Panasonic SA-HT990E Manuel utilisateur

ORDERNO.MD0603064C2

DVDHome Theater Sound System

SA-HT990E / SA-HT990EB / SA-HT990EG

Colour

(S).......................Silver Type

SPECIFICATIONS

Specifications

General

Power Source:

E/ EG areas: AC 230V, 50Hz

EB area: AC 230V-240V, 50Hz

Power consumption: 120 W

Dimensions(W×H×D): 430×60×354 mm

Mass: 3.35kg

Amplifier section

RMS Output Power: DolbyDigital Mode

Total RMS Dolby

Digital

modePower:

1000 W

At 1kHz and total harmonicof 10%

Front: 125 W/ Channel (3 )

Center: 250 W/ Channel (6 )

Surround: 125 W/ Channel (3 )

At 100Hz and total harmonicof 10%

Activesubwoofers: 250 W/ Channel (6 )

DIN Output Power: DolbyDigital Mode:

Total DIN DolbyDigital modePower:

470 W

At 1kHz and total harmonicof 1%

Front: 80 W/ Channel (3 )

Center: 75 W/ Channel (6 )

Surround: 80 W/ Channel (3 )

At 100Hz and total harmonicof 1%

Subwoofer: 75 W/ Channel (6 )

FM tuner section

Preset Memory: FM 15 stations

AM/MW15 stations

FrequencyRange: 87.5-108.00MHz

(50kHz instep)

Sensitivity: 1.8 V (IHF)

S/N 26dB 1.4 V

AntennaTerminals: 75 (unbalanced)

AM tuner section

FrequencyRange: 522-1629kHz (9kHz instep)

AM SensitivityS/N 20dB at

999kHz:

560 V/m

PhoneJack:

Terminal: Stereo3.5mm jack

Front M. Port:

Sensitivity: 100mV (15k )

Terminal: Stereo3.5mm jack

Disc section

Discs played(8cm or12 cm):

(1) DVD [DVD-Video, DVD-Audio, DivX(*1,2)]

(2) DVD-RAM [DVD-VR, MP3(*2,6), JPEG(*2,3), MPEG4(*2,4),

DivX(*1,2)]

(3) DVD-R [DVD-Video, DVD-VR, MP3(*2,6), JPEG(*2,3),

MPEG4(*2,4), DivX(*1,2)]

(4) DVD-R DL[DVD-Video, DVD-VR]

(5) DVD-RW[DVD-Video, DVD-VR, MP3(*2,6), JPEG(*2,3),

MPEG4(*2,4), DivX(*1,2)]

(6) +R/+RW[Video]

(7) +R DL[Video]

(8) CD, CD-R/RW[CD-DA, VideoCD, SVCD(*5), MP3(*2,6),

WMA(*2,7), JPEG(*2,3), MPEG4(*2,4), DivX (*1,2),

HighMATLevel 2(Audioand Image)]

*1 Playsall versionsof DivX video(including DivX 6)

withstandardplayback of DivX mediafiles. Certified

totheDivX Home Theater Profile.

GMC (Global Motion Compensation) isnot supported.

*2Thetotal combinedmaximumnumber of recognizable

audio, picture and videocontentsand groups: 4000

audio, picture and videocontentsand 400 groups.

*3Exif Ver 2.1JPEG Baselinefiles

Picture resolution: between160 x120 and 6144 x

4096 pixels(Sub sampling is4:0:0, 4:2:0, 4:2:2, 4:4:4).

Extremelylong and narrowpictures maynot be

displayed.

*4MPEG4datarecordedwithPanasonicSD multi cameras

orDVD videorecorders.

Conforming toSD VIDEO specifications(ASF

standard)/ MPEG4(SimpleProfile) videosystem/G.726

audiosystem.

*5Conforming toIEC62107

*6MPEG-1Layer 3, MPEG-2Layer 3

*7WindowsMediaAudioVer.9.0L3

Not compatiblewithMultipleBit Rate(MBR)

Pick up:

Wavelength:

CD: 785nm

DVD: 662nm

Laser power:

CD: CLASS 1M

DVD: CLASS 1

Audiooutput (DISC):

Number of channels: 5.1ch(FL, FR, C, SL, SR,

SW)

Audioperformance (Measurement at BE out terminal):

Frequencyresponse:

DVD (linear audio): 4Hz-22 kHz (48 kHz

sampling)

4Hz-44 kHz (96 kHz

sampling)

DVD-Audio: 4Hz-88 kHz (192 kHz

sampling)

CD-Audio: 4Hz-20 kHz

S/N ratio:

CD-Audio: 105 dB

Dynamicrange:

DVD (linear audio): 95 dB

CD-Audio: 95 dB

Total harmonicdistortion:

CD-Audio: 0.005 %

Videosection

Videosystem:

Signal system: PAL625/50, PAL525/60,

NTSC

Compositevideooutput:

Output level: 1Vp-p(75 )

Terminal: Pinjack (1system)

Scart jack (1system)

S-videooutput:

Y output level: 1Vp-p(75 )

C output level: PAL; 0.3Vp-p(75 )

NTSC; 0.286 Vp-p(75 )

Terminal S terminal (1system)

Scart jack (1system)

Component videooutput (NTSC: 480p/480i, PAL: 576p/576i):

Y output level: 1Vp-p(75 )

PBoutput level: 0.7Vp-p(75 )

PRoutput level: 0.7Vp-p(75 )

Terminal: Pinjack (Y: green, PB: blue,

PR: red) (1system)

RGB videooutput:

R output level: 0.7Vp-p(75 )

G output level: 0.7Vp-p(75 )

B output level: 0.7Vp-p(75 )

Terminal: Scart jack (1system)

Power consumption instandbymode:

approx0.5W

Note:

1. Specificationsare subject tochangewithout notice.

Mass and dimensionsare approximate.

2. Total harmonicdistortion ismeasuredbythedigital

spectrumanalyzer.

Solder:

Thismodel uses leadfree solder (PbF).

Mechanism:

Thismodel uses DL2SU (Singletray) mechanism.

Refer totheoriginal service manual for*1, *2, *3, *4.

2006 PanasonicAVCNetworks Singapore Pte. Ltd. All rights

reserved. Unauthorized copying and distribution isaviolation of

law.

1. Safety Precautions

1.1. GENERALGUIDELINES

1. When servicing, observe the original lead dress. Ifashort circuit

isfound, replace all parts which have been overheated or

damaged bythe short circuit.

2. After servicing, see to itthat all the protective devices such as

insulation barriers, insulation papers shields are properly

installed.

3. After servicing, carryout the following leakage current checks to

prevent the customer from being exposed to shock hazards.

1.1.1. LEAKAGE CURRENTCOLD CHECK

1. Unplug the AC cord and connect ajumper between the two

prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between the

jumpered AC plug and each exposed metalliccabinet part on the

equipment such as screwheads, connectors, control shafts, etc.

When the exposed metallicpart has areturn path to the chassis,

the reading shouldbe between 1M and 5.2M . / When the

exposed metal does not have areturn path to the chassis, the

reading must be . Figure 1

1.1.2. LEAKAGE CURRENTHOTCHECK (See Figure 1.)

1. Plug the AC cord directlyinto the AC outlet. Donot use an

isolation transformer for thischeck.

2. Connect a1.5k , 10 watts resistor, inparallel with a0.15 F

capacitors, between each exposed metallicpart on the set and a

good earth ground such as awater pipe, as shownin Figure 1.

3. Use an AC voltmeter, with 1000 ohms/voltor more sensitivity, to

measure the potential across the resistor.

4. Check each exposed metallicpart, and measure the voltage at

each point.

5. Reverse the AC plug inthe AC outlet and repeat each of the above

measurements.

6. The potential at anypoint shouldnot exceed 0.75 volts RMS. A

leakage current tester (Simpson Model 229 or equivalent) maybe

used to make the hot checks, leakage current must not exceed 1/2

milliamp. Incase ameasurement isoutside of the limits specified,

there isapossibilityof ashock hazard, and the equipment should

be repaired and rechecked before itisreturned to the customer.

1.2. Before Repairand Adjustment

Disconnect AC power, discharge PowerSupplyCapacitors C5716, C5717, C5718 through a 10

, 10 W resistortoground.

DO NOTSHORT-CIRCUITDIRECTLY (witha screwdriverblade, forinstance), as this may

destroysolidstate devices.

Afterrepairs are completed, restore powergraduallyusing a variac, toavoidovercurrent.

Current consumption at AC 230 V, 50 Hz inNO SIGNALmode volume minimal shouldbe ~ 600

mA (ForE/ EG).

Current consumption at AC 220V-230 V, 220V/230V-240V, 50Hz inNO SIGNALmode volume

minimal shouldbe ~ 600 mA (ForEB).

1.3. Protection Circuitry

The protection circuitrymayhave operatedif eitherof the following conditions are noticed:

-Nosound isheard when the power isturned on.

-Sound stops during aperformance.

The function of this circuitryis toprevent circuitrydamage if, forexample, the positive and

negative speakerconnection wires are

“shorted”, orif speakersystems withanimpedance less thanthe indicatedratedimpedance of

the amplifierare used.

If this occurs, followthe procedure outlines below:

1. Turn off the power.

2. Determine the cause of the problem and correct it.

3. Turn on the power once againafter one minute.

Note:

Whenthe protection circuitryfunctions, the unit will not operate unless the poweris first turned

off and thenon again.

2. Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor(solidstate) devices canbe damagedeasilybystatic electricity. Such

components commonlyare calledElectrostaticallySensitive (ES) Devices. Examples of typical

ES devices are integratedcircuits and some field-effect transistors and semiconductor"chip"

components. The following techniques shouldbe usedtohelpreduce the incidence of

component damage causedbyelectrostatic discharge (ESD).

1. Immediatelybefore handling anysemiconductor component or

semiconductor-equipped assembly, drainoff anyESDon your

bodybytouching aknownearth ground. Alternatively, obtainand

wear acommerciallyavailabledischarging ESDwrist strap, which

shouldbe removed for potential shock reasons prior to applying

power to the unitunder test.

2. After removing an electrical assemblyequipped with ES devices,

place the assemblyon aconductive surface such as aluminum

foil, to prevent electrostaticcharge buildup or exposure of the

assembly.

3. Use onlyagrounded-tipsoldering iron to solder or unsolder ES

devices.

4. Use onlyan anti-staticsolder removal device. Some solder

removal devices not classified as "anti-static(ESDprotected)"

can generate electrical charge sufficient to damage ES devices.

5. Donot use freon-propelled chemicals. These can generate

electrical charges sufficient to damage ES devices.

6. Donot remove areplacement ES device from its protective

package until immediatelybefore you are readyto install it. (Most

replacement ES devices are packaged with leads electrically

shorted together byconductive foam, aluminum foil or

comparableconductive material).

7. Immediatelybefore removing the protective material from the

leads of areplacement ES device, touch the protective material to

the chassisor circuitassemblyinto which the device will be

installed.

Caution

Besure no power isapplied to the chassisor circuit, and observe

all other safetyprecautions.

8. Minimize bodilymotions when handling unpackaged replacement

ES devices. (Otherwise harmless motion such as the brushing

together of your clothes fabricor the lifting of your foot from a

carpeted floor can generate staticelectricity(ESD)sufficient to

damage an ES device).

3. Precaution of Laser Diode

4. About Lead Free Solder (PbF)

Distinction of PbF PCB: PCBs (manufactured) using leadfree solderwill have a PbF stampon

the PCB.

Caution:

-Pb free solder has ahigher melting point than standard solder;

Typicallythe melting point is50 -70°F (30 -40°C)higher. Please

use ahigh temperature soldering iron. Incase of the soldering

iron with temperature control, please set itto 700 ± 20°F (370 ±

10°C).

-Pb free solder will tend to splash when heated too high (about

1100°F/ 600°C).

When soldering or unsoldering, please completelyremove all of the

solder on the pins or solder area, and be sure to heat the soldering

points with the Pb free solder until itmelts enough.

5. Caution for AC Cord

Ce manuel convient aux modèles suivants

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