Panasonic DMR-E85HEP Manuel utilisateur

ORDERNO.DSD0405014C8

DVDVideo Recorder

DMR-E85HEP

Colour

(S).......................Silver Type

SPECIFICATIONS

Unauthorized copying and distribution isaviolation of law.

1. Safety precautions

1.1. General guidelines

1. When servicing, observe the original lead dress. Ifashort circuit

isfound, replace all parts which have been overheated or

damaged bythe short circuit.

2. After servicing, see to itthat all the protective devices such as

insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following leakage current checks to

prevent the customer from being exposed to shock hazards.

1.1.1. Leakage current coldcheck

1. Unplug the AC cord and connect ajumper between the two

prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between the

jumpered AC plug and each exposed metalliccabinet part on the

equipment such as screwheads, connectors, control shafts, etc.

When the exposed metallicpart has areturn path to thechassis,

the reading shouldbe between 1M and 5.2M . / When the

exposed metal does not have areturn path to the chassis, the

reading must be . Figure 1

1.1.2. Leakage current hot check / (See Figure 1 .)

1. Plug the AC cord directlyinto the AC outlet. Donot use an

isolation transformer for thischeck.

2. Connect a1.5k , 10 watts resistor, inparallel with a0.15 F

capacitors, between each exposed metallicpart on the set and a

good earth ground such as awater pipe, as shownin Figure 1 .

3. Use an AC voltmeter, with 1000 ohms/voltor more sensitivity, to

measure the potential across the resistor.

4. Check each exposed metallicpart, and measure the voltage at

each point.

5. Reverse the AC plug inthe AC outlet and repeat each of the above

measurements.

6. The potential at anypoint shouldnot exceed 0.75 volts RMS. A

leakage current tester (Simpson Model 229 or equivalent) maybe

used to make the hot checks, leakage current must not exceed 1/2

milliampere. Incase ameasurement isoutside of the limits

specified, there isapossibilityof ashock hazard, and the

equipment shouldbe repaired and rechecked before itisreturned

to the customer.

2. Prevention of Electrostatic Discharge (ESD) to

Electrostatic Sensitive (ES) Devices

Some semiconductor(solidstate) devices canbe damagedeasilybystatic electricity. Such

components commonlyare calledElectrostatic Sensitive (ES) Devices. Examples of typical ES

devices are integratedcircuits and some field-effect transistor-sandsemiconductor"chip"

components. The following techniques shouldbe usedtohelpreduce the incidence of

component damage causedbyelectrostatic discharge (ESD).

1. Immediatelybefore handling anysemiconductor component or

semiconductor-equipped assembly, drainoff anyESDon your

bodybytouching aknownearth ground. Alternatively, obtainand

wear acommerciallyavailabledischarging ESDwrist strap,

whichshouldbe removed for potential shock reasons prior to

applying power to the unitunder test.

2. After removing an electrical assemblyequipped with ES devices,

place the assemblyon aconductive surface such as aluminum

foil, to prevent electrostaticcharge buildup or exposure of the

assembly.

3. Use onlyagrounded-tipsoldering iron to solder or unsolder ES

devices.

4. Use onlyan anti-staticsolder removal device. Some solder

removal devices not classified as "anti-static(ESDprotected)"

can generate electrical charge sufficient to damage ES devices.

5. Donot use freon-propelled chemicals. These can generate

electrical charges sufficient to damage ES devices.

6. Donot remove areplacement ES device from its protective

package until immediatelybefore you are readyto install it. (Most

replacement ES devices are packaged with leads electrically

shorted together byconductive foam, aluminum foil or

comparableconductive material).

7. Immediatelybefore removing the protective material from the

leads of areplacement ES device, touch the protective material to

the chassisor circuitassemblyinto which the device will be

installed.

Caution

Besure no power isapplied to the chassisor circuit, and observe

all other safetyprecautions.

8. Minimize bodilymotions when handling unpackaged replacement

ES devices. (Otherwise hamless motion such as the brushing

together of your clothes fabricor the lifting of your foot from a

carpeted floor can generate staticelectricitysufficientto damage

an ES device).

3. Precaution of Laser Diode

4. Handling the Lead-free Solder

4.1. About lead free solder (PbF)

Distinction of PbF P.C.B.:

P.C.B.s (manufactured) using leadfree solderwill have a PbF stampon the P.C.B.

Caution:

-Pb free solder has ahigher melting point than standard solder;

Typicallythe melting point is50 -70°F (30 -40°C)higher. Please

use ahigh temperature soldering iron. Incase of the soldering

iron with temperature control,please set itto 700 ± 20°F (370 ±

10°C).

-Pb free solder will tend to splash when heated too high (about

1100°F/600°C).

-When soldering or unsoldering, please completelyremove all of

the solder on the pins or solder area, and be sure to heat the

soldering points with the Pb free solder until itmelts enough.

5. Each Buttons

6. Taking out the Disc from RAM-Drive Unit when the

Disc cannot be ejected by OPEN/CLOSE button

6.1. ForcibleDisc Eject

6.1.1. When the powercan be turned off.

1. Turn off the power and press [STOP] [CH UP] keyson the front

panel simultaneouslyfor 5seconds.

6.1.2. When the powercan not be turned off.

1. Press [POWER]keyon the front panel for over 10 seconds to turn

off the power forcibly, and press [STOP] [CH UP] keyson the front

panel simultaneouslyfor 5seconds.

6.2. When the ForcibleDisc Eject can not be done.

1. Turn off the power and pull out AC cord.

2. Remove the Top Case.

3. Remove the Front Panel.

4. Remove 4screwsand Upper Base Unitfrom DVD-RAMDrive.

5. Take out the disc and put the Opener Roller on fullyposition for

direction of Arrow.

6. Put the Upper Base Unitso that the Opener Roller isinserted into

the groove.

7. Check center of Opener Roller isseen through the Opener

position Checking Hole, and tighten 4screws.

7. Service Explorer

Confirm “RAM-Drive Last Error” inService Mode

Execute Service Mode

1. Press [STOP], [TIME SLIP] and [OPEN/CLOSE] simultaneouslyfor

5seconds when P-off.

FL Display:

*After finishing display“(7). Factor of Drive Error occurring”,

press [0] [2] ~[9] [9] keysof the Remote Controller so that 99

memories can be displayed as maximum.

2. Press [4] [2] keysof remote controller.

Example of FL Display:

(1) ErrorNumberis displayedfor5 seconds.

(2) Time whenthe errorhas occurredis displayedfor5 seconds.

(3) Last Drive Error(1/2) is displayedfor5 seconds.

(4) Last Drive Error(2/2) is displayedfor5 seconds.

(5) Erroroccurring Disc type is displayedfor5 seconds.

(6) Disc Maker's ID is displayedfor5 seconds.

Example of Disc Maker's ID:

DVD-R Disc

No. FL Display(Disc

Maker's ID) Disc Maker Country

1MEI Panasonic Japan

2 PVC Pioneer Japan

3 MCC Mitsubishi Chemical

Corporation Japan

4TDK TDK Japan

5 MXL Maxell Japan

6 MCI MITUI CHEMICALS Japan

7 JVC VictorJVC Japan

8TAIYOYUDEN Taiyoyuden Japan

TYG

9 GSC Giga Storage Taiwan

10 PRODISC Prodisc Taiwan

11 PRINCO PRINCO Taiwan

12 RITEK RITEK Taiwan

13 OPTDISC OPTDISC Taiwan

14 LEAD DATA LEAD DATA Taiwan

15 CMC CMC Taiwan

16 AUVISTAR AUVISTAR Taiwan

17 ACER Acer Taiwan

18 VIVASTAR VIVASTAR Switzerland

19 LGE LG Electronics Korea

DVD-RAM Disc

No. FL Display(Disc

Maker's ID) Disc Maker Country

1MEI Panasonic

2 MATSUSHITA Panasonic Japan

3 MXL Maxell Japan

4 PRODISC Prodisc Taiwan

5 OPTDISC OPTDISC Taiwan

6 CMC CMC Taiwan

*Since andisplayis arbitrarilyset up bythe disk producerside, the above-mentioneddisplay

maybe changed.

Please make it reference as anexample of a display.

(7) Factorof Drive Erroroccurring is left displayed

ErrorOccurring Disc Type

FL Display Disc Type

00 DVD-ROM/Video

01 Audio-CD

02 2.6GB DVD-RAM

03 4.7GB DVD-RAM

04 DVD-R

ErrorOccurring Disc State

8. Self-Diagnosis and Special Mode Setting

8.1. Self-DiagnosisFunctions

Self-Diagnosis Function provides information forerrors toservice personnel by“Self-Diagnosis

Display” whenanyerrorhas occurred.

U14, H** and F** are storedinmemoryand held.

Displayon FL will be cancelledwhenthe poweris turnedoff orAC input is turnedoff during self

-diagnosis displayis ON.

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