the adjustment mode, take note of the value in each item before starting adjustment.

5.1.2. How to exit

Switch off the power with the [POWER] button on the main unit or the [POWER] button on the remote control.

Main item Sub item Sample Data

ADJUST CONTRAST 000

COLOR 59

TINT FE

SUB-BRT 800

BACKLGT 20D

B-Y-G 40

R-Y-A 0

VCOM 189

WB-ADJ R-GAIN 75

G-GAIN 80

B-GAIN 65

R-CENT 80

G-CENT 80

B-CENT 9B

OPTION Boot ROM

STBY-SET 00

EMERGENCY ON

CLK MODE 00

CLOCK FC7

EDID-CLK HIGH

SRV-TOOL 00

TH-L32C53T

5.2. SRV-TOOL

5.2.1. How to access

1. Select [SRV-TOOL] in Service Mode.

2. Press [OK] button on the remote control.

5.2.2. Display of SOS History

SOS History (Number of LED blinking ) indication.

From left side; Last SOS, before Last, three occurrence before, 2nd occurrence after shipment, 1st occurrence after shipment.

This indication except 2nd and 1st occurrence after shipment will be cleared by [Self-check indication and forced to factory

shipment setting].

5.2.3. POWER ON TIME/COUNT

Note : To display TIME/COUNT menu, highlight position, then press MUTE for 3sec.

Time : Cumulative power on time, indicated hour : minute by decimal

Count : Number of ON times by decimal

Note : This indication will not be cleared by either of the self-checks or any other command.

5.2.4. Exit

1. Disconnect the AC cord from wall outlet.

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